Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/06/2012DE112009004978T5 Leistungshalbleitervorrichtung Power semiconductor device
09/06/2012DE102012202421A1 Microelectromechanical systems transducer device mounted to circuit board comprises package substrate having first coefficient of thermal expansion, and transducer substrate comprising transducer and disposed over package substrate
09/06/2012DE102011086730A1 Verfahren zum Markieren eines SiC-Halbleiterwafers und SiC-Halbleiterwafer A method for marking a SiC semiconductor wafer and the SiC semiconductor wafer
09/06/2012DE102011004921A1 Halbleiterbauelement mit einer Chipumrandung mit einer integrierten Justiermarke A semiconductor device comprising a chip having an integrated border alignment mark
09/05/2012EP2496061A1 Circuit board, and semiconductor device having component mounted on circuit board
09/05/2012EP2495760A2 Thermal spreader with phase change thermal capacitor for electrical cooling
09/05/2012EP2494655A1 Antenna arrangement for transmitting signals
09/05/2012EP2494598A1 High impedance electrical connection via
09/05/2012EP2494570A1 Method and device for cooling a jacketed medium-voltage electrical installation
09/05/2012EP2494568A1 Device for cooling a medium-voltage apparatus using heat pipes under voltage
09/05/2012EP2494567A1 Device for cooling a medium-voltage apparatus using insulated heat pipes
09/05/2012EP2494263A1 Array of scalable ceramic diode carriers having leds
09/05/2012EP1791180B1 Semiconductor device
09/05/2012DE202012007677U1 Basisplatte für ein Kühlelement Base plate for a cooling element
09/05/2012CN202425271U Improved structure of fixed seat of heat pipe
09/05/2012CN202424864U Image pick-up device
09/05/2012CN202424567U Inverter module
09/05/2012CN202424509U Packaging structure of minitype power module
09/05/2012CN202423280U Serial-diode high voltage rectifying bridge arm with radiating device
09/05/2012CN202423279U Packaging structure for multi-chip wafer-level semiconductor
09/05/2012CN202423278U Semiconductor chip stacking structure
09/05/2012CN202423277U Stacking packaging integrated circuit device
09/05/2012CN202423276U Static protector for field effect component
09/05/2012CN202423275U Static electricity protector for surface mount component
09/05/2012CN202423274U Static protector of double-row straight-plug component
09/05/2012CN202423273U Film coating substrate and film coating equipment
09/05/2012CN202423272U Surface wiring structure of chip
09/05/2012CN202423271U Integrated circuit on-chip inductor structure with multiple substrate shielding layers
09/05/2012CN202423270U Integrated circuit lead frame
09/05/2012CN202423269U Novel chip packaging structure
09/05/2012CN202423268U TO-220 frame with flow guide columns
09/05/2012CN202423267U Lead frame
09/05/2012CN202423266U IDF-type large-matrix SOP14 (small outline package 14) lead frame structure
09/05/2012CN202423265U Lead wire framework and lead wire framework for discrete packaging
09/05/2012CN202423264U Columnar protruding block routing structure of semiconductor chip
09/05/2012CN202423263U Semiconductor member, device, and telephone equipped with heat dissipation apparatus
09/05/2012CN202423262U Chip-level three-dimensional flexible packaging structure based on curled copper wire
09/05/2012CN202423261U Chip-level three-dimensional flexible packaging structure based on sawtooth type copper wiring
09/05/2012CN202423260U Chip-scale three-dimensional flexible packaging structure based on S-shaped copper metallization
09/05/2012CN202423259U Packaged semiconductor chip and optical device
09/05/2012CN202423258U Silicon-controlled radiator
09/05/2012CN202423257U Copper-carbon composite heat conducting plate
09/05/2012CN202423256U CPU (central processing unit) radiator
09/05/2012CN202423255U Wafer circuit element with heat conduction layer
09/05/2012CN202423254U Reinforced rectifier diode
09/05/2012CN202423253U Modular integrated circuit package structure with metal shielding function
09/05/2012CN202423252U High-power three-phase rectifier bridge
09/05/2012CN202423251U Film base plate
09/05/2012CN202423250U Multi-chip mixed structure
09/05/2012CN202421986U Display card cooling device
09/05/2012CN1901181B Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/05/2012CN1877837B 蜂窝电话及数码照相机 Cellular phones and digital cameras
09/05/2012CN102656961A Electronic control device
09/05/2012CN102656955A A method of manufacturing substrates having asymmetric buildup layers
09/05/2012CN102656687A Via structure integrated in electronic substrate
09/05/2012CN102656686A Recessed and embedded die coreless package
09/05/2012CN102656685A Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
09/05/2012CN102656684A Semiconductor device and method of producing same
09/05/2012CN102656674A Method for producing electronic device, electronic device, method for producing electronic device package, and electronic device package
09/05/2012CN102656654A Device for cooling a medium-voltage apparatus using heat pipes under voltage
09/05/2012CN102656653A Device for cooling a medium-voltage apparatus using insulated heat pipes
09/05/2012CN102655732A Power module substrate with heat radiation structure
09/05/2012CN102655730A Heat dissipation device
09/05/2012CN102655710A Power module DBC (Direct Bonding Copper) board with heat radiation structure
09/05/2012CN102655173A Thin film transistor, manufacturing method of same, and display device
09/05/2012CN102655151A Semiconductor device comprising capacitor and double-layered metal contact and method for fabricating the same
09/05/2012CN102655144A TFT (thin film transistor) array substrate, manufacturing method for same, and liquid crystal displayer
09/05/2012CN102655143A Vibrating device, method for manufacturing vibrating device, and electronic apparatus
09/05/2012CN102655140A Multi-die package
09/05/2012CN102655139A Variable inductor
09/05/2012CN102655138A Semiconductor device comprising a die seal having an integrated alignment mark
09/05/2012CN102655137A Electromigration test structure
09/05/2012CN102655136A Semiconductor chip and method for manufacturing the same
09/05/2012CN102655135A Active matrix substrate
09/05/2012CN102655134A Power semiconductor device package and fabrication method
09/05/2012CN102655133A Chip packaging component and manufacturing method for same
09/05/2012CN102655132A Semiconductor device and fabrication method thereof
09/05/2012CN102655131A Electrode array and production method for electrode array
09/05/2012CN102655130A Compressor type chip temperature reducing system
09/05/2012CN102655129A Miniature-channel liquid cooling substrate of integrated power electronics module with the moire fringe effect
09/05/2012CN102655128A Porous graphite radiator and preparation method of porous graphite
09/05/2012CN102655127A Chip protecting structure and forming method
09/05/2012CN102655126A Power module, substrate provided with heat radiator and used for power module and manufacturing method of substrate
09/05/2012CN102655125A Structure of two-sided sputtering metal layer for reducing warpage of silicon wafer
09/05/2012CN102655114A Manufacturing method for TFT-LCD (thin film transistor-liquid crystal display) array substrate, as well as array substrate and related devices thereof
09/05/2012CN102655109A 裸片拾取装置 Die pickup
09/05/2012CN102655097A Semiconductor packaging structure and manufacturing method thereof
09/05/2012CN102654704A Display device and production method thereof
09/05/2012CN102653035A Method of marking sic semiconductor wafer and sic semiconductor wafer
09/05/2012CN102161815B Epoxy resin composition and semiconductor device using thereof
09/05/2012CN102130068B Alloy-type bonding wire with composite plating on surface
09/05/2012CN102117795B Electrode lead-out structure in insulation process
09/05/2012CN102117794B Electrode lead-out structure in STI process
09/05/2012CN102074550B Chip for measuring ohmic contact degradation of semiconductor device and method
09/05/2012CN102034768B Embedded-dice-inside type substrate structure with redistribution layer covered on both side and method thereof
09/05/2012CN102013418B Novel PCB (Printed Circuit Board) carrier tape for SIM card package
09/05/2012CN101971331B Structure and method for forming power devices with carbon-containing region
09/05/2012CN101958303B Double-side graph chip forward single package structure and package method thereof
09/05/2012CN101958261B Semiconductor process and stackable semiconductor device packages
09/05/2012CN101950744B Semiconductor device
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