Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/22/2012CN101649965B Liquid-cooled light distribution hollow type LED lamp
08/22/2012CN101636067B Heat sink
08/22/2012CN101621906B Radiating device
08/22/2012CN101621040B Semiconductor device
08/22/2012CN101606228B Film forming method
08/22/2012CN101587898B A semiconductor structure with an integrated circuit component and formation and operation method thereof
08/22/2012CN101547583B Heat sink combination with protective device
08/22/2012CN101540627B Receiving device comprising impedance control circuit and semiconductor device
08/22/2012CN101515591B Structure for sensing wafer, wafer-class sensing assembling structure and method for producing same
08/22/2012CN101506968B Shielding floating gate tunneling element structure
08/22/2012CN101499451B Printed circuit board, semiconductor package, card apparatus, and system
08/22/2012CN101425333B High density resistor conversion memory and memory operation method thereof
08/22/2012CN101389725B 粘合膜 Adhesive film
08/22/2012CN101364629B Semiconductor light emitting apparatus
08/22/2012CN101341593B Multiple die integrated circuit package
08/22/2012CN101304017B Sintered high performance semiconductor substrate and corresponding production method
08/22/2012CN101183661B Post-channel interconnection implementing method for balancing stress of silicon chip
08/22/2012CN101068942B Non-evaporable getter alloys for hydrogen sorption
08/22/2012CN101043042B 半导体装置 Semiconductor device
08/21/2012USRE43590 Aluminum alloy electrode for semiconductor devices
08/21/2012US8248806 System and method for directly coupling a chassis and a heat sink associated with a circuit board or processor
08/21/2012US8248805 System to improve an in-line memory module
08/21/2012US8248785 Electronic device with thermal insulation member for heat sink
08/21/2012US8248523 Camera module with fold over flexible circuit and cavity substrate
08/21/2012US8247965 Light emitting display device and method for manufacturing the same
08/21/2012US8247911 Wire bonding structure and method for forming same
08/21/2012US8247910 Three-dimensional multichip module
08/21/2012US8247909 Semiconductor package device with cavity structure and the packaging method thereof
08/21/2012US8247908 Circuit substrate and method for utilizing packaging of the circuit substrate
08/21/2012US8247906 Supplying power to integrated circuits using a grid matrix formed of through-silicon vias
08/21/2012US8247904 Interconnection between sublithographic-pitched structures and lithographic-pitched structures
08/21/2012US8247903 Semiconductor device
08/21/2012US8247902 Semiconductor device and manufacturing method of the same
08/21/2012US8247900 Flip chip package having enhanced thermal and mechanical performance
08/21/2012US8247899 Power semiconductor module comprising a connection device with internal contact spring connection elements
08/21/2012US8247898 Semiconductor device and semiconductor device mounted structure
08/21/2012US8247897 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
08/21/2012US8247896 Stacked semiconductor device and fabrication method for same
08/21/2012US8247895 4D device process and structure
08/21/2012US8247894 Integrated circuit package system with step mold recess
08/21/2012US8247893 Mountable integrated circuit package system with intra-stack encapsulation
08/21/2012US8247892 Arrangement comprising at least one power semiconductor module and a transport packaging
08/21/2012US8247891 Chip package structure including heat dissipation device and an insulation sheet
08/21/2012US8247890 Wiring circuit structure and manufacturing method for semiconductor device using the structure
08/21/2012US8247889 Package having an inner shield and method for making the same
08/21/2012US8247888 Semiconductor device and method for manufacturing metallic shielding plate
08/21/2012US8247883 Printing shielded connections and circuits
08/21/2012US8247879 Micromechanical device with microfluidic lubricant channel
08/21/2012US8247876 Semiconductor device
08/21/2012US8247872 ESD protection circuit including multi-finger transistor
08/21/2012US8247866 Semiconductor device
08/21/2012US8247836 Nickel tin bonding system with barrier layer for semiconductor wafers and devices
08/21/2012US8247835 LED package with top and bottom electrodes
08/21/2012US8247827 LED phosphor deposition
08/21/2012US8247708 Cable seal apparatus and techniques for outside plant telecommunications housings
08/21/2012US8245763 Heat dissipation device with guilding lines and soldered heat pipes and manufacturing method thereof
08/16/2012WO2012109265A2 Three-dimensional power supply module having reduced switch node ringing
08/16/2012WO2012108944A2 Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
08/16/2012WO2012108469A1 Semiconductor device and semiconductor device manufacturing method
08/16/2012WO2012108320A1 Encapsulating resin composition for pre-application purposes, semiconductor chip, and semiconductor device
08/16/2012WO2012108083A1 Cover material for airtight sealing, package for housing electronic components, and method for manufacturing cover material for airtight sealing
08/16/2012WO2012108073A1 Method for manufacturing heat dissipating plate for semiconductor module, said heat dissipating plate, and semiconductor module using said heat dissipating plate
08/16/2012WO2012108053A1 Cooling device and power conversion device
08/16/2012WO2012108036A1 Power converter
08/16/2012WO2012108011A1 Power semiconductor module
08/16/2012WO2012107978A1 Semiconductor device
08/16/2012WO2012107755A1 Insulated metal substrate
08/16/2012WO2012107523A1 Heat-absorbing device with phase-change material
08/16/2012WO2012107482A2 Power semiconductor module
08/16/2012WO2012107312A1 Contact system comprising a connecting means and method
08/16/2012WO2012107231A1 Encapsulated component
08/16/2012WO2012106767A1 Electronic assembly
08/16/2012WO2012087613A3 Fabrication of through-silicon vias on silicon wafers
08/16/2012WO2012087474A3 A multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
08/16/2012WO2012079942A3 Measuring device operating with microwaves
08/16/2012WO2012078335A3 Hybrid-core through holes and vias
08/16/2012WO2012058471A3 Package inductance compensating tunable capacitor circuit
08/16/2012WO2012054416A3 System and method of forming sealed packages for electronic devices using a solder jet
08/16/2012WO2012048095A3 Interposers, electronic modules, and methods for forming the same
08/16/2012US20120208326 Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings
08/16/2012US20120205822 Resin composition for encapsulating semiconductor and semiconductor device using the resin composition
08/16/2012US20120205821 External gettering method and apparatus
08/16/2012US20120205820 Encapsulating resin sheet and semiconductor device using the same, and manufacturing method for the semiconductor device
08/16/2012US20120205819 Device with gaps for capacitance reduction
08/16/2012US20120205818 Self-aligned permanent on-chip interconnect structure formed by pitch splitting
08/16/2012US20120205817 Manufacturing method of semiconductor device and semiconductor device
08/16/2012US20120205816 Semiconductor chip and fabricating method thereof
08/16/2012US20120205815 Semiconductor package
08/16/2012US20120205814 Dielectric protection layer as a chemical-mechanical polishing stop layer
08/16/2012US20120205813 Integrated circuit package system with post-passivation interconnection and integration
08/16/2012US20120205812 Patterns of passivation material on bond pads and methods of manufacture thereof
08/16/2012US20120205811 Integrated circuit packaging system with terminal locks and method of manufacture thereof
08/16/2012US20120205810 Semiconductor device and fabricating method thereof
08/16/2012US20120205808 MEMS and Protection Structure Thereof
08/16/2012US20120205807 Device with post-contact back end of line through-hole via integration
08/16/2012US20120205806 Integrated circuit system with through silicon via and method of manufacture thereof
08/16/2012US20120205805 Semiconductor device and method of manufacturing the same
08/16/2012US20120205804 Method to fabricate copper wiring structures and structures formed tehreby
08/16/2012US20120205803 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
08/16/2012US20120205802 Printed circuit board and flip chip package using the same with improved bump joint reliability
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