Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/28/2012US8253230 Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
08/28/2012US8253229 Semiconductor package and stacked layer type semiconductor package
08/28/2012US8253228 Package on package structure
08/28/2012US8253227 Semiconductor integrated circuit device
08/28/2012US8253226 Electronic parts, and method for arranging shielding case and chip parts
08/28/2012US8253225 Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof
08/28/2012US8253224 Semiconductor package with metal straps
08/28/2012US8253217 Seal ring structure in semiconductor devices
08/28/2012US8253203 Electrostatic discharge (ESD) protection circuit
08/28/2012US8253198 Devices for shielding a signal line over an active region
08/28/2012US8253175 Sealed semiconductor device
08/28/2012US8253165 Structures for lowering trigger voltage in an electrostatic discharge protection device
08/28/2012US8253041 Electronic element packaging module
08/28/2012US8252694 Plasma etching method and storage medium
08/28/2012US8252682 Method for thinning a wafer
08/28/2012US8252677 Method of forming solder bumps on substrates
08/28/2012US8252635 Electronic system modules and method of fabrication
08/28/2012US8252631 Method and apparatus for integrated circuit packages using materials with low melting point
08/28/2012US8252615 Integrated circuit package system employing mold flash prevention technology
08/28/2012US8252419 Adhesive for bonding circuit members, circuit board and process for its production
08/28/2012US8251518 Projector with adjustable light source module
08/28/2012US8251131 Injection cooling heat exchanger for vehicle electrical components
08/23/2012WO2012112912A2 Side-mounted controller and methods for making the same
08/23/2012WO2012111814A1 Wiring substrate, method for manufacturing same, and semiconductor device
08/23/2012WO2012111789A1 Method for forming insulating film
08/23/2012WO2012111765A1 Curable resin composition and colour conversion material using same
08/23/2012WO2012111729A1 Method for producing silicon dioxide film
08/23/2012WO2012111652A1 Liquid sealing resin composition and semiconductor device obtained using liquid sealing resin composition
08/23/2012WO2012111642A1 Hollow resin case for housing semiconductor chip
08/23/2012WO2012111285A1 Insulated gate semiconductor device
08/23/2012WO2012111254A1 Semiconductor device and process for manufacture thereof
08/23/2012WO2012111174A1 Wafer level package, chip size package device and method of manufacturing wafer level package
08/23/2012WO2012110365A1 Carrier substrate and method for producing semiconductor chips
08/23/2012WO2012109861A1 Heat sink, electronic device and mounting method thereof
08/23/2012WO2012082881A3 Void-free wafer bonding using channels
08/23/2012WO2012072070A3 Sensor comprising a preferably multilayered ceramic substrate and method for producing it
08/23/2012WO2012061091A3 Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package
08/23/2012WO2011093934A8 Method for improving plating on non-conductive substrates
08/23/2012WO2011080672A3 Fan-out chip scale package
08/23/2012US20120212251 Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device
08/23/2012US20120212245 Circuit and method for testing insulating material
08/23/2012US20120211904 Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die
08/23/2012US20120211903 Semiconductor device
08/23/2012US20120211902 Bond pad structure
08/23/2012US20120211901 Semiconductor device, manufacturing method of semiconductor device, and power source device
08/23/2012US20120211900 Semiconductor Device and Method of Forming Multi-Layered UBM with Intermediate Insulating Buffer Layer to Reduce Stress for Semiconductor Wafer
08/23/2012US20120211899 Semiconductor device, method for manufacturing the same, and power supply unit
08/23/2012US20120211898 Semiconductor device
08/23/2012US20120211897 Semiconductor apparatus
08/23/2012US20120211896 Interconnects for packaged semiconductor devices and methods for manufacturing such devices
08/23/2012US20120211895 Chip module and method for providing a chip module
08/23/2012US20120211894 Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same
08/23/2012US20120211893 Method for manufacturing semiconductor device and semiconductor device
08/23/2012US20120211892 Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP
08/23/2012US20120211891 Anchoring Structure and Intermeshing Structure
08/23/2012US20120211890 Method for forming metal thin film, semiconductor device and manufacturing method thereof
08/23/2012US20120211889 Method for contacting agglomerate terminals of semiconductor packages
08/23/2012US20120211888 Apparatus and methods for uniform metal plating
08/23/2012US20120211887 Bump-on-Lead Flip Chip Interconnection
08/23/2012US20120211886 Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the Method
08/23/2012US20120211885 Semiconductor package having through silicon via (tsv) interposer and method of manufacturing the semiconductor package
08/23/2012US20120211884 Wafer chip scale package connection scheme
08/23/2012US20120211883 Anchored conductive via and method for forming
08/23/2012US20120211882 Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch
08/23/2012US20120211881 Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
08/23/2012US20120211880 Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate
08/23/2012US20120211879 Manufacturing method of semiconductor device, semiconductor device and electronic apparatus
08/23/2012US20120211877 Semiconductor Device And Method For Manufacturing Same
08/23/2012US20120211876 Module ic package structure
08/23/2012US20120211875 Semiconductor device with stacked semiconductor chips
08/23/2012US20120211872 Semiconductor device
08/23/2012US20120211867 Side-mounted controller and methods for making the same
08/23/2012US20120211856 Photovoltaic cell conductor consisting of two, high-temperature and low-temperature, screen-printed parts
08/23/2012US20120211846 Mram device and method of assembling same
08/23/2012US20120211796 Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same
08/23/2012US20120211764 Semiconductor device and method for manufacturing semiconductor device
08/23/2012US20120211762 Semiconductor device, method of manufacturing semiconductor device and electronic circuit
08/23/2012US20120211205 Multi-blade centrifugal fan and air conditioner employing the same
08/23/2012DE112010004326T5 Integrierter Entkopplungskondensator, bei welchem leitfähige Durchkontaktierungen durch das Substrat verwendet werden Integrated decoupling capacitor can be used in which conductive vias through the substrate
08/23/2012DE112010003418T5 Verflochtener vertikaler Parallelkondensator Intertwined vertical parallel capacitor
08/23/2012DE112010002791T5 SCHALTKREISSTRUKTUR UND VERFAHREN ZUM PROGRAMMIEREN UNDUMPROGRAMMIEREN EINER ELEKTRONISCHEN SICHERUNG (eFUSE) FÜRGERINGE LEISTUNG UND MIT MEHREREN ZUSTÄNDEN CIRCUIT STRUCTURE AND METHOD FOR PROGRAMMING UNDUMPROGRAMMIEREN AN ELECTRONIC CONTROL (eFUSE) FÜRGERINGE PERFORMANCE AND MULTIPLE STATES
08/23/2012DE112010001383T5 Verbindungsstruktur für ein Halbleiterbauelement und zugehöriges Verfahren zur Herstellung Interconnect structure for a semiconductor device and associated method for the preparation of
08/23/2012DE102012101116A1 Package manufacturing method, involves exposing coating material of coating film to plasma and brought into active state, before coating material is separated on surface of circuit component
08/23/2012DE102011055018A1 Semiconductor package for use in e.g. electronic system, has upper semiconductor device comprising conductive bumps that connect pads on upper surface of interposer to corresponding terminal on lower surface of device
08/23/2012DE102011012186A1 Chipmodul und Verfahren zur Bereitstellung eines Chipmoduls Chip module and method of providing a chip module
08/23/2012DE102011011861A1 Halbleiterchipgehäuseanordnung und Herstellungsverfahren A semiconductor chip package assembly and manufacturing processes
08/23/2012DE102011004570A1 Component carrier for e.g. microelectromechanical system component, has carrier film formed with coating, where mounting surface is formed on inner wall of film for mounting microelectromechanical system components
08/23/2012DE102011004544A1 Schaltungsanordnung Circuitry
08/23/2012DE102011004541A1 Verbessertes Leistungshalbleitermodul Improved power semiconductor module
08/23/2012DE102011004508A1 Method for contacting LED chip for LED lamp, involves mechanically pressing electrically conductive contact surface of chip carrier to appropriate electrically conductive contact surface of LED chip
08/23/2012DE102011004381A1 Moldmodul mit Sensorelement Moldmodul with sensor element
08/23/2012DE102011000866A1 Elektrisches Bauelement mit einer elektrischen Verbindungsanordnung und Verfahren zu dessen Herstellung An electrical component with an electrical connection arrangement and method for its production
08/23/2012DE102008063724B4 Sammelschienenanordnung mit eingebauter Kühlung, Fahrzeugwechselrichtermodul und Verfahren zum Kühlen eines Wechselrichtermoduls Busbar arrangement with integrated cooling, car inverter module and method for cooling an inverter module
08/23/2012DE102007007566B4 Halbleiter-Bauelement-System, Speichermodul und Verfahren zum Betreiben eines Halbleiter-Bauelement-Systems Semiconductor component system, memory module and method of operating a semiconductor device system
08/22/2012EP2490515A1 Electric function unit and method for manufacturing a three-dimensional electric function unit
08/22/2012EP2490256A1 Electronic arrangement
08/22/2012EP2490255A1 Microwave and millimeter wave circuit
08/22/2012EP2490254A2 Power conversion apparatus with cooling means
08/22/2012EP2490252A2 Electroconductive bonding material comprising three types of metal particles with different melting points and its use for bonding an electronic component to a substrate
08/22/2012EP2490250A1 Mould module with sensor element
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