Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/16/2012US20120205801 Anti-Tamper Wrapper Interconnect Method and a Device
08/16/2012US20120205800 Packaging structure
08/16/2012US20120205799 Chip package and fabrication method thereof
08/16/2012US20120205798 Semiconductor package and method for manufacturing the same
08/16/2012US20120205797 Bump and semiconductor device having the same
08/16/2012US20120205796 Semiconductor package and method for manufacturing the same
08/16/2012US20120205795 Stacked package and method of manufacturing the same
08/16/2012US20120205794 Semiconductor chip package structure and semiconductor chip
08/16/2012US20120205792 Semiconductor device
08/16/2012US20120205791 Semiconductor chip with reinforcing through-silicon-vias
08/16/2012US20120205790 Semiconductor device and method for manufacturing semiconductor device
08/16/2012US20120205789 Semiconductor device and method of manufacturing the same
08/16/2012US20120205788 Semiconductor device and a method of manufacturing the same
08/16/2012US20120205786 Method and structure for reworking antireflective coating over semiconductor substrate
08/16/2012US20120205785 Technique for Etching Monolayer and Multilayer Materials
08/16/2012US20120205722 Three-dimensional semiconductor memory devices and methods of fabricating the same
08/16/2012US20120205523 Avalanche impact ionization amplification devices
08/16/2012US20120205508 Spring clip
08/16/2012US20120204950 Transparent conductive coatings for optoelectronic and electronic devices
08/16/2012DE112010004342T5 Verbesserung der Umverdrahtungsschicht zum Steigern der Funktionssicherheit von Wafer Level Packaging Improving the redistribution layer for increasing the reliability of wafer level packaging
08/16/2012DE112010003936T5 Halbleitereinheit mit einem Kupferanschluss Semiconductor device having a copper connection
08/16/2012DE112010000798T5 Zeitmultiplex-frontend-modul Time division frontend module
08/16/2012DE112009004714T5 Kühlanordnung für gedruckte schaltungsplatinen Cooling assembly for printed circuit boards
08/16/2012DE112005001296B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit reduziertem Kontaktwiderstand A method of manufacturing a semiconductor device with reduced contact resistance
08/16/2012DE102012201710A1 Wärmetauscher Heat exchanger
08/16/2012DE102012100429A1 Verfahren zur Montage eines Halbleiterchips auf einem Träger A method for mounting a semiconductor chip on a carrier
08/16/2012DE102011087149A1 Halbleitervorrichtung und Verfahren, um sie zu testen A semiconductor device and method in order to test them
08/16/2012DE102011011378A1 Trägersubstrat und Verfahren zur Herstellung von Halbleiterchips Carrier substrate and process for producing semiconductor chips
08/16/2012DE102011004061A1 Elektronisches Gerät und Schutzelement hierfür für den Einsatz in explosionsgefährdeten Bereichen Electronic apparatus and protective element therefor for use in potentially explosive atmospheres
08/16/2012DE102009027292B4 Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung Inverter power module with distributed support for the direct substrate cooling
08/16/2012DE102007012818B4 Halbleitervorrichtung mit Anschlüssen A semiconductor device having terminals
08/16/2012DE102006056361B4 Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren Module with polymer-electrical connector and method
08/16/2012DE102006015447B4 Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben Power semiconductor component thereof with a power semiconductor chip and method for producing
08/16/2012DE102005024900B4 Leistungsmodul Power module
08/16/2012CA2827359A1 Electronic assembly
08/16/2012CA2824541A1 Insulated metal substrate
08/15/2012EP2488006A2 Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
08/15/2012EP2487710A1 Semiconductor device manufacturing method
08/15/2012EP2486587A1 Hermetically sealed radio-frequency front end
08/15/2012EP2486586A1 Three dimensional inductor and transformer
08/15/2012EP2184960B1 Circuit board and method for manufacturing circuit board
08/15/2012EP2026379B1 Multilayer ceramic electronic component and method for manufacturing same
08/15/2012EP1924960B1 Chip module and method for producing a chip module
08/15/2012EP1742171B1 Method for producing sheet provided with ic tags, apparatus for producing sheet provided with ic tags, sheet provided with ic tags, method for fixing ic chips, apparatus for fixing ic chips, and ic tag
08/15/2012EP1537187B1 Organic species that facilitate charge transfer to or from nanostructures
08/15/2012EP1525618B1 Semiconductor device with a cooling element
08/15/2012EP1490454B1 Method for making an integrated circuit device and corresponding integrated circuit device
08/15/2012CN202385449U Heat dissipating device
08/15/2012CN202384344U Forming structure for metal-oxide-semiconductor field effect transistor (MOSFET) power amplifier tube
08/15/2012CN202384330U Glass passivated chip with multilayer protection
08/15/2012CN202384329U Lug structure
08/15/2012CN202384328U Chip package structure
08/15/2012CN202384327U Small-size chip package structure
08/15/2012CN202384326U Improved chip package structure
08/15/2012CN202384325U Crystal package structure
08/15/2012CN202384324U Semiconductor package-in-package (PiP) system structure
08/15/2012CN202384323U 半导体封装构造 Semiconductor package
08/15/2012CN202384322U Large-current transistor packaging structure
08/15/2012CN202384321U Assembled radiating fin provided with transistor
08/15/2012CN202384320U Glue overflow prevention device for discrete device with radiating fins
08/15/2012CN202384319U Super-power brushless motor control actuating arm module
08/15/2012CN202384318U Firm rectifying diode
08/15/2012CN202384317U New type wafer package structure
08/15/2012CN202384316U Improved crystal package structure
08/15/2012CN202384315U Crystal package structure
08/15/2012CN202384314U Small-size semiconductor packaging structure
08/15/2012CN202384313U SMC (Surface Mount Component) packaging sheet
08/15/2012CN1996585B Semiconductor element with semiconductor component embedded into a plastic housing
08/15/2012CN1885554B Method for manufacturing electronic component and electronic component
08/15/2012CN102640310A Substrate for light-emitting elements and light-emitting device
08/15/2012CN102640286A Methods and apparatus for inductors with integrated passive and active elements
08/15/2012CN102640285A Microelectromechanical system having movable element integrated into leadframe-based package
08/15/2012CN102640284A Substrate for mounting element, and method for manufacturing the substrate
08/15/2012CN102640283A Semiconductor package with embedded die and its methods of fabrication
08/15/2012CN102640276A Sealed electronic housing and method for the sealed assembly of such a housing
08/15/2012CN102640257A Heterostructure for electronic power components, optoelectronic or photovoltaic components
08/15/2012CN102639643A Sealant for optical semiconductors and optical semiconductor device
08/15/2012CN102639590A Curable resin composition and cured product thereof
08/15/2012CN102638944A Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure
08/15/2012CN102637747A Double-copper-electrode rectifying tube chip made of coated environment-friendly material, and coating process
08/15/2012CN102637725A Device accomplished by adopting Bipolar low-pressure process and manufacturing method thereof
08/15/2012CN102637701A Transparent conductive film for improving charge transfer in backside illuminated image sensor
08/15/2012CN102637683A Led device with shared voltage-limiting unit and individual voltage-equalizing resistance
08/15/2012CN102637678A Packaging and stacking device and method for manufacturing same
08/15/2012CN102637677A Inductor as well as forming method thereof, radio frequency device and integrated passive device
08/15/2012CN102637676A Light emitting diode package and backlight unit having the same
08/15/2012CN102637675A Methods of forming a thin tim coreless high density bump-less package and structures formed thereby
08/15/2012CN102637674A TO247 lead frame
08/15/2012CN102637673A Novel lead frame
08/15/2012CN102637672A High connectivity lead frame
08/15/2012CN102637671A Novel lead frame
08/15/2012CN102637670A Novel lead frame
08/15/2012CN102637669A Novel lead frame
08/15/2012CN102637668A Novel lead frame
08/15/2012CN102637667A Novel lead frame
08/15/2012CN102637666A Novel lead frame
08/15/2012CN102637665A Lead frame with grooves in chip areas
08/15/2012CN102637664A Novel lead frame
08/15/2012CN102637663A Novel lead frame
08/15/2012CN102637662A Sn-sb-ge solder alloy
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