Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/07/2012US8237225 Semiconductor device for electrostatic discharge protection
08/07/2012US8237187 Package structure for chip and method for forming the same
08/07/2012US8237160 Probe pad on a corner stress relief region in a semiconductor chip
08/07/2012US8237145 Nonvolatile memory device with recording layer having two portions of different nitrogen amounts
08/07/2012US8237065 Twin-chip-mounting type diode
08/07/2012US8236618 Method of making a semiconductor chip assembly with a post/base/post heat spreader
08/07/2012US8236617 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
08/07/2012US8236616 Semiconductor device and manufacturing method thereof
08/07/2012US8236610 Forming semiconductor chip connections
08/07/2012US8236607 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
08/07/2012US8236160 Plating methods for low aspect ratio cavities
08/07/2012US8235896 Analyte monitoring device and methods of use
08/07/2012US8235768 Cooler with ground heated plane and grinding method and apparatus thereof
08/07/2012US8235551 LED module and packaging method thereof
08/07/2012US8235095 Heat dissipation device
08/02/2012WO2012103369A1 Single layer bga substrate process
08/02/2012WO2012102711A1 Microadhesive systems and methods of making and using the same
08/02/2012WO2012102496A2 Cooling element having improved assembly productivity and battery modules including same
08/02/2012WO2012102336A1 Epoxy resin composition for sealing, and electronic component device
08/02/2012WO2012102335A1 Power device and package for power device
08/02/2012WO2012102303A1 Electronic component module and electronic component element
08/02/2012WO2012102291A1 Glass-embedded silicon substrate and method for manufacturing same
08/02/2012WO2012102270A1 Method for producing semiconductor devices
08/02/2012WO2012102267A1 Circuit substrate and semiconductor device using same
08/02/2012WO2012102266A1 Resin-attached lead frame, method for manufacturing same, and lead frame
08/02/2012WO2012102252A1 Substrate with though electrode and method for producing same
08/02/2012WO2012102107A1 Composition containing quantum dot fluorescent body, molded body of quantum dot fluorescent body dispersion resin, structure containing quantum dot fluorescent body, light-emitting device, electronic apparatus, mechanical device, and method for producing molded body of quantum dot fluorescent body dispersion resin
08/02/2012WO2012101978A1 Electronic component
08/02/2012WO2012101920A1 Circuit module and manufacturing method thereof
08/02/2012WO2012101857A1 Module substrate
08/02/2012WO2012101557A1 Battery adapter with flex circuit and silicone spring
08/02/2012WO2012101489A1 Light emitting device chip scale package
08/02/2012WO2012101001A1 Leadless package having a conducting coating for electrically shielding
08/02/2012WO2012100721A1 Packaging structure
08/02/2012WO2012100398A1 Basic function unit of voltage source converter based on fully-controlled device
08/02/2012WO2012100334A1 Radio antenna switch
08/02/2012WO2012039120A4 Printed circuit board
08/02/2012US20120196434 E-fuse Structure Design in Electrical Programmable Redundancy for Embedded Memory Circuit
08/02/2012US20120195137 Semiconductor integrated circuit and control method thereof
08/02/2012US20120193817 Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof
08/02/2012US20120193816 Electronic Component and Method for Producing an Electronic Component
08/02/2012US20120193815 Stacked structure of chips
08/02/2012US20120193814 IC Device Having Low Resistance TSV Comprising Ground Connection
08/02/2012US20120193813 Wiring structure of semiconductor device and method of manufacturing the wiring structure
08/02/2012US20120193812 Semiconductor packages and methods of packaging semiconductor devices
08/02/2012US20120193811 Interposer and method for forming the same
08/02/2012US20120193810 Wireless apparatus and wireless system
08/02/2012US20120193809 Integrated circuit device and method for preparing the same
08/02/2012US20120193808 Bonded stacked wafers and methods of electroplating bonded stacked wafers
08/02/2012US20120193807 Dram cell based on conductive nanochannel plate
08/02/2012US20120193806 3d semiconductor device
08/02/2012US20120193805 Dual molded multi-chip package system
08/02/2012US20120193804 Ohmic connection using widened connection zones in a portable electronic object
08/02/2012US20120193803 Semiconductor device, method for producing semiconductor device, and display
08/02/2012US20120193802 Glob top semiconductor package
08/02/2012US20120193801 Rfid transponder and method for connecting a semiconductor die to an antenna
08/02/2012US20120193800 Solder, soldering method, and semiconductor device
08/02/2012US20120193799 Circuit substrate and method of manufacturing same
08/02/2012US20120193798 Semiconductor device structure and method for manufacturing the same
08/02/2012US20120193797 3d integrated circuit structure and method for manufacturing the same
08/02/2012US20120193795 Semiconductor device having an airbridge and method of fabricating the same
08/02/2012US20120193794 Semiconductor device and method of fabricating the same
08/02/2012US20120193793 Semiconductor device and method of fabricating the same
08/02/2012US20120193792 Semiconductor device conductive pattern structures including dummy conductive patterns, and methods of manufacturing the same
08/02/2012US20120193791 Semiconductor device and method of manufacturing the semiconductor device
08/02/2012US20120193790 Electrostatic chucking of an insulator handle substrate
08/02/2012US20120193789 Package stack device and fabrication method thereof
08/02/2012US20120193788 Stacked semiconductor chips packaging
08/02/2012US20120193787 Manufacturing method of semiconductor device and semiconductor device
08/02/2012US20120193786 Chip package and method for forming the same
08/02/2012US20120193785 Multichip Packages
08/02/2012US20120193784 Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor device
08/02/2012US20120193783 Package on package
08/02/2012US20120193782 Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/02/2012US20120193781 Customized rf mems capacitor array using redistribution layer
08/02/2012US20120193780 Semiconductor mounting device and method for manufacturing semiconductor mounting device
08/02/2012US20120193779 Semiconductor device and method of fabricating the same
08/02/2012US20120193778 Integrated circuit having protruding bonding features with reinforcing dielectric supports
08/02/2012US20120193777 Integrated circuit fabrication
08/02/2012US20120193776 Compliant spring interposer for wafer level three dimensional (3d) integration and method of manufacturing
08/02/2012US20120193775 Semiconductor structure with low resistance of substrate and low power consumption
08/02/2012US20120193774 Contactless communication medium
08/02/2012US20120193773 Adhesion Promoting Composition for Metal Leadframes
08/02/2012US20120193771 Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
08/02/2012US20120193770 Semiconductor device
08/02/2012US20120193768 Multiple-layer, multiple film having the same and electronic device having the same
08/02/2012US20120193767 ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES
08/02/2012US20120193766 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
08/02/2012US20120193755 Copper-based metallization system including an aluminum-based terminal layer
08/02/2012US20120193750 Power management integrated circuit
08/02/2012US20120193746 Semiconductor chip and multi-chip package having the same
08/02/2012US20120193718 Electrostatic discharge protection device
08/02/2012US20120193705 Vertical nonvolatile memory devices having reference features
08/02/2012US20120193696 Semiconductor device and method for manufacturing the same
08/02/2012US20120193682 System of dynamic and end-user configurable electrical interconnects
08/02/2012US20120193681 3d semiconductor device
08/02/2012US20120193622 Device
08/02/2012US20120193310 End clamp for fastening framed pv modules
08/02/2012US20120193138 Enclosure cooling apparatus
08/02/2012US20120192399 Panel clamp
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