Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/05/2012CN101950740B 半导体装置及其制造方法 Semiconductor device and manufacturing method
09/05/2012CN101937907B Chip stacking package structure and manufacture method thereof
09/05/2012CN101937905B Semiconductor encapsulating part and manufacture method thereof
09/05/2012CN101919049B Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
09/05/2012CN101881381B White light emitting diode and white light emitting diode lamp
09/05/2012CN101859690B Packaging structure, sealing compound module and sealing compound mold for packaging same
09/05/2012CN101853791B Manufacturing method and structure of flip chip package as well as structure of wafer coating
09/05/2012CN101851386B Epoxy resin compound
09/05/2012CN101847436B Magnetic multilayer film random memorizer based on vertical transistor
09/05/2012CN101827509B Phase-change energy accumulation and temperature control device of sealing equipment
09/05/2012CN101826514B Compact type electric inductance power electronic device encapsulation
09/05/2012CN101807662B Thermoelectric element, manufacturing method thereof, chip stack structure and chip encapsulating structure
09/05/2012CN101794755B Heat pipe with flat end face
09/05/2012CN101794716B 半导体装置及其制造方法 Semiconductor device and manufacturing method
09/05/2012CN101765639B Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
09/05/2012CN101679629B Benzoxazine-formulations with reduced outgassing behaviour
09/05/2012CN101668404B Microfluid conveying and atomizing device
09/05/2012CN101656238B Advanced quad flat non-leaded package structure and manufacturing method thereof
09/05/2012CN101626012B Long-term annealed integrated circuit arrangements and method for producing the same
09/05/2012CN101611491B Printed board unit and semiconductor package
09/05/2012CN101608052B Conductive die-bonding agent for LED (light emitting diode)
09/05/2012CN101605446B Radiating device
09/05/2012CN101598282B Led路灯 Led lights
09/05/2012CN101568247B Shielding insulating radiating system
09/05/2012CN101536624B Mounting structure for power module and motor control device having the same
09/05/2012CN101533828B Semiconductor device and method for fabricating the same
09/05/2012CN101510515B Circuit board, manufacturing method thereof and chip packaging structure
09/05/2012CN101505166B Audio encoding and decoding module for mobile terminal
09/05/2012CN101501830B Method for producing an electric functional layer on a surface of a substrate
09/05/2012CN101499488B Semiconductor devices and methods of fabricating the same
09/05/2012CN101499472B Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus
09/05/2012CN101498432B Heat radiation die set
09/05/2012CN101494215B semiconductor device with high reliability and manufacturing method thereof
09/05/2012CN101467248B Heat dissipating wiring board and method for manufacturing same
09/05/2012CN101442057B Semiconductor device,its manufacturing method and electronic apparatus
09/05/2012CN101436587B Semiconductor module and image pickup apparatus
09/05/2012CN101436571B Electrical device and method
09/05/2012CN101409268B Bond pad design for fine pitch wire bonding
09/05/2012CN101405219B Silica powder and use thereof
09/05/2012CN101404276B Light emitting module and method for manufacturing the same
09/05/2012CN101207114B Semiconductor device and manufacturing method of the same
09/05/2012CN101083270B Array substrate and display panel having the same
09/04/2012US8261367 Method and device for protection of an MRAM device against tampering
09/04/2012US8260392 Analyte monitoring device and methods of use
09/04/2012US8259454 Interconnect structure including hybrid frame panel
09/04/2012US8259451 Metal injection molded heat dissipation device
09/04/2012US8258810 3D semiconductor device
09/04/2012US8258805 Test device and semiconductor integrated circuit device
09/04/2012US8258637 Bonding structure and method for manufacturing same
09/04/2012US8258636 High refractive index curable liquid light emitting diode encapsulant formulation
09/04/2012US8258635 Implantable microelectronic device and method of manufacture
09/04/2012US8258634 Contact pad array
09/04/2012US8258633 Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
09/04/2012US8258632 Optically-initiated silicon carbide high voltage switch with contoured-profile electrode interfaces
09/04/2012US8258631 Pad layout structure of semiconductor chip
09/04/2012US8258630 Semiconductor device and method of manufacturing the same
09/04/2012US8258629 Curing low-k dielectrics for improving mechanical strength
09/04/2012US8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels
09/04/2012US8258627 Group II element alloys for protecting metal interconnects
09/04/2012US8258626 Copper interconnection, method for forming copper interconnection structure, and semiconductor device
09/04/2012US8258625 Semiconductor device
09/04/2012US8258624 Method for fabricating a semiconductor and semiconductor package
09/04/2012US8258623 Circuit layout of circuit substrate, light source module and circuit substrate
09/04/2012US8258622 Power device package and semiconductor package mold for fabricating the same
09/04/2012US8258621 Semiconductor device
09/04/2012US8258620 Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module
09/04/2012US8258619 Integrated circuit die stacks with translationally compatible vias
09/04/2012US8258618 Power semiconductor module
09/04/2012US8258617 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
09/04/2012US8258616 Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads
09/04/2012US8258615 Semiconductor device and fabricating method thereof
09/04/2012US8258614 Integrated circuit package system with package integration
09/04/2012US8258613 Semiconductor memory card
09/04/2012US8258612 Encapsulant interposer system with integrated passive devices and manufacturing method therefor
09/04/2012US8258611 Leadframe structure for electronic packages
09/04/2012US8258609 Integrated circuit package system with lead support
09/04/2012US8258607 Apparatus and method for providing bypass capacitance and power routing in QFP package
09/04/2012US8258606 High frequency flip chip package structure of polymer substrate
09/04/2012US8258605 Semiconductor device
09/04/2012US8258604 Semiconductor device and method of manufacturing same
09/04/2012US8258599 Electronics package with an integrated circuit device having post wafer fabrication integrated passive components
09/04/2012US8258583 Conductive channel pseudo block process and circuit to inhibit reverse engineering
09/04/2012US8258575 Isolated drain-centric lateral MOSFET
09/04/2012US8258515 Contact structure and semiconductor device
09/04/2012US8258509 Micro vacuum gauge
09/04/2012US8258015 Integrated circuit package system with penetrable film adhesive
09/04/2012US8258014 Method of manufacturing a power transistor module and package with integrated bus bar
09/04/2012US8258013 Integrated circuit assembly having vented heat-spreader
09/04/2012US8258012 Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
09/04/2012US8258005 Method of making a semiconductor device having a conductive particle on an electric pad
09/04/2012US8256660 Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
09/04/2012US8256499 Heat dissipation device having fan holder for attachment of a fan
09/04/2012DE202011105836U1 Montageplatte aus Aluminium für Wärme erzeugende Elemente Aluminum mounting plate for heat generating elements
08/2012
08/30/2012WO2012116218A2 Semiconductor packages with agglomerate terminals
08/30/2012WO2012116157A2 Chip module embedded in pcb substrate
08/30/2012WO2012116107A1 A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
08/30/2012WO2012115333A1 Substrate having penetrating structure and manufacturing method thereof, package device including substrate having penetrating structure and manufacturing method thereof
08/30/2012WO2012115065A1 Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component
08/30/2012WO2012115011A1 Moistureproof insulation material
08/30/2012WO2012114955A1 Heat sink and method for using heat sink
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