Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/15/2012CN102637661A 半导体器件 Semiconductor devices
08/15/2012CN102637660A Integrated passive device, MIM (metal injection molding) capacitor, polar plate and forming method of polar plate
08/15/2012CN102637659A Chip package and fabrication method thereof
08/15/2012CN102637658A Electronic device with built-in over-voltage-protection composite film
08/15/2012CN102637657A Single crystal copper bonding lead and preparation method thereof
08/15/2012CN102637656A Through-silicon-via structure and forming method thereof
08/15/2012CN102637655A 热交换器 Heat exchanger
08/15/2012CN102637654A Chip cooling device capable of reinforcing boiling heat transfer based on foam metal
08/15/2012CN102637653A A semiconductor device
08/15/2012CN102637652A Semiconductor encapsulation, integral semiconductor encapsulation adopting semiconductor encapsulation and manufacture method of semiconductor encapsulation
08/15/2012CN102637651A Film for forming protective layer
08/15/2012CN102637650A Semiconductor device and method for producing the same, and power supply
08/15/2012CN102637649A Manufacturing method of semiconductor structure
08/15/2012CN102637612A Method for fixedly arranging semiconductor chip on circuit substrate and structure of semiconductor chip
08/15/2012CN102637608A Semiconductor device and method of forming a vertical interconnect structure for 3-d fo-wlcsp
08/15/2012CN102634164A Epoxide resin composition and condensate thereof
08/15/2012CN102157488B Integrated laminated transformer based on two layers of metal
08/15/2012CN102157471B Dual-layer laminated patch rectifying full bridge
08/15/2012CN102097345B Method for directly depositing metal line patterns on surface of insulating base material
08/15/2012CN102064158B Compact power module
08/15/2012CN101996958B Chip package and fabrication method thereof
08/15/2012CN101901797B Power electronics power module with imbedded gate circuitry
08/15/2012CN101901794B Plastic lead frame structure with reflective and conductor metal layer and preparation method thereof
08/15/2012CN101887884B Semiconductor device
08/15/2012CN101728396B Array substrate of thin film transistor and manufacturing method thereof
08/15/2012CN101728319B Circuit structure of metal line modified through silicon/germanium soaking
08/15/2012CN101640178B Semiconductor device, method for manufacturing semiconductor device, and lead frame
08/15/2012CN101615602B Semiconductor device, test mould and test method
08/15/2012CN101525437B Modified polyaluminosiloxane
08/15/2012CN101517733B 层叠的集成电路芯片组装件 Stacked integrated circuit chip assembly
08/15/2012CN101512622B Display device
08/15/2012CN101508878B Bonder and method of preparing the same
08/15/2012CN101477995B Photodetection semiconductor device, photodetector, and image display device
08/15/2012CN101471318B LGA substrate and method of making same
08/15/2012CN101471270B Low profile wire bonded USB device
08/15/2012CN101373766B Semiconductor device
08/15/2012CN101221958B Thin film transistor array panel having a means for visual inspection and a method of performing visual inspection
08/14/2012US8244399 Transport method and transport apparatus
08/14/2012US8243465 Semiconductor device with additional power supply paths
08/14/2012US8243462 Printed wiring board, semiconductor device, and method for manufacturing printed wiring board
08/14/2012US8243461 Electronic device and process for manufacturing electronic device
08/14/2012US8243451 Cooling member for heat containing device
08/14/2012US8243449 Heat-transporting device and electronic apparatus
08/14/2012US8242616 Method for manufacturing semiconductor device and molded structure
08/14/2012US8242615 Semiconductor chip on film package with dummy patterns and manufacturing method thereof
08/14/2012US8242614 Thermally improved semiconductor QFN/SON package
08/14/2012US8242613 Bond pad for semiconductor die
08/14/2012US8242612 Wiring board having piercing linear conductors and semiconductor device using the same
08/14/2012US8242611 Bonding metallurgy for three-dimensional interconnect
08/14/2012US8242610 Semiconductor device and method of fabricating semiconductor device
08/14/2012US8242608 Universal bump array structure
08/14/2012US8242607 Integrated circuit package system with offset stacked die and method of manufacture thereof
08/14/2012US8242606 Semiconductor integrated circuit
08/14/2012US8242605 Semiconductor device and method of manufacturing the same
08/14/2012US8242604 Coaxial through-silicon via
08/14/2012US8242603 Chip identification using top metal layer
08/14/2012US8242602 Composite solder TIM for electronic package
08/14/2012US8242601 Semiconductor chip with passivation layer comprising metal interconnect and contact pads
08/14/2012US8242600 Redundant metal barrier structure for interconnect applications
08/14/2012US8242599 Electronic component with diffusion barrier layer
08/14/2012US8242598 Semiconductor module having semiconductor device mounted on device mounting substrate
08/14/2012US8242597 Crystal structure of a solder bump of flip chip semiconductor device
08/14/2012US8242596 Method for efficiently producing removable peripheral cards
08/14/2012US8242595 Heatsink and semiconductor device with heatsink
08/14/2012US8242594 Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure
08/14/2012US8242593 Clustered stacked vias for reliable electronic substrates
08/14/2012US8242592 IC chip, antenna, and manufacturing method of the IC chip and the antenna
08/14/2012US8242591 Electrostatic chucking of an insulator handle substrate
08/14/2012US8242590 Silicon wafer for semiconductor with powersupply system on the backside of wafer
08/14/2012US8242589 Semiconductor device
08/14/2012US8242588 Lead frame based ceramic air cavity package
08/14/2012US8242587 Electronic device and pressure sensor
08/14/2012US8242586 Integrated circuit chip with seal ring structure
08/14/2012US8242585 Semiconductor device and method for manufacturing the same
08/14/2012US8242582 Semiconductor package and stacked semiconductor package having the same
08/14/2012US8242578 Anti-fuse device structure and electroplating circuit structure and method
08/14/2012US8242577 Fuse of semiconductor device and method for forming the same
08/14/2012US8242576 Protection layer for preventing laser damage on semiconductor devices
08/14/2012US8242572 Semiconductor apparatus
08/14/2012US8242565 Electrostatic discharge protection device
08/14/2012US8242529 Light emitting chip and method for manufacturing the same
08/14/2012US8242387 Electronic component storing package and electronic apparatus
08/14/2012US8242361 Tuner housing
08/14/2012US8241999 Semiconductor device having a protection pattern with two element separation regions
08/14/2012US8241964 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
08/14/2012US8241950 System and method to manufacture an implantable electrode
08/14/2012US8240363 Heat dissipation apparatus
08/14/2012US8240033 Method for manufacturing a circuit board
08/14/2012US8240032 Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
08/09/2012WO2012106720A1 High density metal-insulator-metal trench capacitor with concave surfaces
08/09/2012WO2012106183A1 Multichip packages
08/09/2012WO2012106182A1 Light-emitting devices comprising non-linear electrically protective material
08/09/2012WO2012106111A2 Circuit assemblies including thermoelectric modules
08/09/2012WO2012106103A1 Socket for ic device
08/09/2012WO2012105658A1 Manufacturing method for adhered material, manufacturing method for substrate having adhesive pattern, and substrate having adhesive pattern
08/09/2012WO2012105550A1 Resin composition and semiconductor device
08/09/2012WO2012105474A1 Bonding-surface fabrication method, bonded substrate, substrate bonding method, bonding-surface fabrication device, and substrate assembly
08/09/2012WO2012105199A1 Cooling structure for electronic device
08/09/2012WO2012105072A1 Epoxy resin composition and semiconductor sealing material using same
08/09/2012WO2012105071A1 Resin sealng material for semiconductor
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