Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/12/2012CN101527310B Solid-state image sensing apparatus and package of same
09/12/2012CN101339911B Mounted semiconductor device and a method for making the same
09/12/2012CN101290914B Semiconductor device and method for manufacturing the same
09/11/2012US8265726 Analyte monitoring device and methods of use
09/11/2012US8265432 Optical transceiver module with optical windows
09/11/2012US8264849 Mold compounds in improved embedded-die coreless substrates, and processes of forming same
09/11/2012US8264618 Remote control apparatus
09/11/2012US8264092 Integrated circuits on a wafer and method of producing integrated circuits
09/11/2012US8264091 Integrated circuit packaging system with encapsulated via and method of manufacture thereof
09/11/2012US8264090 Semiconductor device including offset bonding pad and inspection method therefor
09/11/2012US8264088 Planarized passivation layer for semiconductor devices
09/11/2012US8264087 Semiconductor package for discharging heat and method for fabricating the same
09/11/2012US8264086 Via structure with improved reliability
09/11/2012US8264085 Semiconductor device package interconnections
09/11/2012US8264084 Solder-top enhanced semiconductor device for low parasitic impedance packaging
09/11/2012US8264083 Semiconductor device and semiconductor device manufacturing method
09/11/2012US8264082 Semiconductor devices with low resistance back-side coupling
09/11/2012US8264081 Multilayered barrier metal thin-films
09/11/2012US8264080 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
09/11/2012US8264079 Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
09/11/2012US8264078 Metal wiring structures for uniform current density in C4 balls
09/11/2012US8264077 Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips
09/11/2012US8264076 Power type LED
09/11/2012US8264075 Stacked-die package including substrate-ground coupling
09/11/2012US8264074 Device for use as dual-sided sensor package
09/11/2012US8264073 Multi-phase voltage regulation module
09/11/2012US8264072 Electronic device
09/11/2012US8264071 Power semiconductor module with overcurrent protective device
09/11/2012US8264070 Package structure with ESD and EMI preventing functions
09/11/2012US8264067 Through silicon via (TSV) wire bond architecture
09/11/2012US8264065 ESD/antenna diodes for through-silicon vias
09/11/2012US8264063 Capacitive element, method of manufacture of the same, and semiconductor device
09/11/2012US8264055 CMOS thermoelectric refrigerator
09/11/2012US8264054 MEMS device having electrothermal actuation and release and method for fabricating
09/11/2012US8264043 Protection of integrated circuit gates during metallization processes
09/11/2012US8264037 Semiconductor device and method of manufacturing semiconductor device
09/11/2012US8264011 Semiconductor device
09/11/2012US8263969 Laminated structure and image display device
09/11/2012US8263871 Mount board and semiconductor module
09/11/2012US8263843 Graphene nanoplatelet metal matrix
09/11/2012US8263492 Through substrate vias
09/11/2012US8263491 Substrate with feedthrough and method for producing the same
09/11/2012US8263438 Method for connecting a die assembly to a substrate in an integrated circuit
09/11/2012US8262970 Semiconductor device and method of manufacturing thereof
09/11/2012US8262898 Nanotube position controlling method, nanotube position controlling flow path pattern and electronic element using nanotube
09/11/2012CA2374143C Substrate for power electronic circuit and power electronic module using such substrate
09/07/2012WO2012119011A1 Liquid displacer in led bulbs
09/07/2012WO2012118896A2 Apparatus and methods related to wire bond pads and reducing impact of high rf loss plating
09/07/2012WO2012118668A1 Power routing in standard cells
09/07/2012WO2012118297A2 Cooling apparatus in which a heat pipe and heat sink are coupled, and the structure of which enables improved productivity
09/07/2012WO2012118094A1 Forging method
09/07/2012WO2012118039A1 Al alloy film for display devices or semiconductor devices, display device or semiconductor device equipped with al alloy film, and sputtering target
09/07/2012WO2012117978A1 Airtight member and method for producing same
09/07/2012WO2012117929A1 Epoxy silicone resin and hardening resin composition using same
09/07/2012WO2012117899A1 Transmission control device and electronic circuit device
09/07/2012WO2012117894A1 Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus
09/07/2012WO2012117853A1 Copper-titanium alloy sputtering target, semiconductor wiring line formed using the sputtering target, and semiconductor element and device each equipped with the semiconductor wiring line
09/07/2012WO2012117822A1 Heat-curable silicone resin composition for optical-semiconductor encapsulation and optical-semiconductor package formed using same
09/07/2012WO2012117692A1 Electrode substrate and display device and touch panel comprising same
09/07/2012WO2012117640A1 Semiconductor device and method of manufacturing semiconductor device
09/07/2012WO2012116470A1 Miniature surface mount device
09/07/2012WO2012087475A3 Substrate with embedded stacked through-silicon via die
09/07/2012WO2012083110A3 Ic device having electromigration resistant feed line structures
09/07/2012WO2012072212A3 Electronic device, method for producing the latter, and printed circuit board comprising electronic device
09/07/2012WO2012070915A3 Encapsulation composition and photovoltaic module
09/07/2012CA2828546A1 Liquid displacer in led bulbs
09/06/2012US20120223445 Semiconductor device comprising a die seal having an integrated alignment mark
09/06/2012US20120223444 Semiconductor device and method for manufacturing the same
09/06/2012US20120223443 Active matrix substrate
09/06/2012US20120223442 Method for Manufacturing an Electronic Device
09/06/2012US20120223441 Stacked semiconductor device and manufacturing method thereof
09/06/2012US20120223440 Method of manufacturing three-dimensional integrated circuit and three-dimensional integrated circuit apparatus
09/06/2012US20120223439 Two-track cross-connect in double-patterned structure using rectangular via
09/06/2012US20120223438 Semiconductor device and method of manufacturing the same
09/06/2012US20120223437 Semiconductor Device Comprising Metallization Layers of Reduced Interlayer Capacitance by Reducing the Amount of Etch Stop Materials
09/06/2012US20120223436 Semiconductor device and structure for heat removal
09/06/2012US20120223435 Integrated circuit packaging system with leads and method of manufacture thereof
09/06/2012US20120223434 Co-axial restraint for connectors within flip-chip packages
09/06/2012US20120223433 Semiconductor package including connecting member having controlled content ratio of gold
09/06/2012US20120223432 Moisture barrier for a wire bond
09/06/2012US20120223431 Through-silicon via and method for forming the same
09/06/2012US20120223430 Solder ball for semiconductor packaging and electronic member using the same
09/06/2012US20120223429 Package 3D Interconnection and Method of Making Same
09/06/2012US20120223428 Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Semiconductor Die and Substrate
09/06/2012US20120223427 Flip chip package
09/06/2012US20120223426 Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
09/06/2012US20120223425 Semiconductor device and fabrication method thereof
09/06/2012US20120223424 Semiconductor component and production method
09/06/2012US20120223423 Lead Frame Strip with Rails Having Bow Reducing Ribs
09/06/2012US20120223418 Solution processible hardmasks for high resolution lithography
09/06/2012US20120223377 Semiconductor memory device including multi-layer gate structure
09/06/2012US20120223369 Gated Bipolar Junction Transistors, Memory Arrays, and Methods of Forming Gated Bipolar Junction Transistors
09/06/2012US20120223368 Power Routing in Standard Cells
09/06/2012US20120223325 Microelecronic assembly with an embedded waveguide adapter and method for forming the same
09/06/2012US20120223309 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
09/06/2012US20120223032 Solar panel mounting system
09/06/2012US20120222290 Method and system for preparing wireless communication chips for later processing
09/06/2012DE202012007480U1 Aktive Kühlung von Computer CPU über isolierten Kühlkörper mittels Peltier-Element Active cooling of computer CPU heatsink isolated using Peltier element
09/06/2012DE202011110024U1 Weisslichtgerät White light unit
09/06/2012DE112010003578T5 Elektronische Bauteil-Submounts mit thermisch leitfähigen Durchführungen undlichtemittierende Bauteile mit denselben Electronic Component submounts with thermally conductive penetrations undlichtemittierende components having the same
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