Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/08/2012CN102629556A Semi-conductor structure with smooth surface and method for obtaining such a structure
08/08/2012CN102629336A Packaging structure and packaging method for electronic tag
08/08/2012CN102627929A Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof
08/08/2012CN102627832A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device
08/08/2012CN102626975A Mould, thermoplastic resin sealing electronic base plate and manufacturing method thereof
08/08/2012CN102130083B Array-type fine-pitch connector
08/08/2012CN102005391B Heat-radiating module and assembling method thereof
08/08/2012CN101969060B Active element array substrate, display panel and repairing method
08/08/2012CN101964339B Semiconductor packaging piece, manufacturing method thereof and manufacturing method of rerouted chip package
08/08/2012CN101930964B Mounting substrate, and method for manufacturing thin light-emitting device using same
08/08/2012CN101908524B Antioxidation method for finishing fuse
08/08/2012CN101904003B Electronic assembly manufacturing method
08/08/2012CN101904001B Corrugated-fin type radiator
08/08/2012CN101889333B Substrate and method for manufacturing the same
08/08/2012CN101873784B Heat dispersion module of electronic element and assembling method thereof
08/08/2012CN101859734B Lead frame, manufacturing method thereof, and manufacturing method for package structure
08/08/2012CN101859733B Semiconductor packaging structure, support plate for same, and manufacture method thereof
08/08/2012CN101851411B Curable resin composition
08/08/2012CN101783579B Power inverter
08/08/2012CN101754643B Electronic device and thermal module thereof
08/08/2012CN101728348B Semiconductor device and manufacturing method thereof
08/08/2012CN101697351B Structure for testing semiconductor
08/08/2012CN101689538B Method for the production of a rigid power module
08/08/2012CN101673771B Capacitative element
08/08/2012CN101636750B Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method
08/08/2012CN101626228B Switch circuit of ESD protection of integrated circuit chip input/output pins
08/08/2012CN101621065B Circuit device
08/08/2012CN101577271B Semiconductor device and its manufacturing method
08/08/2012CN101535366B Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin
08/08/2012CN101477980B Stacked wafer level package having a reduced size
08/08/2012CN101467500B Interconnect substrate and electronic circuit mounted structure
08/08/2012CN101452902B Semiconductor device and manufacturing method of the same
08/08/2012CN101442030B Group iii nitride semiconductor crystal substrate and semiconductor device
08/08/2012CN101414595B Package substrate and manufacturing method thereof
08/08/2012CN101393904B Semiconductor devices including interconnections and contact plugs and methods of forming the same
08/08/2012CN101335257B Semiconductor apparatus and manufacturing method thereof
08/08/2012CN101294065B Enhanced thermal conducting formulations and methods for cooling electronic parts
08/08/2012CN101286487B Semiconductor device, led head and image forming apparatus
08/08/2012CN101267708B Plasma processing device and method
08/08/2012CN101226960B Access device having vertical channel and related semiconductor device and a method of fabricating the access device
08/08/2012CN101226903B 半导体装置 Semiconductor device
08/08/2012CN101202266B Chip scale package for power devices and method for making the same
08/08/2012CN101188190B SOQ substrate and method of manufacturing SOQ substrate
08/07/2012US8238103 Electronic component unit and coupling mechanism
08/07/2012US8238102 Heat dissipation apparatus for electronic device
08/07/2012US8238101 Heat transfer system for memory modules
08/07/2012US8238093 Computer system with duct
08/07/2012US8238007 On-the-fly laser beam path error correction for specimen target location processing
08/07/2012US8237457 Replacement-gate-compatible programmable electrical antifuse
08/07/2012US8237297 System and method for providing alignment mark for high-k metal gate process
08/07/2012US8237296 Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication
08/07/2012US8237295 Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
08/07/2012US8237294 Dicing tape-integrated wafer back surface protective film
08/07/2012US8237293 Semiconductor package with protective tape
08/07/2012US8237292 Semiconductor device and method for manufacturing the same
08/07/2012US8237291 Stack package
08/07/2012US8237290 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads
08/07/2012US8237289 System in package device
08/07/2012US8237288 Enhanced electromigration resistance in TSV structure and design
08/07/2012US8237287 Semiconductor device
08/07/2012US8237286 Integrated circuit interconnect structure
08/07/2012US8237285 Semiconductor device, through hole having expansion portion and thin insulating film
08/07/2012US8237284 Contact plug of semiconductor device and method of forming the same
08/07/2012US8237283 Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices
08/07/2012US8237282 Semiconductor device
08/07/2012US8237281 Semiconductor device
08/07/2012US8237280 Semiconductor device
08/07/2012US8237279 Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
08/07/2012US8237278 Configurable interposer
08/07/2012US8237277 Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
08/07/2012US8237276 Bump structure and fabrication method thereof
08/07/2012US8237275 Tungsten stiffener for flexible substrate assembly
08/07/2012US8237274 Integrated circuit package with redundant micro-bumps
08/07/2012US8237273 Metal post chip connecting device and method free to use soldering material
08/07/2012US8237272 Conductive pillar structure for semiconductor substrate and method of manufacture
08/07/2012US8237271 Direct edge connection for multi-chip integrated circuits
08/07/2012US8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
08/07/2012US8237269 High Q transformer disposed at least partly in a non-semiconductor substrate
08/07/2012US8237268 Module comprising a semiconductor chip
08/07/2012US8237267 Semiconductor device having a microcomputer chip mounted over a memory chip
08/07/2012US8237266 Component stacking for integrated circuit electronic package
08/07/2012US8237264 Method of manufacturing semiconductor device and thermal annealing apparatus
08/07/2012US8237263 Method and apparatus for cooling an integrated circuit
08/07/2012US8237262 Method and system for innovative substrate/package design for a high performance integrated circuit chipset
08/07/2012US8237261 Semiconductor device
08/07/2012US8237260 Power semiconductor module with segmented base plate
08/07/2012US8237259 Embedded chip package
08/07/2012US8237258 Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween
08/07/2012US8237257 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
08/07/2012US8237256 Integrated package
08/07/2012US8237255 Multi-layer printed circuit board having built-in integrated circuit package
08/07/2012US8237254 Distributed semiconductor device methods, apparatus, and systems
08/07/2012US8237252 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
08/07/2012US8237251 Semiconductor device including semiconductor chips with different thickness
08/07/2012US8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof
08/07/2012US8237249 Stacked multichip package
08/07/2012US8237248 Semiconductor device
08/07/2012US8237246 Deep trench crackstops under contacts
08/07/2012US8237235 Metal-ceramic multilayer structure
08/07/2012US8237232 Semiconductor device including a DC-DC converter having a metal plate
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