Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/09/2012WO2012104507A1 Method for manufacturing two substrates connected by at least one mechanical and electrically conductive connection and the structure obtained
08/09/2012WO2012104271A1 Electronic component comprising a ceramic carrier and use of a ceramic carrier
08/09/2012WO2012064636A3 Contact pad and method of manufacturing the same
08/09/2012US20120201596 Modification of solder alloy compositions to suppress interfacial void formation in solder joints
08/09/2012US20120201068 Stacked semiconductor device
08/09/2012US20120200329 Semiconductor device
08/09/2012US20120200303 High Bandwidth Passive Switching Current Sensor
08/09/2012US20120200282 Chip electronic component, mounted structure of chip electronic component, and switching supply circuit
08/09/2012US20120199993 Semiconductor device and method for manufacturing the same
08/09/2012US20120199992 Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
08/09/2012US20120199991 Semiconductor device and method for producing the same, and power supply
08/09/2012US20120199990 Semiconductor Module Having Deflecting Conductive Layer Over a Spacer Structure
08/09/2012US20120199989 Circuit arrangement and manufacturing method thereof
08/09/2012US20120199988 Method of manufacturing electronic device, electronic device, and apparatus for manufacturing electronic device
08/09/2012US20120199987 Methods for forming three-dimensional memory devices, and related structures
08/09/2012US20120199985 Compliant core peripheral lead semiconductor test socket
08/09/2012US20120199984 Semiconductor device, method for manufacturing the same, and data processing device
08/09/2012US20120199983 Enhanced electromigration resistance in tsv structure and design
08/09/2012US20120199982 Semiconductor device and method of manufacturing the same
08/09/2012US20120199981 Semiconductor device and method of fabricating the semiconductor device
08/09/2012US20120199980 Integrated circuits having interconnect structures and methods for fabricating integrated circuits having interconnect structures
08/09/2012US20120199979 Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device
08/09/2012US20120199978 Method for manufacturing semiconductor device and semiconductor wafer
08/09/2012US20120199977 Semiconductor device
08/09/2012US20120199976 Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for beol integration
08/09/2012US20120199975 Enhanced electromigration resistance in tsv structure and design
08/09/2012US20120199974 Silicon-Based Thin Substrate and Packaging Schemes
08/09/2012US20120199973 Interchangeable connection arrays for double-sided dimm placement
08/09/2012US20120199972 Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps
08/09/2012US20120199971 Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
08/09/2012US20120199970 Semiconductor device and method of manufacturing a semiconductor device
08/09/2012US20120199969 Semiconductor device
08/09/2012US20120199968 Semiconductor package
08/09/2012US20120199967 Interconnection Structure
08/09/2012US20120199966 Elongated Bump Structure for Semiconductor Devices
08/09/2012US20120199965 Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
08/09/2012US20120199963 Package-on-Package Using Through-Hole Via Die on Saw Streets
08/09/2012US20120199962 Semiconductor Package with Cantilever Leads
08/09/2012US20120199961 Semiconductor packages having lead frames
08/09/2012US20120199960 Wire bonding for interconnection between interposer and flip chip die
08/09/2012US20120199959 Extended under-bump metal layer for blocking alpha particles in a semiconductor device
08/09/2012US20120199958 Method of manufacturing high frequency module and high frequency module
08/09/2012US20120199955 Package carrier and manufacturing method thereof
08/09/2012US20120199950 Integrated circuits having place-efficient capacitors and methods for fabricating the same
08/09/2012US20120199943 Semiconductor device including antifuse element
08/09/2012US20120199942 Semiconductor device and fabrication method thereof
08/09/2012US20120199916 Semiconductor device
08/09/2012US20120199866 Reflective anode electrode for organic el display
08/09/2012US20120199830 Integrated Microelectronic Package Temperature Sensor
08/09/2012US20120199829 Semiconductor device
08/09/2012US20120199180 Solar panel assemblies
08/09/2012DE102012100767A1 Drain-erweiterte Feldeffekttransistoren und Verfahren zu deren Herstellung Drain-extended field effect transistors and methods for their preparation
08/09/2012DE102011052722B3 Cooling arrangement for electronic component, has metal block that is comprised with interconnected water chambers for supply and circulation of water from receiving side to discharging side of metal block
08/09/2012DE102011003870A1 Electronic circuit module for vehicle, has contact assembly that has contact surface electrically connected to contact region of circuit assembly, where filling component in region of contact surface is removed to expose contact surface
08/09/2012DE102011003832A1 Vergossenes Bauteil Molded component
08/08/2012EP2485260A2 Method for assembly and airtight sealing of an encapsulation box
08/08/2012EP2485257A1 Heat sink for electronic device, and process for production thereof
08/08/2012EP2485256A2 A semiconductor device
08/08/2012EP2485255A1 Laminated heat sink having enhanced heat dissipation capacity
08/08/2012EP2485254A1 Insulation circuit board, and power semiconductor device or inverter module using the same
08/08/2012EP2485253A1 Package for containing element and mounted structure
08/08/2012EP2485247A2 Image processing-based lithography system and target object coating method
08/08/2012EP2484190A1 Cold plate with pins
08/08/2012EP2483931A2 Solar cell module and method of manufacturing the same
08/08/2012EP2483922A1 Circuit arrangement and manufacturing method thereof
08/08/2012EP2483921A2 Cooling module for cooling electronic components
08/08/2012EP2483920A2 Apparatus for using heat pipes in controlling temperature of an led light unit
08/08/2012EP2326686B1 Curable organopolysiloxane composition and semiconductor device
08/08/2012EP2139553B1 Apparatus for setting the parameters of an alert window used for timing the delivery of etc signals to a heart under varying cardiac conditions
08/08/2012EP2100490B1 Rack enclosure
08/08/2012CN202374615U Heat pipe sink and heat radiating fin thereof
08/08/2012CN202374613U Flexible heat radiation assembly of electronic component
08/08/2012CN202374566U Multi-module printed circuit board (PCB) package and communication terminal
08/08/2012CN202373589U Diode capable of preventing stress from acting on chip
08/08/2012CN202373579U ESD (electrostatic discharge) protection resistor
08/08/2012CN202373578U Ultrathin paster diode
08/08/2012CN202373577U Welding blade terminal of high-power automotive rectifier bridge
08/08/2012CN202373576U Radiating module
08/08/2012CN202373575U Radiating device for power semiconductor device
08/08/2012CN202373574U Heat radiator for electronic component
08/08/2012CN202373573U IC packaging structure with heat exchange member
08/08/2012CN202373572U Multi-layer filling and sealing structure of light-emitting diode (LED) driver
08/08/2012CN202373571U Wafer with special testing structure
08/08/2012CN202373563U Temperature-controllable avalanche photodiode assembly
08/08/2012CN202367716U Plating bath with novel lifting baffles
08/08/2012CN102630339A Mounting electronic components assembled by means of a clip in a package
08/08/2012CN102630233A Epoxy resin composition
08/08/2012CN102629604A Cantilever type IC (Integrated Circuit) chip stack package of BT (Bismaleimide Triazine) substrate and production method of cantilever type IC chip stack package
08/08/2012CN102629603A 半导体装置 Semiconductor device
08/08/2012CN102629602A Semiconductor device
08/08/2012CN102629601A Bonded stacked wafers and methods of electroplating bonded stacked wafers
08/08/2012CN102629600A Wiring structure of semiconductor device and method of manufacturing the wiring structure
08/08/2012CN102629599A Quad flat no lead package and production method thereof
08/08/2012CN102629598A Semiconductor package having metalized source, gate and drain contact areas
08/08/2012CN102629597A Elongated bump structure for semiconductor devices
08/08/2012CN102629596A Patch type vehicle power diode and manufacturing method
08/08/2012CN102629595A Component encapsulating structure
08/08/2012CN102629568A Semiconductor device
08/08/2012CN102629561A Preparation method of stackable semiconductor assembly
08/08/2012CN102629560A Package carrier and manufacturing method thereof
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