Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/22/2012EP2489975A2 Heat sink and manufacturing method of porous graphite
08/22/2012EP2489956A1 Cooling system of an electric construction element that heats up
08/22/2012EP2489094A2 Prismatic cell system with thermal management features
08/22/2012EP2489072A1 Protective circuit board cover
08/22/2012EP2489071A1 Method and system for exposing delicate structures of a device encapsulated in a mold compound
08/22/2012EP2489070A1 Use of calcium oxide as a water scavenger in solar module applications
08/22/2012EP2489069A1 Edge sealants having balanced properties
08/22/2012EP2489068A2 Ic package with non-uniform dielectric layer thickness
08/22/2012EP1188182B1 A method of assembling a semiconductor device package
08/22/2012DE202012101335U1 Thermosiphonsysteme für Elektronikbauelemente Thermosiphon systems for electronic components
08/22/2012CN202394982U Anti-radiation MOS component structure based on part-depletion type SOI process
08/22/2012CN202394968U Semiconductor packaging structure
08/22/2012CN202394967U Semiconductor packaging structure
08/22/2012CN202394966U e/LQFP stacked packaging piece with grounding ring
08/22/2012CN202394965U e/LQFP (low profile quad flat package) planar package with ground loop
08/22/2012CN202394964U Multilayer-spacer IC (integrated circuit) chip laminated package for substrate
08/22/2012CN202394963U Multi-chip wafer-level semiconductor packaging structure
08/22/2012CN202394962U Semiconductor packaging structure with stacked chips
08/22/2012CN202394961U Semiconductor wafer with radiating columns and packaging structure
08/22/2012CN202394959U Packaging structure with test gasket
08/22/2012CN202394958U Wafer-level semiconductor packaging structure
08/22/2012CN202394957U Semi-conductor wafer and packaging structure
08/22/2012CN202394956U Semiconductor encapsulation structure
08/22/2012CN202394955U Wafer level package optimization structure
08/22/2012CN202394954U Semiconductor packaging structure
08/22/2012CN202394953U Lead frame with semiconductor packaging structure
08/22/2012CN202394952U Center-wiring double-loop-arranged single IC (integrated circuit) chip package
08/22/2012CN202394951U Integrated circuit lead frame heat radiating fin
08/22/2012CN202394950U Combined lead frame
08/22/2012CN202394949U No external leading pin type semiconductor package structure
08/22/2012CN202394948U New semiconductor lead frame
08/22/2012CN202394947U Single-base island embedded single-circle pin electrostatic discharge ring-passive device ball grid array packaging structure
08/22/2012CN202394946U Single-island embedded single ring pin passive device ball grid array encapsulating structure
08/22/2012CN202394945U Ball grid array packaging structure of single-base-island embedding single-circle pin electrostatic discharge rings
08/22/2012CN202394944U Structure for packaging ball grid array of passive device by embedding single circle of pin through a plurality of base islands
08/22/2012CN202394943U Multi-base island embedded single-circle pin electrostatic discharge ring ball grid array packaging structure
08/22/2012CN202394942U Multi-base island embedded multi-circle pin electrostatic discharge ring-passive device ball grid array packaging structure
08/22/2012CN202394941U Single-base island embedded multi-circle pin electrostatic discharge ring-passive device ball grid array packaging structure
08/22/2012CN202394940U Single-base island embedded multi-circle pin electrostatic discharge ring ball grid array packaging structure
08/22/2012CN202394939U Ball grid array package structure with single buried base island, multiple circles of pins and passive device
08/22/2012CN202394938U Single-base island embedded multi-circle pin ball grid array packaging structure
08/22/2012CN202394937U Multi-basic island and embedded multi-loop pin passive device ball grid array packaging structure
08/22/2012CN202394936U Multiple base-embedded multi-pin circle ball grid array packaging structure
08/22/2012CN202394935U Multi-base island embedded multi-circle pin electrostatic discharge ring-passive device ball grid array packaging structure
08/22/2012CN202394934U Structure for packaging static releasing ring by embedding single circle of pin through single base island
08/22/2012CN202394933U Single-base island embedded single-circle pin packaging structure
08/22/2012CN202394932U Single-base island embedded single-circle pin electrostatic discharge ring-passive device packaging structure
08/22/2012CN202394931U Packaging structure for multi-circle pins embedded in single-base island
08/22/2012CN202394930U Single-base island embedded single-circle pin passive device packaging structure
08/22/2012CN202394929U Multi-base embedded multi-pin and electrostatic discharge loop packaging structure
08/22/2012CN202394928U Multi-base island embedded multi-circle pin passive device packaging structure
08/22/2012CN202394927U Multi-base island embedded single-circle pin electrostatic discharge ring-passive device packaging structure
08/22/2012CN202394926U Multi-base embedded multi-loop-pin packaging structure
08/22/2012CN202394925U Structure for packaging static releasing rings by embedding single circle of pin through plurality of base islands
08/22/2012CN202394924U Multi-base-island embedded single-loop pin packaging structure
08/22/2012CN202394923U Encapsulation structure of multi-basic island embedded type passive device with multi-coil pins and static release coils
08/22/2012CN202394922U Encapsulation structure for single-island reveal multi-ring pin ball grid array
08/22/2012CN202394921U Single-basic island and exposed multi-loop pin electrostatic discharge coil passive device ball grid array packaging structure
08/22/2012CN202394920U multiple base island exposed single-circle pin, passive device and ball grid array packaging structure
08/22/2012CN202394919U Encapsulation structure of single-base-island exposed type multi-circle pin static release ring ball grid array
08/22/2012CN202394918U Single-base-island exposure type single-circle-pin electrostatic release ring passive component ball grid array packaging structure
08/22/2012CN202394917U Multiple base-exposed multi-pin circle passive device ball grid array packaging structure
08/22/2012CN202394916U Encapsulation structure of multi-base-island exposed type single-circle pin static release ring passive device ball grid array
08/22/2012CN202394915U Single base island exposed single-circle pin, passive device and ball grid array packaging structure
08/22/2012CN202394914U Multiple base island exposed single-circle pin and ball grid array packaging structure
08/22/2012CN202394913U Ball grid array encapsulation structure of single-basic island exposed passive device with multi-coil pins
08/22/2012CN202394912U Multi-basic island and exposed-type multi-loop pin electrostatic discharge coil ball grid array packaging structure
08/22/2012CN202394911U Encapsulation structure of multi-base-island exposed type single-circle pin static release ring ball grid array
08/22/2012CN202394910U Non-base-island chip inversion ball grid array packaging structure
08/22/2012CN202394909U Non-base-island chip inversion passive component ball grid array packaging structure
08/22/2012CN202394908U Base-free chip upside-down packaging structure
08/22/2012CN202394907U Island-free chip direct current discharge passive device encapsulating structure
08/22/2012CN202394906U Single-island-exposed passive device package structure with single circle of pins
08/22/2012CN202394905U Single-base-island exposure type multi-circle-pin packaging structure
08/22/2012CN202394904U Single-base exposed single-loop-pin electrostatic discharge loop passive device packaging structure
08/22/2012CN202394903U Multiple base-exposed multi-pin circle passive device packaging structure
08/22/2012CN202394902U Multi-base-island exposure type single-circle-pin electrostatic release ring packaging structure
08/22/2012CN202394901U Multi-base-island exposure type single-circle-pin packaging structure
08/22/2012CN202394900U Multi-basic island and exposed-type multi-loop pin packaging structure
08/22/2012CN202394899U Single-base-island exposure type single-circle-pin electrostatic release ring packaging structure
08/22/2012CN202394898U Single-base-island exposure type single-circle-pin packaging structure
08/22/2012CN202394897U Encapsulation structure of multi-base-island exposed type single-circle pin passive device
08/22/2012CN202394896U Single-base-island exposure type multi-circle-pin passive component packaging structure
08/22/2012CN202394895U Single-base-island exposure type multi-circle-pin electrostatic release ring packaging structure
08/22/2012CN202394894U Multiple base-exposed single-pin circle electrostatic discharge ring passive device packaging structure
08/22/2012CN202394893U Lead framework structure
08/22/2012CN202394892U Double IC chip packaging piece in multiple loop arrangement
08/22/2012CN202394891U Center-wiring double-loop-arranged IC (integrated circuit) laminated package
08/22/2012CN202394890U Semiconductor substrate structure
08/22/2012CN202394889U Semiconductor packaging structure
08/22/2012CN202394888U Insulated gate bipolar translator (IGBT) heat dissipation structure of automobile motor controller
08/22/2012CN202394887U Semiconductor packaging structure with stacked chips
08/22/2012CN202394886U Heat pipe radiator used for power semiconductor device
08/22/2012CN202394885U Intelligent refrigerator control chip radiating assembly
08/22/2012CN202394884U Assembled chip heat radiating device
08/22/2012CN202394883U High-voltage diode for microwave oven
08/22/2012CN202394882U Insulation half-enclosed three-terminal transistor
08/22/2012CN202394881U Semiconductor package structure for stacking
08/22/2012CN202394880U Single-base island embedded single-circle pin ball grid array packaging structure
08/22/2012CN202394879U Multi-base island embedded single-circle pin ball grid array packaging structure
1 ... 330 331 332 333 334 335 336 337 338 339 340 341 342 343 344 345 346 347 348 349 350 ... 2262