Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2015
01/01/2015US20150000149 Alignment Mark Definer
12/2014
12/31/2014CN204069602U 一种热管散热器 A heat pipe radiator
12/31/2014CN204067374U 一种大功率大电流二极管封装结构 One kind of high-power high-current diode package structure
12/31/2014CN204067373U 一种电子元件检波二极管 An electronic component detector diode
12/31/2014CN204067364U 一种带分压环结构的片上高压电阻 An on-chip with a sub-structure of the high-voltage resistance pressure ring
12/31/2014CN204067357U 微间距图案的布线结构 Wiring structure pattern of fine pitch
12/31/2014CN204067352U 一种桥式整流器内部封装结构 A bridge-type rectifier inside the package
12/31/2014CN204067351U 双芯片封装体 Dual-chip package
12/31/2014CN204067350U 一种等离子诱导损伤的测试结构 A plasma-induced damage test structure
12/31/2014CN204067349U 一种芯片保护结构 A chip protection structure
12/31/2014CN204067348U 晶片的正、背面间电性连接结构 N, electrically connected between the back surface of the wafer structure
12/31/2014CN204067347U 一种铆接有陶瓷基底的铜板 Riveting copper ceramic substrate
12/31/2014CN204067346U 一种无线控制芯片以及相应的无线设备 A radio control chip and a corresponding wireless device
12/31/2014CN204067345U 一种新型整流器件to-220框架 A new framework to-220 rectifier
12/31/2014CN204067344U 大功率大电流二极管封装框架 High-power high-current diode package framework
12/31/2014CN204067343U 一种半导体用键合丝 A semiconductor with bonding wire
12/31/2014CN204067342U 一种半导体用键合丝 A semiconductor with bonding wire
12/31/2014CN204067341U 具有凸块结构的基板 A substrate having a bump structure
12/31/2014CN204067340U 半导体模块、电子设备以及车辆 The semiconductor module, the electronic equipment and a vehicle
12/31/2014CN204067339U 一种基于emmc芯片的bga封装装置 Bga package device based emmc chip
12/31/2014CN204067338U 一种风扇式电子器件散热片 One kind of electronic device heat sink fan
12/31/2014CN204067337U 一种带有多孔泡沫金属的强化沸腾换热结构 A strengthening of the porous metal foam structure with boiling heat
12/31/2014CN204067336U 一种大散热片半导体分立器件 One kind of big heatsink discrete semiconductor devices
12/31/2014CN204067335U 一种带导热硅胶片的功率半导体模块 Power semiconductor module with a piece of thermal silica
12/31/2014CN204067334U 光电半导体的灯条结构 Light structure Opto Semiconductors
12/31/2014CN204067333U 芯片封装结构 Chip package
12/31/2014CN204067332U 基于基板的凸点倒装芯片csp封装件 Based bump flip chip package substrate csp
12/31/2014CN204067331U 一种用于动车整流器的大功率二极管 A high-power diode rectifier EMU
12/31/2014CN204067330U 一种基板片式载体csp封装件 A substrate chip carrier package csp
12/31/2014CN204067329U 一种导热硅胶片 One kind of thermal silica film
12/31/2014CN104255086A 基板的制造方法、基板以及掩蔽膜 Producing a substrate, the substrate and the masking film
12/31/2014CN104254917A 用于半导体封装的多层基底 A multilayer substrate for semiconductor package
12/31/2014CN104254916A 具有增大的芯片岛状物的衬底 The substrate has an increased chip islands of
12/31/2014CN104254198A 布线基板 Wiring board
12/31/2014CN104253148A 一种有机发光二极管阵列基板及其制作方法、显示装置 An organic light emitting diode array substrate and method of manufacturing the display device
12/31/2014CN104253147A 一种阵列基板及其制作方法、显示设备 One kind of array substrate and method of manufacturing the display device
12/31/2014CN104253122A 半导体封装件 Semiconductor package
12/31/2014CN104253119A 一种电力半导体压接式绝缘型模块 A power semiconductor modules insulation crimp
12/31/2014CN104253118A 半导体封装件 Semiconductor package
12/31/2014CN104253117A 半导体装置 Semiconductor device
12/31/2014CN104253116A 用于嵌入式管芯的封装组件及相关联的技术和配置 For embedded die package assembly and associated technologies and configurations
12/31/2014CN104253115A 用于半导体封装中减小的管芯到管芯间隔的底部填充材料流控制 Underfill material flow control is used to reduce the semiconductor die package to the die spaced
12/31/2014CN104253114A 嵌入式封装结构及其制造方法 Embedded package structure and manufacturing method
12/31/2014CN104253113A 一种测量时使用的定位标记及其识别方法 An anchor tag and identification method to use when measuring
12/31/2014CN104253112A 测试结构序列号的设计方法及测试结构序列号 Test structure design methods and test structures serial number serial number
12/31/2014CN104253111A 用于ic封装的硅空间转变器 Silicon space for ic package mutator
12/31/2014CN104253110A 衬底间通孔连接结构及其制造方法 Vias connecting structure between the substrate and its manufacturing method
12/31/2014CN104253109A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/31/2014CN104253108A 互连结构及其形成方法 Interconnect structure and method of forming
12/31/2014CN104253107A 具有自保护熔丝的半导体器件及其制造方法 A semiconductor device having self-protection fuse and its manufacturing method
12/31/2014CN104253106A 具有局部过孔的金属-绝缘体-金属管芯上电容器 Partial vias having metal - insulator - metal die on the capacitor
12/31/2014CN104253105A 半导体器件和形成低廓形3d扇出封装的方法 Semiconductor devices and form a low profile shape 3d fan-out package method
12/31/2014CN104253104A 管芯-管芯感应通信装置及方法 Die - die inductive communication device and method
12/31/2014CN104253103A 交错管脚的引线框架结构以及半导体器件制造方法 Staggered pin leadframe structure and a semiconductor device manufacturing method
12/31/2014CN104253102A 半导体器件和用于制造其的方法 The method of manufacturing a semiconductor device and means for its
12/31/2014CN104253101A 外部存储装置 An external storage device
12/31/2014CN104253100A 晶片封装体 Chip package
12/31/2014CN104253099A 用于半导体器件的焊盘结构布局 Pad layout structure for semiconductor devices
12/31/2014CN104253098A 一种压接式绝缘型电力半导体模块的共用电极 A common electrode insulated crimp-type power semiconductor module
12/31/2014CN104253097A 散热装置及通过注塑体接合形成的散热装置的制造方法 Method of manufacturing a heat sink and cooling means is formed by bonding of molded body
12/31/2014CN104253096A 电子设备 Electronic equipment
12/31/2014CN104253095A 具有减小耦合的引线接合壁的半导体封装 Having a reduced wall coupling wire bonding a semiconductor package
12/31/2014CN104253094A 半导体封装 The semiconductor package
12/31/2014CN104253093A 功率器件的模组封装框架以及功率器件的制造方法 Frame power module package and method of manufacturing the device power devices
12/31/2014CN104253092A 分层衬底上有嵌入载盘的集成电路封装系统及其制造方法 There is an embedded integrated circuit package carrier disc system and method for manufacturing the layered substrate
12/31/2014CN104253086A 用于金属氧化物还原的预处理方法和所形成的器件 Pretreatment method for reduction of the metal oxide and the device is formed
12/31/2014CN104253083A 熔丝器件的制备方法 Preparation fuse device
12/31/2014CN104253082A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/31/2014CN104253059A 电迁移可靠性测试结构及其使用方法 Reliability test structures and methods of using electro-migration
12/31/2014CN104253058A 在扇出型wlcsp上堆叠半导体小片的方法及半导体装置 On the fan-out wlcsp stacked semiconductor die method and semiconductor device
12/31/2014CN104253057A 半导体管芯载体结构及其制造方法 The semiconductor die carrier structure and manufacturing method
12/31/2014CN104253056A 具有穿通电极的半导体封装及其制造方法 Having a semiconductor package and method of manufacturing the through electrodes
12/31/2014CN104253053A 具有与凹槽相对准的焊料区的封装件 With a package aligned with the grooves of the solder area
12/31/2014CN104253052A 金属内连线结构及其制造方法 Metal wiring structure and its manufacturing method
12/31/2014CN104253020A 相变材料可变电容器 Phase change material of the variable capacitor
12/31/2014CN104253019A 深沟槽电容器 Deep trench capacitor
12/31/2014CN104252636A 具有电容式安全屏蔽的设备 Has a capacitive device security shield
12/31/2014CN103339726B 电子部件及其制造方法和带有电子部件的电路板 The method of manufacturing an electronic component and a circuit board with electronic components
12/31/2014CN102933678B 封装材料、太阳能电池组件及发光二极管 Packaging materials, solar cells and light-emitting diode module
12/31/2014CN102822271B 半导体封装用环氧树脂组合物和使用其的半导体装置 The epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same
12/31/2014CN102800710B 一种半导体二极管封装结构 A semiconductor diode package structure
12/31/2014CN102782000B 光半导体密封用树脂组合物及使用该组合物的光半导体装置 An optical semiconductor device using the optical semiconductor sealing resin composition and use of the composition
12/31/2014CN102768960B 封装结构及其制作方法 Package structure and manufacturing method thereof
12/31/2014CN102725356B 可固化组合物 The curable composition
12/31/2014CN102693965B 封装堆迭结构 Stacked package structure
12/31/2014CN102686021B 电子设备 Electronic equipment
12/31/2014CN102598252B 安装结构体及其制造方法和安装结构体的修理方法 The method of installation and repair of structures and manufacturing method and mounting structure
12/31/2014CN102593111B Igbt模块及其制作方法 Igbt module and its manufacturing method
12/31/2014CN102593072B 倒装封装中用于提高可靠性的盖式设计 Improve the reliability of the package for flip-lid design
12/31/2014CN102544007B 包括场效应晶体管的集成电路 An integrated circuit including a field effect transistor
12/31/2014CN102543962B 金属屏蔽板的制造方法 The method of producing a metal shield plate
12/31/2014CN102484950B 树脂多层基板以及该树脂多层基板的制造方法 The method of manufacturing a multilayer resin substrate and the resin multilayer substrate
12/31/2014CN102479768B 半导体器件 Semiconductor devices
12/31/2014CN102306643B 反熔丝及其形成方法和具有该反熔丝的非易失性存储器件的单位单元 And method of forming the antifuse and the anti-fuse unit cells having non-volatile memory device
12/31/2014CN102295894B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/31/2014CN102295893B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/31/2014CN102254896B 电子器件及其制造方法 Electronic device and manufacturing method thereof
12/31/2014CN102223121B 电动机的驱动单元及利用该驱动单元的电动设备 Motor drive unit and the drive by the electric equipment unit
12/31/2014CN102179974B 一种用于晶闸管阀串的固定高强度玻璃纤维环氧缠绕带 Fixed high-strength glass fiber epoxy for a thyristor valve train wrap
12/31/2014CN102170219B 能量转换装置 Energy conversion means
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