Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/02/2012DE202012006562U1 Kühlmodul Cooling module
08/02/2012DE112009004661T5 Stromversorgungsvorrichtung A power supply apparatus
08/02/2012DE102012001769A1 Gebondete gestapelte wafer und verfahren zum elektroplattieren gebondeter gestapelter wafer Bonded wafer stacked and moved to electroplate bonded stacked wafer
08/02/2012DE102011090085A1 Halbleiterchipstapel und Halbleiterbauelementherstellungsverfahren Semiconductor chip stack and semiconductor device manufacturing method
08/02/2012DE102011088306A1 Vertikales Speicherbauelement Vertical storage device
08/02/2012DE102011086312A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
08/02/2012DE102011010186A1 Verfahren zur Herstellung eines Laminats mit leitender Kontaktierung A process for producing a laminate with conductive contact
08/02/2012DE102011003481A1 Elektronisches Bauteil umfassend einen keramischen träger und Verwendung eines keramischen Trägers Electronic component comprising a ceramic carrier and use a ceramic carrier
08/02/2012DE102011003284A1 Leistungshalbleiterelement und Anordnung eines Leistungshalbleiterelements zu mindestens einer Solarzelle Power semiconductor element and arrangement of a power semiconductor element to at least one solar cell
08/02/2012DE102011001799A1 Method of manufacturing back contact of e.g. solar cell, involves thermally spraying materials containing metal or alloy on back layer of wafer to form lower and upper layers, where materials have different melting temperatures
08/02/2012DE102007033810B4 Teststruktur-Anordnung eines Halbleiterbauelements Test structure arrangement of a semiconductor device
08/02/2012DE102004002007B4 Transistoranordnung mit Temperaturkompensation und Verfahren zur Temperaturkompensation Transistor arrangement with temperature compensation and method for temperature compensation
08/01/2012EP2482312A2 Power supply module and packaging and integrating method thereof
08/01/2012EP2482311A2 Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/01/2012EP2481083A2 Method for producing an electronic component and component produced according to said method
08/01/2012EP2291066B1 Heat radiation sheet and heat radiation device
08/01/2012EP1944116B1 Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
08/01/2012EP1894239B1 Flip chip die assembly using thin flexible substrates
08/01/2012EP1495442B1 Method for encapsulation of a chipcard and module obtained thus
08/01/2012EP1446832B1 Electrode structure for use in an integrated circuit
08/01/2012CN202363458U Light-emitting device
08/01/2012CN202363457U 芯片封装结构 Chip package structure
08/01/2012CN202363456U Flip chip packaging structure
08/01/2012CN202363455U Lead frame and lead frame array used for packaging power IC and packaging structure
08/01/2012CN202363454U Chip packaging structure
08/01/2012CN202363453U 半导体封装结构 The semiconductor package structure
08/01/2012CN202363452U Water-filled radiator for IGBT module
08/01/2012CN202363451U Electronic component having insulated heat radiation substrate
08/01/2012CN202363450U Improved wafer packaging structure
08/01/2012CN202363449U Flip chip packaging structure
08/01/2012CN202363448U Small-sized semiconductor packaging structure
08/01/2012CN202363447U Novel crystal packaging structure
08/01/2012CN202363446U Chip packaging structure
08/01/2012CN202363445U Improved novel wafer packaging structure
08/01/2012CN202363444U Metal-free base plate power module
08/01/2012CN202363443U Piled chip packaging structure
08/01/2012CN202363442U Improved type wafer packaging structure
08/01/2012CN202363441U Improved stacking type wafer packaging structure
08/01/2012CN102625952A Film for forming spacer, method for manufacturing semiconductor wafer bonded body, semiconductor wafer bonded body, and semiconductor device
08/01/2012CN102625576A Interposer and method for forming the same
08/01/2012CN102625575A Circuit board, semiconductor element, semiconductor apparatus, and making method thereof
08/01/2012CN102625516A Power IC, lead frame and packaging structure comprising power IC and lead frame
08/01/2012CN102623514A Plugging type radiating photovoltaic assembly diode capable of preventing mistaken installing and terminal box thereof
08/01/2012CN102623482A MRAM device and method of assembling same
08/01/2012CN102623445A Rectifier bridge arm
08/01/2012CN102623444A Integrated circuit device and method for preparing the same
08/01/2012CN102623443A Semiconductor package
08/01/2012CN102623441A Semiconductor device and method of fabricating the same
08/01/2012CN102623440A Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/01/2012CN102623439A Capacitive coupler packaging structure
08/01/2012CN102623438A Semiconductor device
08/01/2012CN102623437A Through silicon via (TSV) structure and manufacturing method thereof
08/01/2012CN102623436A Distributed metal routing
08/01/2012CN102623435A Barrier layer and preparation method thereof
08/01/2012CN102623434A Diffusion barrier layer and preparation method thereof
08/01/2012CN102623433A Three-dimensional interconnection structure for air gaps
08/01/2012CN102623432A Semiconductor chip and multi-chip package having the same
08/01/2012CN102623431A Semiconductor device
08/01/2012CN102623430A Semiconductor device and manufacturing method therefor
08/01/2012CN102623429A Encapsulation carrier structure
08/01/2012CN102623428A 半导体模块 Semiconductor Modules
08/01/2012CN102623427A Semiconductor packaging structure and packaging method thereof
08/01/2012CN102623426A Semiconductor packaging structure and method thereof
08/01/2012CN102623425A Device including two semiconductor chips and manufacturing thereof
08/01/2012CN102623424A Chip package and method for forming the same
08/01/2012CN102623423A Integrated circuit pattern and multiple patterning method
08/01/2012CN102623422A Heat radiating device
08/01/2012CN102623421A Micro temperature-uniforming plate structure
08/01/2012CN102623420A Fastening tool, heat dissipation device assembly using fastening tool, and electronic device
08/01/2012CN102623419A Chip-on-film type semiconductor package, and tape circuit board for the same
08/01/2012CN102623418A Radiator
08/01/2012CN102623417A High efficiency computer motherboard heat sink
08/01/2012CN102623416A Unpacked structure for power device of radio frequency power amplification module and assembly method for unpacked structure
08/01/2012CN102623415A Semiconductor encapsulation structure and manufacturing method thereof
08/01/2012CN102623414A Semiconductor package
08/01/2012CN102623413A Test key circuit in which the quantity of devices tested by unit test modules is increased
08/01/2012CN102623412A Semiconductor wafer, semiconductor bar, method of manufacturing semiconductor wafer, method of manufacturing semiconductor bar, and method of manufacturing semiconductor device
08/01/2012CN102623411A Semiconductor devices having insulating substrates and methods of formation thereof
08/01/2012CN102623397A Array substrate structure for display panel and method of making the same
08/01/2012CN102623394A Long-term heat-treated integrated circuit arrangements and methods for producing the same
08/01/2012CN102623392A Manufacturing method of semiconductor device and semiconductor device
08/01/2012CN102623391A Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
08/01/2012CN102623363A Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor device
08/01/2012CN102623362A Three-dimensional packaging method and package
08/01/2012CN102623359A Semiconductor encapsulation structure and manufacturing method thereof
08/01/2012CN102623306A Metal-multilayer insulator-metal capacitor, manufacture method for same and integrated circuit thereof
08/01/2012CN102623305A Metal-multilayer insulator-metal capacitor as well as preparation method and integrated circuit thereof
08/01/2012CN102623063A Semiconductor apparatus and repair method thereof
08/01/2012CN102620822A Brightness and proximity multi-chip integrated sensor and packaging method thereof
08/01/2012CN102620590A Micro-channel heat sink and performance testing device thereof
08/01/2012CN102618213A Resin composition and semiconductor devices made by using the same
08/01/2012CN102617987A Epoxy resin composition and condensate
08/01/2012CN102617981A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device
08/01/2012CN102615446A Solder, soldering method, and semiconductor device
08/01/2012CN102129961B Manufacturing method of chip label
08/01/2012CN102110621B Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device
08/01/2012CN102054861B Bidirectional thyristor and electrostatic protection circuit
08/01/2012CN102054840B Static discharge protection device
08/01/2012CN101969052B Heat radiator
08/01/2012CN101924093B Semiconductor device and method of manufacturing semiconductor device
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