Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2012
08/30/2012WO2012114613A1 Thermally conductive adhesive
08/30/2012WO2012113730A1 Arrangement for cooling heat-generating components on a system board of a computer system, such a system board and such a computer system
08/30/2012WO2012113645A1 Semiconductor chip packet arrangement and fabrication method
08/30/2012WO2012113584A1 Power semiconductor module
08/30/2012WO2012113297A1 Multi-layer hybrid synchronous bonding structure and method for three-dimensional packaging
08/30/2012WO2012113249A1 Led encapsulation bracket structure and led device
08/30/2012WO2012050333A3 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
08/30/2012WO2012047002A3 Radiant heat circuit board, heat generating device package having the same, and backlight unit
08/30/2012WO2012022404A8 Core-sheath ribbon wire
08/30/2012WO2011125441A9 Magnesium-based composite member, heat dissipation member, and semiconductor device
08/30/2012US20120220104 Semiconductor integrated circuit device and process for manufacturing the same
08/30/2012US20120220091 Methods of making power semiconductor devices with thick bottom oxide layer
08/30/2012US20120218024 Integrated Circuit Die Stacks With Translationally Compatible Vias
08/30/2012US20120217660 Semiconductor apparatus, method for manufacturing the same and electric device
08/30/2012US20120217659 Integrated circuit package with molded cavity
08/30/2012US20120217658 Multi-stack semiconductor integrated circuit device
08/30/2012US20120217657 Multi-chip module package
08/30/2012US20120217656 Semiconductor Package Including Multiple Chips And Separate Groups of Leads
08/30/2012US20120217655 Electronic device for high power applications
08/30/2012US20120217653 Semiconductor device and noise suppressing method
08/30/2012US20120217652 Semiconductor devices and methods of manufacturing semiconductor devices
08/30/2012US20120217651 Through substrate vias
08/30/2012US20120217650 Semiconductor device, sensor and electronic device
08/30/2012US20120217649 Digital integrated circuit
08/30/2012US20120217648 Through substrate structure, device package having the same, and methods for manufacturing the same
08/30/2012US20120217647 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
08/30/2012US20120217646 Vias between conductive layers to improve reliability
08/30/2012US20120217645 Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP
08/30/2012US20120217644 Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding
08/30/2012US20120217643 Semiconductor Device and Method of Forming Bond Wires Between Semiconductor Die Contact Pads and Conductive TOV in Peripheral Area Around Semiconductor Die
08/30/2012US20120217642 Semiconductor device packages having a side-by-side device arrangement and stacking functionality
08/30/2012US20120217641 Preventing the Cracking of Passivation Layers on Ultra-Thick Metals
08/30/2012US20120217640 Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer
08/30/2012US20120217639 Semiconductor device and manufacturing method of semiconductor device
08/30/2012US20120217638 Wiring connection method and functional device
08/30/2012US20120217637 Substrate for high speed semiconductor package and semiconductor package having the same
08/30/2012US20120217636 Ni PLATING OF A BLM EDGE FOR Pb-FREE C4 UNDERCUT CONTROL
08/30/2012US20120217635 Packaging Structure and Method
08/30/2012US20120217634 Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
08/30/2012US20120217633 Passivation layer for semiconductor devices
08/30/2012US20120217632 Extending Metal Traces in Bump-on-Trace Structures
08/30/2012US20120217631 Integrated circuit devices including air spacers separating conductive structures and contact plugs and methods of fabricating the same
08/30/2012US20120217630 Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device
08/30/2012US20120217629 Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump
08/30/2012US20120217628 Metal bumps for cooling device connection
08/30/2012US20120217627 Package structure and method of fabricating the same
08/30/2012US20120217626 Semiconductor device and method for manufacturing semiconductor device
08/30/2012US20120217625 Integrated circuit micro-module
08/30/2012US20120217624 Connection using conductive vias
08/30/2012US20120217616 Semiconductor device and semiconductor device mounting structure
08/30/2012US20120217614 Power convertor device and construction methods
08/30/2012US20120217613 Programmable Fuse
08/30/2012US20120217611 Integrated circuits including conductive structures through a substrate and methods of making the same
08/30/2012US20120217593 Sensor mounted in flip-chip technology at a substrate edge
08/30/2012US20120217556 Semiconductor device
08/30/2012US20120217552 Metal line structure and manufacturing method for trench
08/30/2012US20120217541 Igbt with integrated mosfet and fast switching diode
08/30/2012US20120217500 Wiring, thin film transistor, thin film transistor panel and methods for manufacturing the same
08/30/2012US20120217497 Manufacturing method for semiconductor device, manufacturing apparatus for semiconductor device, and semiconductor device
08/30/2012US20120217374 Solid-state imaging device, electronic equipment, semiconductor device and manufacturing method of solid-state imaging device
08/30/2012US20120217305 Ic card
08/30/2012US20120217209 Solar collector module
08/30/2012US20120217056 Electronic Component and Package for Device, and Method of Manufacturing the Same
08/30/2012DE112010000447T5 Elektronische Schaltungsvorrichtung An electronic circuit device
08/30/2012DE112006001048B4 Herstellungsverfahren für Schaltungsteile Production method for circuit parts
08/30/2012DE112004002071B4 Elektronisches Bauteil mit Kühlvorrichtung Electronic component with cooler
08/30/2012DE102012202785A1 Halbleitervorrichtung Semiconductor device
08/30/2012DE102011013172A1 Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste Paste for connecting components of electronic power modules, system and method for applying the paste
08/30/2012DE102009005650B4 Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls Electronic module and method for producing an electronic module
08/30/2012DE102007034247B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
08/30/2012DE102007025950B4 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method
08/30/2012DE102007003568B4 Kühlvorrichtung für eine zu kühlende elektronische Einrichtung Cooling device for electronic device to be cooled
08/30/2012DE102006044836B4 Module mit einem Abschirm- und/oder Wärmeableitungselement und Verfahren zu ihrer Herstellung Modules with a shield and / or heat dissipation element and process for their preparation
08/29/2012EP2493272A1 Device mounting structure and device mounting method
08/29/2012EP2493080A1 High-frequency module and reception device
08/29/2012EP2492960A2 Vias between conductive layers to improve reliability
08/29/2012EP2492959A1 Electrical component having an electrical connection arrangement and method for the manufacture thereof
08/29/2012EP2492958A1 Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
08/29/2012EP2492957A2 Switching assembly
08/29/2012EP2492675A1 A biosensor chip and a method of manufacturing the same
08/29/2012EP2491589A1 Reconfiguring through silicon vias in stacked multi-die packages
08/29/2012EP2491588A1 Esd/antenna diodes for through-silicon vias
08/29/2012EP2491587A2 Method of embedding material in a glass substrate
08/29/2012EP2491582A1 Method for producing vias
08/29/2012EP2491580A2 Semiconductor wafer having scribe lane alignment marks for reducing crack propagation
08/29/2012EP2491579A1 Self-aligned barrier and capping layers for interconnects
08/29/2012CN202406387U Printed circuit board (PCB) with ball grid array structure
08/29/2012CN202405271U Small power voltage-regulator diode
08/29/2012CN202405270U Quick-recovery silicon plastic-packaged rectifier diode
08/29/2012CN202405262U Silicon plastic-packaged bidirectional trigger diode
08/29/2012CN202405260U Active matrix display
08/29/2012CN202405252U Pin framework of bridge type rectifier
08/29/2012CN202405251U Heat radiating apparatus
08/29/2012CN202405250U Heat radiating structure of radiator and device utilizing the same structure
08/29/2012CN202405249U Silicon plastic package voltage stabilizing diode
08/29/2012CN202405248U Bidirectional voltage-stabilizing diode with silicon plastic package
08/29/2012CN202405247U Rapidly-recovered diode
08/29/2012CN202405246U Silicon plastic package rapid recovery diode
08/29/2012CN202405245U Novel double-interface smart card module
08/29/2012CN202405244U Plastic silicon small-power voltage stabilizing diode
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