Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/18/2012US8269358 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element
09/18/2012US8269357 Microelectronic assembly with impedance controlled wirebond and conductive reference element
09/18/2012US8269356 Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
09/18/2012US8269355 Flexible contactless wire bonding structure and methodology for semiconductor device
09/18/2012US8269354 Semiconductor package substrate structure and manufacturing method thereof
09/18/2012US8269353 Semiconductor device having a plurality of adhesion area patterns and one or more non-adhesion area patterns
09/18/2012US8269352 Multi-chip stack package structure
09/18/2012US8269351 Multi-chip stack package structure
09/18/2012US8269350 Reducing the switching noise on substrate with high grounding resistance
09/18/2012US8269349 Semiconductor device
09/18/2012US8269348 IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch
09/18/2012US8269347 Semiconductor chip, electrode structure therefor and method for forming same
09/18/2012US8269346 Semiconductor device and method of designing a wiring of a semiconductor device
09/18/2012US8269345 Bump I/O contact for semiconductor device
09/18/2012US8269344 Method and system for inter-chip communication via integrated circuit package waveguides
09/18/2012US8269343 Semiconductor device including a pressure-contact section
09/18/2012US8269342 Semiconductor packages including heat slugs
09/18/2012US8269341 Cooling structures and methods
09/18/2012US8269340 Curvilinear heat spreader/lid with improved heat dissipation
09/18/2012US8269339 Underfill film having thermally conductive sheet
09/18/2012US8269338 Semiconductor device having improved heat dissipation capabilities
09/18/2012US8269337 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
09/18/2012US8269336 Semiconductor chip assembly with post/base heat spreader and signal post
09/18/2012US8269335 Multilayer semiconductor device and electronic equipment
09/18/2012US8269334 Multichip package leadframe including electrical bussing
09/18/2012US8269333 Combined power mesh transition and signal overpass/underpass
09/18/2012US8269332 Semiconductor element mounting board
09/18/2012US8269330 MOSFET pair with stack capacitor and manufacturing method thereof
09/18/2012US8269329 Multi-chip package
09/18/2012US8269328 Stacked die package for peripheral and center device pad layout device
09/18/2012US8269327 Vertical system integration
09/18/2012US8269326 Semiconductor device assemblies
09/18/2012US8269325 Semiconductor storage device and manufacturing method thereof
09/18/2012US8269324 Integrated circuit package system with chip on lead
09/18/2012US8269323 Integrated circuit package with etched leadframe for package-on-package interconnects
09/18/2012US8269322 Tape wiring substrate and tape package using the same
09/18/2012US8269321 Low cost lead frame package and method for forming same
09/18/2012US8269320 Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
09/18/2012US8269319 Collective and synergistic MRAM shields
09/18/2012US8269318 MOS device
09/18/2012US8269317 Phosphorescent materials
09/18/2012US8269315 Semiconductor device and method of manufacturing semiconductor device
09/18/2012US8269309 Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same
09/18/2012US8269280 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
09/18/2012US8269248 Light emitting assemblies and portions thereof
09/18/2012US8269233 Vertical ACLED structure
09/18/2012US8269213 Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same
09/18/2012US8268715 Multi-component integrated circuit contacts
09/18/2012US8268673 Stacked electronic component and manufacturing method thereof
09/18/2012US8268671 Semiconductor system-in-package and methods for making the same
09/18/2012US8268670 Method of semiconductor device protection
09/18/2012US8268668 Destructor integrated circuit chip, interposer electronic device and methods
09/18/2012US8268403 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
09/18/2012US8268209 Pattern forming method and its mold
09/17/2012DE202012102754U1 Kühlkörper mit eingebautem Lüfter Heat sink with built-in fan
09/13/2012WO2012122390A2 Tilt monitor and stress controller for absorption type refrigerator
09/13/2012WO2012121545A2 Method for fixing electronic components
09/13/2012WO2012121377A1 Semiconductor device, and process for manufacturing semiconductor device
09/13/2012WO2012121373A1 Method for producing package substrate for mounting semiconductor element, package substrate for mounting semiconductor element, and semiconductor package
09/13/2012WO2012121336A1 Adhesive for electronic components, and manufacturing method for semiconductor chip mount
09/13/2012WO2012121255A1 Semiconductor device
09/13/2012WO2012121164A1 Resin composition for printed circuit board
09/13/2012WO2012121109A1 Cu-Ni-Si BASED ALLOY AND PROCESS FOR MANUFACTURING SAME
09/13/2012WO2012120968A1 Electronic component
09/13/2012WO2012120930A1 Device mounting structure of semiconductor device
09/13/2012WO2012120911A1 Heat-dissipation structure, processing circuit provided with heat-dissipation structure, and electronic apparatus
09/13/2012WO2012120694A1 Method of manufacturing wafer level package and wafer level package
09/13/2012WO2012120672A1 Cooler
09/13/2012WO2012120659A1 Method for manufacturing semiconductor device
09/13/2012WO2012120594A1 Semiconductor module and semiconductor module manufacturing method
09/13/2012WO2012120568A1 Semiconductor device
09/13/2012WO2012120245A1 Connection component provided with hollow inserts
09/13/2012WO2012119813A1 Lead frame for optoelectronic components and method for producing optoelectronic components
09/13/2012WO2012119333A1 Through-silicon-via (tsv) structure and its fabricating method
09/13/2012WO2012119292A1 Cover tape, component package, and method of making the same
09/13/2012WO2012028144A3 A cooling device with at least two coolant flow modules
09/13/2012US20120229807 Mark structure and method for measuring alignment accuracy between former layer and latter layer
09/13/2012US20120229176 Integrated Semiconductor Device
09/13/2012US20120228784 Semiconductor device
09/13/2012US20120228783 Mixed wire bonding profile and pad-layout configurations in ic packaging processes for high-speed electronic devices
09/13/2012US20120228782 Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device package
09/13/2012US20120228781 Stacked semiconductor component having through wire interconnect (twi) with compressed wire
09/13/2012US20120228780 Semiconductor device and method of manufacturing the same
09/13/2012US20120228779 Air-gap c4 fluidic i/o interconnects and methods of fabricating same
09/13/2012US20120228778 Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
09/13/2012US20120228777 Through silicon via guard ring
09/13/2012US20120228776 Semiconductor device
09/13/2012US20120228775 Airgap-containing interconnect structure with patternable low-k material and method of fabricating
09/13/2012US20120228774 Semiconductor device and method of manufacturing the same
09/13/2012US20120228773 Large-grain, low-resistivity tungsten on a conductive compound
09/13/2012US20120228772 Diode Array and Method for Producing a Diode Array
09/13/2012US20120228771 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration
09/13/2012US20120228770 Metal cap for back end of line (beol) interconnects, design structure and method of manufacture
09/13/2012US20120228769 Carrier-free semiconductor package and fabrication method thereof
09/13/2012US20120228768 Integrated circuit packaging system using b-stage polymer and method of manufacture thereof
09/13/2012US20120228767 Integrated circuit package system with stackable devices and a method of manufacture thereof
09/13/2012US20120228766 Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch
09/13/2012US20120228765 Solder bump interconnect
09/13/2012US20120228764 Package structure, fabricating method thereof, and package-on-package device thereby
09/13/2012US20120228763 Semiconductor device and manufacturing method thereof
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