Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/19/2012CN102683340A Area efficient arrangement of interface devices within an integrated circuit
09/19/2012CN102683331A Side-mounted controller and methods for making the same
09/19/2012CN102683330A Semiconductor device and manufacturing method of the same
09/19/2012CN102683329A Semiconductor package and method of fabricating the same
09/19/2012CN102683328A Electronic device, portable electronic terminal, and method of manufacturing electronic device
09/19/2012CN102683327A Sheet type circuit protector
09/19/2012CN102683326A Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof
09/19/2012CN102683325A Solar battery cell
09/19/2012CN102683324A Test structure for interconnected metal capacitors
09/19/2012CN102683323A Semiconductor device, fabrication process, and electronic device
09/19/2012CN102683322A Package-on-package (POP) packaging structure and manufacturing method thereof
09/19/2012CN102683321A Preventing the cracking of passivation layers on ultra-thick metals
09/19/2012CN102683320A Semiconductor device
09/19/2012CN102683319A Layout structure of metal-insulator-metal (MIM) capacitor with inter-metallic air isolation structure
09/19/2012CN102683318A Internal multilayer electrode connecting structure and connecting method for silicon capacitor
09/19/2012CN102683317A TO3PB lead frame
09/19/2012CN102683316A Semiconductor device and manufacture method thereof
09/19/2012CN102683315A Barrel-plating four-side pinless packaging structure and manufacturing method thereof
09/19/2012CN102683314A Diode connection device for photovoltaic wiring box
09/19/2012CN102683313A Semiconductor bond pad structure and integrated circuit
09/19/2012CN102683312A Semiconductor apparatus
09/19/2012CN102683311A Chip packaging body and formation method thereof
09/19/2012CN102683310A Power semiconductor device
09/19/2012CN102683309A Adapter plate for filling through holes by wafer-level re-balling printing and manufacturing method thereof
09/19/2012CN102683308A Through-silicon-vias structure and formation method thereof
09/19/2012CN102683307A CPU (Central Processing Unit) radiator with combined corner-tube type flat self-excited capillary heat pipe
09/19/2012CN102683306A Efficient microchannel evaporation cooling nozzle
09/19/2012CN102683305A Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces
09/19/2012CN102683304A 散热装置 Cooling devices
09/19/2012CN102683303A Semiconductor device
09/19/2012CN102683302A Radiating structure for single chip package and system-in-package
09/19/2012CN102683301A Semiconductor device including a base plate
09/19/2012CN102683300A Semiconductor housing and method for the production of semiconductor housing
09/19/2012CN102683299A Semiconductor device, resin sealing mould, device manufacturing method and lead frame
09/19/2012CN102683298A Carrier-free semiconductor package and fabrication method thereof
09/19/2012CN102683297A Encapsulating resin sheet and semiconductor device using same, and manufacturing method for semiconductor device
09/19/2012CN102683296A Reinforcement structure for flip-chip packaging
09/19/2012CN102683295A Carrier structure and manufacturing method thereof
09/19/2012CN102683279A Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
09/19/2012CN102683278A Chip separation method
09/19/2012CN102683275A Super-low dielectric constant (k) material thin film and preparation method thereof
09/19/2012CN102683270A Semiconductor device manufacturing method and semiconductor device
09/19/2012CN102683264A Method for manufacturing semiconductor structure
09/19/2012CN102683234A Manufacturing method of semiconductor device
09/19/2012CN102683230A Quad flat no-lead multi-circle-arranged integrated circuit (IC) chip packaging part and production method thereof
09/19/2012CN102683229A Packaging technology of video card packaging production line
09/19/2012CN102683228A Thermal enhanced package
09/19/2012CN102683227A Cooling fan and packaging method of electronic assembly of cooling fan
09/19/2012CN102683226A Wafer level package structure and manufacturing method thereof
09/19/2012CN102683223A Manufacturing method of semiconductor device, and semiconductor device
09/19/2012CN102683221A Semiconductor device and assembly method of semiconductor device
09/19/2012CN102683219A Surface processing layer structure and producing method thereof
09/19/2012CN102683181A Method for improving photoetching registration accuracy in germanium silicon technology
09/19/2012CN102683173A Method for reducing wafer arc discharge, and manufacturing method of integrated circuit
09/19/2012CN102682666A Electrooptic substrate, electrooptic device, and electronic apparatus
09/19/2012CN102681278A Array substrate, manufacture method thereof, display panel and display device
09/19/2012CN102679966A Sensor module, sensor device, method for producing sensor device, and electronic apparatus
09/19/2012CN102676113A Light-emitting diode (LED) packaging silica gel and preparation method thereof
09/19/2012CN102676105A High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof
09/19/2012CN102675881A High temperature resistant rubber base composite material used for chip packaging and application thereof
09/19/2012CN102675599A Method for manufacturing semiconductor device
09/19/2012CN102122671B Rear through-hole interconnected wafer level MOSFET (metal oxide semiconductor field effect transistor) packaging structure and implementation method
09/19/2012CN102005437B Electronic assembly for an image sensing device and wafer-level lens set
09/19/2012CN102005427B Printed circuit board strip and panel
09/19/2012CN101989582B Packaging substrate embedded with semiconductor chip
09/19/2012CN101958305B Double-side graph chip forward module package structure and package method thereof
09/19/2012CN101950742B 半导体装置 Semiconductor device
09/19/2012CN101924084B Packaged semiconductor piece and production method thereof
09/19/2012CN101894813B Semiconductor packaging structure and manufacture method thereof
09/19/2012CN101882606B Heat-dissipation semiconductor encapsulation structure and manufacturing method thereof
09/19/2012CN101865971B Method and structure for testing semiconductor field effect transistor
09/19/2012CN101775211B Polyimide film
09/19/2012CN101749570B LED light fitting and light engine thereof
09/19/2012CN101719513B 30V double-diffusion MOS device and 18V double-diffusion MOS device
09/19/2012CN101662915B Heat dissipating device
09/19/2012CN101646331B Radiating device
09/19/2012CN101621047B Framework for reducing far end crosstalk between signal circuits
09/19/2012CN101604677B Method and device for return loss techniques in wirebond packages for high-speed data communications
09/19/2012CN101583257B Fixing device combination
09/19/2012CN101582402B Circuit base plate
09/19/2012CN101566326B Illuminating device and light engine thereof
09/19/2012CN101562963B Heat radiation device
09/19/2012CN101561126B 照明装置 Lighting device
09/19/2012CN101556948B Semiconductor device, method for manufacturing semiconductor device and gas for plasma cvd
09/19/2012CN101529589B Bottom source ldmosfet structure and method
09/19/2012CN101522010B Heat dissipating device and manufacturing method thereof
09/19/2012CN101508882B Encapsulating material applied to LED and method of preparing the same
09/19/2012CN101505165B Audio encoding and decoding module for mobile terminal
09/19/2012CN101466235B Radiating device
09/19/2012CN101447464B Vacuum package and manufacturing process thereof
09/19/2012CN101415311B Radiating device
09/19/2012CN101408301B LED light fitting with heat radiating device
09/19/2012CN101389199B Heat Radiating device
09/19/2012CN101378041B Semiconductor device and substrate
09/18/2012USRE43674 Post passivation metal scheme for high-performance integrated circuit devices
09/18/2012USRE43663 Semiconductor device
09/18/2012US8271926 Semiconductor integrated circuit with multi-cut via and automated layout method for the same
09/18/2012US8270231 Configurable embedded processor
09/18/2012US8270178 Active device array substrate
09/18/2012US8269883 Solid image capture device and electronic device incorporating same
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