Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/13/2012US20120228762 Semiconductor device and manufacturing method of the same
09/13/2012US20120228761 Semiconductor device and method for manufacturing the same
09/13/2012US20120228760 Systems including an i/o stack and methods for fabricating such systems
09/13/2012US20120228759 Semiconductor package having interconnection of dual parallel wires
09/13/2012US20120228758 Electron beam induced deposition of interface to carbon nanotube
09/13/2012US20120228757 Cooling structure of semiconductor device
09/13/2012US20120228756 Semiconductor housing and method for the production of a semiconductor housing
09/13/2012US20120228755 Semiconductor module and manufacturing method thereof
09/13/2012US20120228754 Chip-last embedded interconnect structures and methods of making the same
09/13/2012US20120228753 Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof
09/13/2012US20120228752 Chip package and method for forming the same
09/13/2012US20120228751 Semiconductor package and method of manufacturing the same
09/13/2012US20120228750 Semiconductor device and method for manufacturing semiconductor device
09/13/2012US20120228749 Semiconductor device and method of forming shielding layer over semiconductor die mounted to tsv interposer
09/13/2012US20120228748 Passivation layer surface topography modifications for improved integrity in packaged assemblies
09/13/2012US20120228746 Semiconductor device, fabrication process, and electronic device
09/13/2012US20120228735 Fuse patterns and method of manufacturing the same
09/13/2012US20120228724 Non-Volatile Anti-Fuse With Consistent Rupture
09/13/2012US20120228718 Method of forming an electrical fuse and a metal gate transistor and the related electrical fuse
09/13/2012US20120228620 Thin film transistor array panel for a liquid crystal display
09/13/2012US20120228610 Display Panel
09/13/2012US20120227942 Flow guide structure and thermal module thereof
09/13/2012DE202012007986U1 Wärmeleitpad Thermal pad
09/13/2012DE112010004347T5 Tunnelübergangs-Durchkontaktierung Tunnel junction via hole
09/13/2012DE112010001560T5 GaN-FLI P-CHIP-Leistungstransistor mit elektrisch isolierter Rückseite GaN-FLI P-CHIP-power transistor electrically insulated back
09/13/2012DE112009002414T5 Ankerstift-Leiterrahmen Anchor pin lead frame
09/13/2012DE102012201080A1 Leistungsmodul Power module
09/13/2012DE102011016566A1 Leiterrahmen für optoelektronische Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente Lead frame for optoelectronic devices and methods for producing optoelectronic devices
09/13/2012DE102011013468A1 Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses Semiconductor package and method for manufacturing a semiconductor package
09/13/2012DE102011013278A1 Housing for receiving optoelectronic functional element e.g. LED for illumination device, has base element with channel in which connector is arranged, where channel is filled with glass in order to connect base element with connector
09/13/2012DE102011013277A1 Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System" Housing for high power light emitting diodes - "2-layer system"
09/13/2012DE102011013276A1 Housing for electronic component e.g. LED used in lighting device, has glass layer that is arranged between the head section and base, and is made of alkali-titanium silicate glass
09/13/2012DE102011013228A1 Method for manufacturing semiconductor component that is three-dimensionally integrated in semiconductor chip stack, involves selectively removing upper stop layer with respect to lower stop layer
09/13/2012DE102008048424B4 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation
09/13/2012DE102008000261B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
09/13/2012DE102007046021B4 Halbleiteranordnung, Halbleitermodul und Verfahren zum Verbinden eines Halbleiterchips mit einem Keramiksubstrat A semiconductor device, semiconductor module and method for connecting a semiconductor chip to a ceramic substrate
09/13/2012DE102007006212B4 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs
09/13/2012DE102006015112B4 Halbleitervorrichtung und elektrisches Leistungshalbleiterprodukt Semiconductor device and electric power semiconductor product
09/13/2012CA2829348A1 Tilt monitor and stress controller for absorption type refrigerator
09/12/2012EP2498290A1 Contact element and power semiconductor module comprising a contact element
09/12/2012EP2498289A2 IGBT power semiconductor package having an electrically conductive clip
09/12/2012EP2498288A2 Circuit board using heat radiating member, electronic module and method for manufacturing the module
09/12/2012EP2498287A2 Method for making vertical interconnections through structured layers
09/12/2012EP2498283A2 Method for manufacturing a power-semiconductor substrate
09/12/2012EP2497109A2 Package configurations for low emi circuits
09/12/2012DE202012102888U1 Kühler mit einem Wärmerohrschutz Cooler with heat pipe protection
09/12/2012CN202434518U Novel high power module
09/12/2012CN202434509U Stackable semiconductor chip packaging structure
09/12/2012CN202434508U Semiconductor chip stacking and encapsulating structure
09/12/2012CN202434507U High-reliability high-power insulated gate bipolar transistor module
09/12/2012CN202434506U Metal connecting structure of pressure points of medium-large power semiconductor devices
09/12/2012CN202434505U Photoelectricity chip assembly
09/12/2012CN202434504U Novel lead frame ball bonding device
09/12/2012CN202434503U DIP10 integrated circuit device and lead frame, and lead frame matrix
09/12/2012CN202434502U Pressure point metal wire structure with power electronic device
09/12/2012CN202434501U TSV packaging structure for semiconductor chip
09/12/2012CN202434500U Radiator
09/12/2012CN202434499U CPU (Central Processing Unit) radiator
09/12/2012CN202434498U Semiconductor device radiator with fixing device
09/12/2012CN202434497U CPU (Central Processing Unit) cooling device
09/12/2012CN202434496U Radiator
09/12/2012CN202434495U Bracket box for solar photovoltaic junction box
09/12/2012CN202434494U Packaging structure
09/12/2012CN202434493U Circuit encapsulation structure
09/12/2012CN202434492U Novel chip capable of distinguishing color of carbon powder or ink
09/12/2012CN202433828U CPU (central processing unit) cooler
09/12/2012CN202432669U Instant electromagnetic water heater
09/12/2012CN102668734A 电路模块 Circuit module
09/12/2012CN102668728A Through-wired substrate and manufacturing method therefor
09/12/2012CN102668271A Wiring connection method and functional device
09/12/2012CN102668108A Assemblies comprising a polyimide film and an electrode, and methods relating thereto
09/12/2012CN102668075A Semiconductor chip device with solder diffusion protection
09/12/2012CN102668073A System to improve coreless package connections and associated methods
09/12/2012CN102668072A Devices with crack stops
09/12/2012CN102668071A Semiconductor apparatus
09/12/2012CN102668070A Electronic device for switching currents and method for producing the same
09/12/2012CN102668069A A routing layer for mitigating stress in a semiconductor die
09/12/2012CN102668068A Glass core substrate for integrated circuit devices and methods of making the same
09/12/2012CN102668067A Patch on interposer assembly and structures formed thereby
09/12/2012CN102668066A Heat dissipating device and method for manufacturing heat dissipating device
09/12/2012CN102668065A Production method for electronic device, electronic device, production method for electronic device package, and electronic device package
09/12/2012CN102668053A Circuit device comprising a semiconductor component
09/12/2012CN102668047A Semiconductor device
09/12/2012CN102667597A Active matrix substrate and display device
09/12/2012CN102666724A Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition
09/12/2012CN102666642A Resin composition for semiconductor encapsulation and semiconductor device using the resin composition
09/12/2012CN102664177A Power semiconductor module adopting double-sided cooling
09/12/2012CN102664176A Carrier tape
09/12/2012CN102664175A Multi-chip packaging structure of power conversion chip
09/12/2012CN102664174A Semiconductor packaging structure
09/12/2012CN102664173A Lead structure for semiconductor device and method for manufacturing lead structure
09/12/2012CN102664172A Power module packaging structure
09/12/2012CN102664171A Three-dimensional grid-type chip heat conduction model based on carbon nano tube
09/12/2012CN102664170A Semiconductor package structure and manufacturing method thereof
09/12/2012CN102664155A Manufacturing method for aluminum welded pad and manufacturing method for integrated circuits
09/12/2012CN102660027A Polysiloxane curing agent
09/12/2012CN102659827A Cyanate monomer, microporous cyanate resin, preparation methods of cyanate monomer and microporous cyanate resin, and application of cyanate monomer and microporous cyanate resin
09/12/2012CN101859765B Protective device for integrated circuit
09/12/2012CN101802049B Inclusion complex containing epoxy resin composition for semiconductor encapsulation
09/12/2012CN101546737B Package structure of compound semiconductor component and manufacturing method thereof
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