Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/29/2012CN202404514U Heat radiator
08/29/2012CN202403583U Compact loop heat pipe device
08/29/2012CN202403580U Temperature equalizing plate structure
08/29/2012CN1992293B Thin film transistor array substrate and method for manufacturing the same
08/29/2012CN102652358A Panel based lead frame packaging method and device
08/29/2012CN102652357A 半导体装置 Semiconductor device
08/29/2012CN102652348A On chip integrated inductor and manufacturing method therefor
08/29/2012CN102651956A Radiating module and manufacturing method thereof
08/29/2012CN102651955A Combined method and structure of heat pipe and heat conducting body
08/29/2012CN102651954A Radiator and fastening device thereof
08/29/2012CN102651404A Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer
08/29/2012CN102651391A High junction temperature semiconductor controllable silicon
08/29/2012CN102651363A Vias between conductive layers to improve reliability
08/29/2012CN102651362A Series integrated photoelectric module and producing method thereof
08/29/2012CN102651361A Integrated circuits
08/29/2012CN102651360A Packaging body structure capable of realizing copper wire keyed joint and manufacturing method thereof
08/29/2012CN102651359A Semiconductor structure with low resistance substrate and low power loss
08/29/2012CN102651358A Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same
08/29/2012CN102651357A Semiconductor device, sensor and electronic device
08/29/2012CN102651356A Extending metal traces in bump-on-trace structures
08/29/2012CN102651355A Integrated circuits including conductive structures through a substrate and methods of making the same
08/29/2012CN102651354A 半导体装置 Semiconductor device
08/29/2012CN102651353A Semiconductor device and method for manufacturing same
08/29/2012CN102651352A Semiconductor apparatus, method for manufacturing the same and electric device
08/29/2012CN102651351A Semiconductor device, method of manufacturing semiconductor device and electronic circuit
08/29/2012CN102651350A Wafer package
08/29/2012CN102651349A Power module substrate and manufacturing method, substrate with radiator and power module
08/29/2012CN102651348A Substrate for power module, manufacturing method, substrate with heat radiator and power module
08/29/2012CN102651347A Circuit system
08/29/2012CN102651346A Passivation layer for semiconductor devices
08/29/2012CN102651344A Common line structure and display panel and fabrication method thereof
08/29/2012CN102651334A Semiconductor device and method for manufacturing semiconductor device
08/29/2012CN102176436B Process for preparing high-performance Diamond/SiC electronic packaging material
08/29/2012CN102074543B Packaging pedestal for semiconductor
08/29/2012CN102074531B Object fixing jig and fixing device group thereof
08/29/2012CN102074479B Semiconductor device and production method thereof
08/29/2012CN102024710B Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof
08/29/2012CN102013415B Substrate structure applied to flexible electronic component and manufacture method thereof
08/29/2012CN101989554B Packaging structure and packaging process
08/29/2012CN101980360B 半导体结构及其制作方法 Semiconductor structure and fabrication method
08/29/2012CN101976652B Semiconductor packaging structure and manufacture process thereof
08/29/2012CN101958306B Embedded circuit substrate and manufacturing method thereof
08/29/2012CN101916754B Through-hole, through-hole forming method and through-hole filling method
08/29/2012CN101877347B Flexible and thin image sensing module with electromagnetic interference prevention and circuit board module
08/29/2012CN101869008B Semiconductor device and multilayer wiring board
08/29/2012CN101861648B Semiconductor power device package having a lead frame-based integrated inductor
08/29/2012CN101853831B Semiconductor device and manufacturing method therefor
08/29/2012CN101836291B Lead frame and process for producing the same
08/29/2012CN101834168B Combined type circuit substrate structure
08/29/2012CN101834148B Semiconductor apparatus and method for manufacturing same
08/29/2012CN101763817B Flat panel display including electrostatic protection circuit
08/29/2012CN101740532B Double solid metal pad with reduced area
08/29/2012CN101728338B Light emitting display and method of manufacturing the same
08/29/2012CN101696317B Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof
08/29/2012CN101635293B Wafer-to-wafer stacking
08/29/2012CN101599466B Graphic substrate for epitaxial growth and production method thereof
08/29/2012CN101593742B Semiconductor device and a method of manufacturing the same
08/29/2012CN101551094B Light emitting diode lamp with functions of heat convection and heat conduction and heat radiation module thereof
08/29/2012CN101533815B Semiconductor device and method of manufacturing the same
08/29/2012CN101517719B Method of manufacturing an integrated circuit
08/29/2012CN101500391B Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip
08/29/2012CN101471355B Image sensor and method for manufacturing the sensor
08/29/2012CN101466242B Radiating device
08/29/2012CN101466208B Wiring substrate and method of manufacturing the same
08/29/2012CN101359637B Power semiconductor device with metal contact layer and corresponding production method
08/29/2012CN101308810B Semiconductor circuit construction and manufacturing process
08/29/2012CN101286516B Active matrix subtrate, liquid crystal display panel and method of manufacturing the same
08/29/2012CN101145564B Active matrix display base plate preparing method
08/29/2012CN101001516B Cooling device, system and method
08/28/2012USRE43607 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects
08/28/2012US8255031 Analyte monitoring device and methods of use
08/28/2012US8254155 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/28/2012US8254142 Method of using conductive elastomer for electrical contacts in an assembly
08/28/2012US8254128 Heat-transfer mechanism and information device
08/28/2012US8254126 Electronic circuit device
08/28/2012US8253672 Circuit board and display device including the same
08/28/2012US8253526 Termination compensation for differential signals on glass
08/28/2012US8253258 Semiconductor device with hollow and throughhole and method of manufacturing same
08/28/2012US8253256 Stacked semiconductor package
08/28/2012US8253255 Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime
08/28/2012US8253254 Semiconductor device and manufacturing method thereof
08/28/2012US8253252 Semiconductor device and manufacturing method thereof
08/28/2012US8253251 Method for producing low-k film, semiconductor device, and method for manufacturing the same
08/28/2012US8253250 Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers
08/28/2012US8253248 Fabrication method of semiconductor device having conductive bumps
08/28/2012US8253247 Semiconductor device and method for manufacturing the same
08/28/2012US8253245 Communication device
08/28/2012US8253244 Semiconductor package having memory devices stacked on logic device
08/28/2012US8253243 Bonded wafer substrate utilizing roughened surfaces for use in MEMS structures
08/28/2012US8253241 Electronic module
08/28/2012US8253240 Cap member and semiconductor device employing same
08/28/2012US8253239 Multi-chip semiconductor connector
08/28/2012US8253238 Resin-sealed semiconductor device and method of manufacturing the same
08/28/2012US8253237 Semiconductor module arrangement and method
08/28/2012US8253236 Power semiconductor device
08/28/2012US8253235 Semiconductor packaging substrate improving capability of electrostatic dissipation
08/28/2012US8253234 Optimized semiconductor packaging in a three-dimensional stack
08/28/2012US8253233 Module including a sintered joint bonding a semiconductor chip to a copper surface
08/28/2012US8253232 Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same
08/28/2012US8253231 Stacked integrated circuit package using a window substrate
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