Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/22/2012CN202394878U Ball grid array packaging structure embedded with multiple base islands and provided with multi-ring pins and electrostatic release ring
08/22/2012CN202394877U Multiple base island embedded single-circle pin and passive device packaging structure
08/22/2012CN202394876U Passive device packaging structure embedded with single base island and provided with multi-ring pins and electrostatic release ring
08/22/2012CN202394875U Passive device packaging structure embedded with single base island and provided with multi-ring pins
08/22/2012CN202394874U Single base island embedded multi-circle pin and electrostatic discharge ring packaging structure
08/22/2012CN202394873U Single-base-island exposure type single-circle-pin ball grid array packaging structure
08/22/2012CN202394872U Single-base-island exposure type single-circle-pin electrostatic release ring ball grid array packaging structure
08/22/2012CN202394871U Ball grid array package structure with multiple exposed base islands and circles of pins
08/22/2012CN202394870U Ball grid array packaging structure of no-base-island chip direct-placing passive devices
08/22/2012CN202394869U Base-free chip repeater sphere gate matrix packaging structure
08/22/2012CN202394868U Packaging structure of passive devices of single-base-island exposed type multi-circle pin electrostatic discharge rings
08/22/2012CN202394867U Non-base-island chip direct installation packaging structure
08/22/2012CN202394866U Packaging structure of multi-base-island exposed type multi-circle pin electrostatic discharge rings
08/22/2012CN202394865U Encapsulation structure for multi-island reveal multi-ring pin static discharge ring passive device
08/22/2012CN202394864U Packaging structure for base island free chip flip passive device
08/22/2012CN202394863U Chip with packaging structure
08/22/2012CN202394862U Power module
08/22/2012CN202394861U Integrated circuit packaged by ceramic casing
08/22/2012CN202394860U Packaging base plate strip
08/22/2012CN202394859U Semiconductor encapsulating structure
08/22/2012CN202393166U Novel heat dissipation assembly of intelligent refrigerator control chip
08/22/2012CN202393079U Radiating component for semiconductor refrigerating chip of refrigerator
08/22/2012CN202393077U Car refrigerator semiconductor refrigeration chip radiating component
08/22/2012CN102648671A Resin substrate with built-in electronic component and electronic circuit module
08/22/2012CN102648667A Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
08/22/2012CN102648520A Power module for an automobile
08/22/2012CN102648519A Cooling structure of semiconductor device
08/22/2012CN102648513A Method for forming metal oxide film, method for forming manganese oxide film, and computer-readable storage medium
08/22/2012CN102647882A Heat radiation module and electronic device provided with heat radiation module
08/22/2012CN102647880A Heat abstractor
08/22/2012CN102646704A Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device
08/22/2012CN102646681A 半导体器件 Semiconductor devices
08/22/2012CN102646680A Semiconductor device and method of manufacturing same
08/22/2012CN102646670A Semiconductor device and manufacturing method thereof
08/22/2012CN102646669A Capacitive proximity communication using tuned-inductor
08/22/2012CN102646668A Semiconductor package having tsv interposer and method of manufacturing same
08/22/2012CN102646667A Power semiconductor module and method of manufacturing a power semiconductor module
08/22/2012CN102646666A Dielectric protection layer as a chemical-mechanical polishing stop layer
08/22/2012CN102646665A Semiconductor device and method of manufacturing the same
08/22/2012CN102646664A Anchored conductive via and method for forming
08/22/2012CN102646663A 半导体封装件 Semiconductor package
08/22/2012CN102646662A TO92 type packaging box and matched molds
08/22/2012CN102646661A TO92S packaging box and matched die
08/22/2012CN102646660A Semiconductor module, packaging structure and packaging method therefor
08/22/2012CN102646659A Nano-sized metals and alloys, and methods of assembling packages containing same
08/22/2012CN102646658A Semiconductor package and method for manufacturing the same
08/22/2012CN102646657A Bump and semiconductor device having the same
08/22/2012CN102646656A Display apparatus
08/22/2012CN102646655A Structure for increasing electric contact surface area in micro-electronic packaging
08/22/2012CN102646654A Vertical electrical-connection structure among different plane circuits and manufacturing method thereof
08/22/2012CN102646653A Heat sink and method of manufacturing the same
08/22/2012CN102646652A Radiator and improvement method thereof
08/22/2012CN102646651A Thin hot plate structure
08/22/2012CN102646650A Semiconductor device and method for manufacturing semiconductor device
08/22/2012CN102646649A Fast heat-dissipation power tube of DC-DC (direct current-direct current) or charging machine of electric vehicle
08/22/2012CN102646648A Semiconductor switch insulation protection device and power supply module
08/22/2012CN102646647A Solid-state imaging apparatus, method of manufacturing same, and camera
08/22/2012CN102646646A Semiconductor chip assembly with post/Base/Post heat spreader and asymmetric posts
08/22/2012CN102646645A 封装结构及其制造方法 Package structure and its manufacturing method
08/22/2012CN102646644A Integrated circuit with sensor and method of manufacturing such an integrated circuit
08/22/2012CN102646639A Semiconductor device with embedded low-k metallization
08/22/2012CN102646638A Semiconductor devices including capacitors and metal contacts, and methods of fabricating the same
08/22/2012CN102646629A Array substrate and manufacturing method thereof
08/22/2012CN102646628A Method for manufacturing semiconductor device
08/22/2012CN102646627A Soft error rate (Ser) reduction in advanced silicon processes
08/22/2012CN102646610A Semiconductor device, method for manufacturing same, and power supply unit
08/22/2012CN102646609A Semiconductor device, manufacturing method of semiconductor device, and power source device
08/22/2012CN102646607A Technology method of parallel seam welding of MMW (Millimeter Waves) T/R assembly high conduction material
08/22/2012CN102646604A Radiator-contained substrate for power module and manufacturing method thereof, and power module
08/22/2012CN102643551A Organic silicon semiconductor packaging adhesive composition
08/22/2012CN102643254A Cycloaliphatic epoxy compound and preparation method and application thereof
08/22/2012CN102642095A Electroconductive bonding material comprising three types of metal particles with different melting points and its use for bonding an electronic component to a substrate
08/22/2012CN102642094A Paste for jointing and method for jointing semiconductor device and substrate
08/22/2012CN102157459B TSV (through silicon via) chip bonding structure
08/22/2012CN102093408B Benzocyclobutene substituted annular siloxane monomer as well as preparation method and application of benzocyclobutene substituted cyclic annular siloxane monomer
08/22/2012CN102054818B Interconnection structure and manufacture method thereof
08/22/2012CN102044523B Semiconductor device structure and manufacturing method thereof
08/22/2012CN102034864B MOS (metal oxide semiconductor) transistor and preparation method thereof
08/22/2012CN102024824B Array field effect transistor
08/22/2012CN102024790B Semiconductor device, manufacturing method, and integrated circuit and electronic equipment including the same
08/22/2012CN102024696B Opening and forming method thereof
08/22/2012CN102014570B PCB (printed circuit board) carried tape for phone card with non-contact function
08/22/2012CN102013422B Insulated gate bipolar translator power tube module
08/22/2012CN101989594B Test structure and test method of semiconductor device
08/22/2012CN101950741B Method for producing chip electrode multilevel interconnection structure
08/22/2012CN101944518B Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
08/22/2012CN101937895B Semiconductor packaging component
08/22/2012CN101937850B 封装制造方法和半导体装置 Package manufacturing method and a semiconductor device
08/22/2012CN101930961B 封装结构 Package
08/22/2012CN101924037B Method for manufacturing coreless capsulation substrates
08/22/2012CN101916755B Plane rectifier
08/22/2012CN101916752B Multilayer printed wiring board
08/22/2012CN101905854B Electronic component and its manufacturing method, and an electronic system
08/22/2012CN101847586B Circuit substrate process and circuit substrate
08/22/2012CN101842894B Module housing and method for producing a module housing
08/22/2012CN101814485B Packaging and fabricating method for mini power semiconductor with stacked inductance IC chip
08/22/2012CN101814477B A Silicon through holes after the interlinked structure being passivated.
08/22/2012CN101789391B Semiconductor device and manufacturing method thereof
08/22/2012CN101764126B Multi-chip semiconductor package structure without outer leads and lead frame thereof
08/22/2012CN101681888B Electronic part apparatus and process for manufacturing the same
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