Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/01/2012CN101908512B Twist-secured assembly of a power semiconductor module mountable on a heat sink
08/01/2012CN101740549B Test structure and test method for precisely evaluating reliability performance of gate oxide
07/2012
07/31/2012US8234594 Redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same
07/31/2012US8234528 Systems and methods for monitoring a memory system
07/31/2012US8233252 ESD protection circuit for low voltages
07/31/2012US8232659 Three dimensional IC device and alignment methods of IC device substrates
07/31/2012US8232658 Stackable integrated circuit package system with multiple interconnect interface
07/31/2012US8232657 Packaged semiconductor assemblies and methods for manufacturing such assemblies
07/31/2012US8232656 Semiconductor device
07/31/2012US8232655 Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
07/31/2012US8232654 Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
07/31/2012US8232653 Wiring structures
07/31/2012US8232652 Semiconductor device
07/31/2012US8232651 Bond pad for wafer and package for CMOS imager
07/31/2012US8232650 Semiconductor device and method for manufacturing the same
07/31/2012US8232649 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
07/31/2012US8232648 Semiconductor article having a through silicon via and guard ring
07/31/2012US8232647 Structure and process for metallization in high aspect ratio features
07/31/2012US8232646 Interconnect structure for integrated circuits having enhanced electromigration resistance
07/31/2012US8232645 Interconnect structures, design structure and method of manufacture
07/31/2012US8232644 Wafer level package having a stress relief spacer and manufacturing method thereof
07/31/2012US8232643 Lead free solder interconnections for integrated circuits
07/31/2012US8232642 Printed circuit board
07/31/2012US8232641 Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure
07/31/2012US8232640 Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
07/31/2012US8232639 Semiconductor-device mounted board and method of manufacturing the same
07/31/2012US8232637 Insulated metal substrates incorporating advanced cooling
07/31/2012US8232636 Reliability enhancement of metal thermal interface
07/31/2012US8232635 Hermetic semiconductor package
07/31/2012US8232634 Semiconductor device having a pin mounted heat sink
07/31/2012US8232633 Image sensor package with dual substrates and the method of the same
07/31/2012US8232632 Composite contact for fine pitch electrical interconnect assembly
07/31/2012US8232631 Semiconductor packing having offset stack structure
07/31/2012US8232630 Contactless communication medium
07/31/2012US8232629 Semiconductor device
07/31/2012US8232628 Method for manufacturing a microelectronic package comprising at least one microelectronic device
07/31/2012US8232620 Electronic fuses in semiconductor integrated circuits
07/31/2012US8232619 Semiconductor IC having electrical fuse capable of preventing thermal diffusion
07/31/2012US8232602 ESD protection device for high performance IC
07/31/2012US8232601 Transient voltage suppressors
07/31/2012US8232600 Semiconductor integrated circuit
07/31/2012US8232595 Semiconductor device including a power MISFET and method of manufacturing the same
07/31/2012US8232576 Semiconductor chip assembly with post/base heat spreader and ceramic block in post
07/31/2012US8232553 Semiconductor device
07/31/2012US8232477 Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board
07/31/2012US8232192 Process of bonding circuitry components
07/31/2012US8232160 Phase change memory device and method of manufacturing the same
07/31/2012US8232141 Integrated circuit packaging system with conductive pillars and method of manufacture thereof
07/31/2012US8232138 Circuit board with notched stiffener frame
07/31/2012US8231532 Analyte monitoring device and methods of use
07/31/2012US8230905 Heat dissipation device having a fan holder
07/31/2012US8230904 Heat dissipation device having a fan duct thereon
07/26/2012WO2012099605A1 Z-directed variable value components for printed circuit boards
07/26/2012WO2012099159A1 Heat-resistant adhesive tape for semiconductor package manufacturing step
07/26/2012WO2012098799A1 Package for encapsulating semiconductor element, and semiconductor device provided with the package
07/26/2012WO2012098720A1 Brazing method and brazed structure
07/26/2012WO2012098595A1 Wiring substrate and semiconductor device using same
07/26/2012WO2012097660A1 Packaging structure of light source, manufacturing method thereof, and liquid crystal display
07/26/2012WO2012071487A3 Integrated circuit device with die bonded to polymer substrate
07/26/2012WO2012062274A3 Power semiconductor module and method for producing a sintered power semiconductor module having a temperature sensor
07/26/2012WO2012059193A3 Power electronic device with edge passivation
07/26/2012US20120187977 Semiconductor device capable of being tested after packaging
07/26/2012US20120187585 Manufacturing method of semiconductor device, semiconductor device and mobile communication device
07/26/2012US20120187584 Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
07/26/2012US20120187583 Methods and apparatuses to stiffen integrated circuit package
07/26/2012US20120187582 Injection molding system and method of chip package
07/26/2012US20120187581 Semiconductor device and wiring board
07/26/2012US20120187580 Semiconductor Device and Method of Forming B-Stage Conductive Polymer over Contact Pads of Semiconductor Die in Fo-WLCSP
07/26/2012US20120187579 Low noise flip-chip packages and flip chips thereof
07/26/2012US20120187578 Packaged semiconductor device for high performance memory and logic
07/26/2012US20120187577 Direct Edge Connection for Multi-Chip Integrated Circuits
07/26/2012US20120187576 Three-Dimensional Integrated Circuits with Protection Layers
07/26/2012US20120187575 Layered chip package and method of manufacturing the same
07/26/2012US20120187574 Memory device and method of manufacturing the same
07/26/2012US20120187573 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
07/26/2012US20120187572 Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component
07/26/2012US20120187571 Method of manufacturing photomask and method of repairing optical proximity correction
07/26/2012US20120187570 Hybrid bonding techniques for multi-layer semiconductor stacks
07/26/2012US20120187569 Semiconductor device and method of manufacturing same
07/26/2012US20120187568 Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
07/26/2012US20120187567 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
07/26/2012US20120187566 Air-dielectric for subtractive etch line and via metallization
07/26/2012US20120187565 Device Including Two Semiconductor Chips and Manufacturing Thereof
07/26/2012US20120187564 Semiconductor device and semiconductor device package
07/26/2012US20120187563 Planarization method applied in process of manufacturing semiconductor component
07/26/2012US20120187562 Semiconductor Package and Method for Fabricating the Same
07/26/2012US20120187561 Forming semiconductor chip connections
07/26/2012US20120187560 Semiconductor chip module, semiconductor package having the same and package module
07/26/2012US20120187559 Semiconductor Device and Method of Forming Column Interconnect Structure to Reduce Wafer Stress
07/26/2012US20120187558 Structures for improving current carrying capability of interconnects and methods of fabricating the same
07/26/2012US20120187557 Semiconductor package and method for manufacturing semiconductor package
07/26/2012US20120187556 Thermal Interface Material with Epoxidized Nutshell Oil
07/26/2012US20120187555 Thermally enhanced semiconductor package system
07/26/2012US20120187554 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
07/26/2012US20120187553 Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor device
07/26/2012US20120187552 Molded Stiffener for Thin Substrates
07/26/2012US20120187551 Semiconductor module
07/26/2012US20120187550 Interconnection structure, apparatus therewith, circuit structure therewith
07/26/2012US20120187549 IC In-process Solution to Reduce Thermal Neutrons Soft Error Rate
07/26/2012US20120187545 Direct through via wafer level fanout package
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