Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/26/2012US20120187544 Semiconductor apparatus having penetration electrode and method for manufacturing the same
07/26/2012US20120187543 Substrate strip plate structure for semiconductor device and method for manufacturing the same
07/26/2012US20120187529 eFUSE AND METHOD OF FABRICATION
07/26/2012US20120187528 Finfet fuse with enhanced current crowding
07/26/2012US20120187526 Method of forming a semiconductor device termination and structure therefor
07/26/2012US20120187511 Integrated circuit package assembly including wave guide
07/26/2012US20120187509 Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components
07/26/2012US20120187403 Test device and a semiconductor integrated circuit device
07/26/2012US20120187402 Semiconductor device and stacked semiconductor device
07/26/2012US20120187401 Device allowing suppression of stress on chip
07/26/2012US20120187400 Test structure for detection of gap in conductive layer of multilayer gate stack
07/26/2012US20120187267 Adjustable mounting bracket for a photovoltaic panel frame system
07/26/2012US20120187098 Energy efficient, laser-based method and system for processing target material
07/26/2012US20120186867 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
07/26/2012US20120186632 Mounting Assembly for Supporting a Solar Panel, and Method of Employing Same
07/26/2012DE19951752B4 Elektrische Druckkontaktvorrichtung und Verfahren zu ihrer Herstellung Electrical pressure contact apparatus and process for their preparation
07/26/2012DE112009005017T5 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
07/26/2012DE10358917B4 Wärmeableitungsvorrichtung und Gehäuse davon Heat dissipation device and housing them
07/26/2012DE10316356B4 Modular aufgebautes Leistungshalbleitermodul Modular power semiconductor module
07/26/2012DE10221085B4 Baugruppe mit einer Verbindungseinrichtung zum Kontaktieren eines Halbleiter-Bauelements und Herstellungsverfahren Assembly having a connection means for contacting a semiconductor device and manufacturing method
07/26/2012DE102012100243A1 Anordnung mit zwei Halbleiterchips und Herstellung einer solchen Anordnung Arrangement with two semiconductor chips and the production of a such an arrangement
07/26/2012DE102012001481A1 Lichtsensor mit IR-Interferenz-Sperrfilter und Farbfilter, die auf einem Chip integriert sind IR light sensor with interference rejection filter, and color filters which are integrated on one chip
07/26/2012DE102011087414A1 Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte Power semiconductor device, printed circuit board and mechanism for connecting the power semiconductor device and the printed circuit board
07/26/2012DE102011016480B3 Multi-component shielding enclosure for integrated circuit, is divided into two halves in which ground terminals are spaced and connected to electronic component on surface of carrier element
07/26/2012DE102011003195A1 Bauteil und Verfahren zum Herstellen eines Bauteils Component and method for manufacturing a component
07/26/2012DE102011003153A1 Leadless Package mit einem leitenden Coating zur elektrischen Schirmung Leadless package with a conductive coating for electrical shielding
07/26/2012DE10122705B4 Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung Means with a functional element and process for its preparation
07/25/2012EP2480058A1 Multi-layer substrate and manufacture method thereof
07/25/2012EP2480052A1 Ceramic circuit board and process for producing same
07/25/2012EP2479788A2 Wiring substrate and method for manufacturing the same
07/25/2012EP2479206A1 A silicone resin composition and an optical semiconductor device making use of the composition
07/25/2012EP2478751A1 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
07/25/2012EP2478556A1 Electronic device for switching currents and method for producing the same
07/25/2012EP2478555A1 Geometry of contact sites at brittle inorganic layers in electronic devices
07/25/2012EP2478317A1 Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
07/25/2012EP2108191B1 Electronic board and cold plate for said board
07/25/2012EP1676308B1 Electronic device and method of manufacturing thereof
07/25/2012EP1618607B1 Semiconductor device comprising an ldmos field-effect transistor and method of operating the same
07/25/2012EP1506054B1 Micro-reactor and micro-channel heat exchanger
07/25/2012CN202352679U Glass-passivated high-power diode
07/25/2012CN202352667U High voltage silicon stack
07/25/2012CN202352665U 半导体装置 Semiconductor device
07/25/2012CN202352664U Power module controlled by direct current motor excitation
07/25/2012CN202352662U Plasma damage test structure based on MOS (Metal Oxide Semiconductor) capacitance
07/25/2012CN202352661U Fuse wire circuit for FT-Trim of IC chip
07/25/2012CN202352660U Microelectronics packaging
07/25/2012CN202352659U Wiring framework suitable for three-chip packaging product
07/25/2012CN202352658U Novel semiconductor packaging lead frame
07/25/2012CN202352657U Novel semiconductor lead frame
07/25/2012CN202352656U Novel semiconductor lead frame
07/25/2012CN202352655U Novel semi-conductor packaging lead frame
07/25/2012CN202352654U Electronic element
07/25/2012CN202352653U Minitype patch-type diode
07/25/2012CN202352652U Mobile phone main board and pad structure of ball grid array (BGA) packaged chip of mobile phone main board
07/25/2012CN202352651U Packaging structure of solid state disk (SSD)
07/25/2012CN202352650U Finned water-cooling plate
07/25/2012CN202352649U Radiator
07/25/2012CN202352648U 功率模块 Power Modules
07/25/2012CN202352647U Micro electronic package
07/25/2012CN202352646U 电子装置 Electronic devices
07/25/2012CN202352645U Packaging shell structure for semiconductor power module
07/25/2012CN202352644U Transistor soldering layer structure
07/25/2012CN202351465U Optical element and electronic package with optical element
07/25/2012CN202350600U Gravity auxiliary circuit heat pipe with supersonic vibration atomization device
07/25/2012CN1909223B Semiconductor package with ferrite shielding structure
07/25/2012CN102612747A Semiconductor module
07/25/2012CN102612745A Heat sink for electronic device, and process for production thereof
07/25/2012CN102612744A Electronic device submounts with thermally conductive vias and light emitting devices including the same
07/25/2012CN102612743A 半导体装置 Semiconductor device
07/25/2012CN102612298A Heat radiating device and manufacturing method thereof
07/25/2012CN102612265A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612264A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612253A Interconnection structure, apparatus therewith, circuit structure therewith
07/25/2012CN102611361A Thyristor group unit serial and parallel connection structure piece applied to motor soft starter
07/25/2012CN102610709A Package carrier and manufacturing method thereof
07/25/2012CN102610614A Multilayer connection structure and making method
07/25/2012CN102610604A Integrated device with defined heat flow
07/25/2012CN102610594A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
07/25/2012CN102610593A Layout design used for preventing static electricity from damaging reliability sample
07/25/2012CN102610592A Manufacturing method of trench-type metal oxide semiconductor (MOS) static electricity discharging structure and integrated circuit
07/25/2012CN102610591A Semiconductor module
07/25/2012CN102610590A EMI shielding in a package module
07/25/2012CN102610589A Sram memory
07/25/2012CN102610588A Semiconductor device and method of manufacture thereof
07/25/2012CN102610587A Buffering element and bonding method for flip-chip soft film using the same
07/25/2012CN102610586A Package carrier
07/25/2012CN102610585A Lead frame for silicon chip encapsulation, encapsulation method and formed electronic element
07/25/2012CN102610584A Staggered-pins structure for substrate
07/25/2012CN102610583A Package carrier and manufacturing method thereof
07/25/2012CN102610582A Semiconductor element provided with shield conduction column and method for manufacturing the same
07/25/2012CN102610581A Electronic component mounting means
07/25/2012CN102610580A Non-metal stiffener ring for fcbga
07/25/2012CN102610579A Base plate structure for manufacturing semiconductor device and manufacturing method thereof
07/25/2012CN102610578A Matrix type sapphire substrate and preparation method thereof
07/25/2012CN102610577A Method of manufacturing a package for embedding one ore more electronic components
07/25/2012CN102610557A Surface coating method, semiconductor device, and circuit board package
07/25/2012CN102610556A Method for reducing cracking phenomenon of double-layer front metal dielectric layer
07/25/2012CN102610534A Stretchable RFID (Radio Frequency Identification) electronic tag and manufacturing method thereof
07/25/2012CN102610533A Injection molding system and method of chip package
07/25/2012CN102610531A Method for preparing diamond-silicon composite package material
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