| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/06/2015 | US8927340 Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same |
| 01/06/2015 | US8927339 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry |
| 01/06/2015 | US8927337 Stacked packaging improvements |
| 01/06/2015 | US8927336 Packaging structure |
| 01/06/2015 | US8927335 Method for bonding of chips on wafers |
| 01/06/2015 | US8927334 Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package |
| 01/06/2015 | US8927333 Die carrier for package on package assembly |
| 01/06/2015 | US8927332 Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice |
| 01/06/2015 | US8927091 Display device and manufacturing method thereof |
| 01/06/2015 | US8927087 Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed |
| 01/06/2015 | US8926174 Controller of power converter |
| 01/06/2015 | US8925789 Contacting means and method for contacting electrical components |
| 01/06/2015 | US8925290 Mask storage device for mask haze prevention and methods thereof |
| 01/06/2015 | US8925194 Flex-rigid wiring board and method of manufacturing the same |
| 01/01/2015 | US20150007353 Device with capacitive security shield |
| 01/01/2015 | US20150006108 Process condition sensing wafer and data analysis system |
| 01/01/2015 | US20150004782 Semiconductor device and method of manufacturing the same |
| 01/01/2015 | US20150004781 Forming beol line fuse structure |
| 01/01/2015 | US20150004770 Method of fabricating a vertically oriented inductor within interconnect structures and capacitor structure thereof |
| 01/01/2015 | US20150004756 Methods of Forming Conductive and Insulating Layers |
| 01/01/2015 | US20150004755 Method of Manufacturing a Semiconductor Device |
| 01/01/2015 | US20150004754 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same |
| 01/01/2015 | US20150004753 Semiconductor package and manufacturing method thereof |
| 01/01/2015 | US20150004752 Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof |
| 01/01/2015 | US20150004751 Dummy Flip Chip Bumps for Reducing Stress |
| 01/01/2015 | US20150004750 Methods of Forming Conductive Materials on Contact Pads |
| 01/01/2015 | US20150004748 Methods of Forming Conductive Jumper Traces |
| 01/01/2015 | US20150003033 Three dimensional energy storage device, method of manufacturing same, and mobile electronic device containing same |
| 01/01/2015 | US20150003029 Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device |
| 01/01/2015 | US20150003016 Semiconductor device and semiconductor system |
| 01/01/2015 | US20150003000 Methods of forming molded panel embedded die structures |
| 01/01/2015 | US20150002846 Wafer alignment mark scheme |
| 01/01/2015 | US20150002229 Semiconductor packages having wire bond wall to reduce coupling |
| 01/01/2015 | US20150002226 Semiconductor package having wire bond wall to reduce coupling |
| 01/01/2015 | US20150002213 Modular fuses and antifuses for integrated circuits |
| 01/01/2015 | US20150001741 Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge |
| 01/01/2015 | US20150001740 Solution to deal with die warpage during 3d die-to-die stacking |
| 01/01/2015 | US20150001739 Wire tail connector for a semiconductor device |
| 01/01/2015 | US20150001738 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 01/01/2015 | US20150001735 Multipatterning via shrink method using ald spacer |
| 01/01/2015 | US20150001734 Conductive line patterning |
| 01/01/2015 | US20150001733 Reliable microstrip routing for electronics components |
| 01/01/2015 | US20150001732 Silicon space transformer for ic packaging |
| 01/01/2015 | US20150001731 Package assembly for embedded die and associated techniques and configurations |
| 01/01/2015 | US20150001730 Method to increase i/o density and reduce layer counts in bbul packages |
| 01/01/2015 | US20150001729 Semiconductor Device and Method of Forming Trench and Disposing Semiconductor Die Over Substrate to Control Outward Flow of Underfill Material |
| 01/01/2015 | US20150001728 Pre-treatment method for metal-oxide reduction and device formed |
| 01/01/2015 | US20150001727 Embedded package structure and method for manufacturing thereof |
| 01/01/2015 | US20150001725 Bonding structure and method for forming the same |
| 01/01/2015 | US20150001724 Method of creating a maskless air gap in back end interconnects with double self-aligned vias |
| 01/01/2015 | US20150001723 Semiconductor Devices Employing a Barrier Layer |
| 01/01/2015 | US20150001722 Semiconductor Device with Reduced Contact Resistance |
| 01/01/2015 | US20150001720 Interconnect Structure and Method for Forming Interconnect Structure |
| 01/01/2015 | US20150001719 Semiconductor Device and Method for Producing the Same |
| 01/01/2015 | US20150001718 Semiconductor device |
| 01/01/2015 | US20150001717 Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
| 01/01/2015 | US20150001716 De-pop on-device decoupling for bga |
| 01/01/2015 | US20150001715 Semiconductor device |
| 01/01/2015 | US20150001714 Stress-resilient chip structure and dicing process |
| 01/01/2015 | US20150001713 Multiple level redistribution layer for multiple chip integration |
| 01/01/2015 | US20150001712 Solder bump connection and method of making |
| 01/01/2015 | US20150001711 Semiconductor device and method of manufacturing same |
| 01/01/2015 | US20150001710 Chip package |
| 01/01/2015 | US20150001709 Semiconductor Device and Method of Stacking Semiconductor Die on a Fan-Out WLCSP |
| 01/01/2015 | US20150001708 Semiconductor Device and Method of Forming Low Profile 3D Fan-Out Package |
| 01/01/2015 | US20150001707 Semiconductor Device and Method of Using Substrate With Conductive Posts and Protective Layers to Form Embedded Sensor Die Package |
| 01/01/2015 | US20150001706 Systems and methods for avoiding protrusions in injection molded solder |
| 01/01/2015 | US20150001705 Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof |
| 01/01/2015 | US20150001704 Mechanisms for forming hybrid bonding structures with elongated bumps |
| 01/01/2015 | US20150001702 Semiconductor module and semiconductor device |
| 01/01/2015 | US20150001701 Multichip module with stiffing frame and associated covers |
| 01/01/2015 | US20150001700 Power Modules with Parylene Coating |
| 01/01/2015 | US20150001699 Semiconductor device |
| 01/01/2015 | US20150001698 Leadless packages and method of manufacturing same |
| 01/01/2015 | US20150001697 Selective treatment of leadframe with anti-wetting agent |
| 01/01/2015 | US20150001696 Semiconductor die carrier structure and method of manufacturing the same |
| 01/01/2015 | US20150001695 Semiconductor package |
| 01/01/2015 | US20150001694 Integrated circuit device package with thermal isolation |
| 01/01/2015 | US20150001693 Leadframe pocket |
| 01/01/2015 | US20150001692 Semiconductor component having a lateral semiconductor device and a vertical semiconductor device |
| 01/01/2015 | US20150001691 Packaged semiconductor device |
| 01/01/2015 | US20150001690 Semiconductor package |
| 01/01/2015 | US20150001689 Radio frequency shielding within a semiconductor package |
| 01/01/2015 | US20150001688 Semiconductor device |
| 01/01/2015 | US20150001686 Wafer level chip scale package with exposed thick bottom metal |
| 01/01/2015 | US20150001685 Semiconductor packages having through electrodes and methods of fabricating the same |
| 01/01/2015 | US20150001684 Electroplating using dielectric bridges |
| 01/01/2015 | US20150001682 Wafer edge protection structure |
| 01/01/2015 | US20150001681 Bonded Wafer Edge Protection Scheme |
| 01/01/2015 | US20150001671 Electric field gap device and manufacturing method |
| 01/01/2015 | US20150001639 Semiconductor device |
| 01/01/2015 | US20150001635 Methods of forming an e-fuse for an integrated circuit product and the resulting integrated circuit product |
| 01/01/2015 | US20150001617 Semiconductor devices including vertical channel transistors and methods of fabricating the same |
| 01/01/2015 | US20150001613 Semiconductor devices including stair step structures, and related methods |
| 01/01/2015 | US20150001599 Power Semiconductor Package with Non-Contiguous, Multi-Section Conductive Carrier |
| 01/01/2015 | US20150001592 Semiconductor Device With Self-Protecting Fuse And Method Of Fabricating The Same |
| 01/01/2015 | US20150001555 Methods for Coating a Substrate with an Amphiphilic Compound |
| 01/01/2015 | US20150001550 Selectively Area Regrown III-Nitride High Electron Mobility Transistor |
| 01/01/2015 | US20150001538 Semiconductor device and a method of manufacturing the same |
| 01/01/2015 | US20150001462 Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates |