Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/20/2012WO2012123367A1 Thermally conductive film for cooling and fastening electronic components
09/20/2012WO2012122848A1 Microchannel cooler of integrated circuit chip and manufacturing method thereof
09/20/2012WO2012122712A1 Liquid-cooled led illuminating lamp
09/20/2012WO2012122619A1 Mems-based getter microdevice
09/20/2012WO2012082431A3 Forming die backside coating structures with coreless packages
09/20/2012WO2012079855A3 Electronic assembly comprising an improved sinter connection
09/20/2012US20120238833 Analyte Monitoring Device and Methods of Use
09/20/2012US20120238233 Wireless communication system
09/20/2012US20120235969 Thin film through-glass via and methods for forming same
09/20/2012US20120235751 Semiconductor device
09/20/2012US20120235310 Semiconductor packages
09/20/2012US20120235309 Semiconductor Package with Embedded Die and Manufacturing Methods Thereof
09/20/2012US20120235308 Manufacturing method of semiconductor device, and semiconductor device
09/20/2012US20120235307 Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
09/20/2012US20120235306 Virtually Substrate-less Composite Power Semiconductor Device
09/20/2012US20120235305 Semiconductor device and method of manufacturing the same
09/20/2012US20120235304 Ultraviolet (uv)-reflecting film for beol processing
09/20/2012US20120235303 Reinforcement structure for flip-chip packaging
09/20/2012US20120235302 Semiconductor device manufacturing method and semiconductor device
09/20/2012US20120235300 Semiconductor having a high aspect ratio via
09/20/2012US20120235299 Semiconductor device contact structures and methods for making the same
09/20/2012US20120235298 Electronic device and method for producing a device
09/20/2012US20120235297 Wafer level packaging of mems devices
09/20/2012US20120235296 Ic devices having tsvs including protruding tips having imc blocking tip ends
09/20/2012US20120235295 Barrier-metal-free copper damascene technology using enhanced reflow
09/20/2012US20120235294 Novel water-cooling radiator of thyristor
09/20/2012US20120235293 Semiconductor device including a base plate
09/20/2012US20120235292 Heat radiating component and semiconductor package having the same
09/20/2012US20120235291 Semiconductor apparatus and method for manufacturing the same
09/20/2012US20120235290 Power module for an automobile
09/20/2012US20120235289 Power device with bottom source electrode and preparation method
09/20/2012US20120235288 Semiconductor device and method of manufacturing same
09/20/2012US20120235287 High brightness and high contrast plastic leaded chip carrier led
09/20/2012US20120235286 Inserts for directing molding compound flow and semiconductor die assemblies
09/20/2012US20120235285 Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer
09/20/2012US20120235284 Film-like wafer mold material, molded wafer, and semiconductor device
09/20/2012US20120235282 Semiconductor device manufacturing method and semiconductor device
09/20/2012US20120235278 Semiconductor integrated circuit device, method of manufacturing the same, and electronic system using the same
09/20/2012US20120235261 Device-mounted substrate, infrared light sensor and through electrode forming method
09/20/2012US20120235253 Vertical Mount Package for MEMS Sensors
09/20/2012US20120235252 Manufacturing method for an encapsulated micromechanical component, corresponding micromechanical component, and encapsulation for a micromechanical component
09/20/2012US20120235250 Semiconductor device and a method of manufacturing the same
09/20/2012US20120235217 Semiconductor Constructions
09/20/2012US20120235162 Power converter
09/20/2012US20120235142 Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof
09/20/2012US20120235141 Semiconductor memory system
09/20/2012DE202012008410U1 Wärmeleitpad Thermal pad
09/20/2012DE112009004562T5 Halbleiterstückverbindungsüberwachungssystem und -verfahren Semiconductor piece connection monitoring system and method
09/20/2012DE112007001422B4 Kühler Cooler
09/20/2012DE10348018B4 CMOS-Schaltkreis-Anordnung CMOS circuit arrangement
09/20/2012DE102012204085A1 Halbleitervorrichtung und Verfahren zum Herstellen dieser A semiconductor device and method for producing these
09/20/2012DE102012200863A1 Halbleitervorrichtung mit Grundplatte Semiconductor device with base plate
09/20/2012DE102012102124A1 Leistungshalbleitervorrichtung Power semiconductor device
09/20/2012DE102012005296A1 Verpacken für fingerabdrucksensoren und verfahren einer herstellung Packaging for fingerprint sensors and process of manufacture
09/20/2012DE102011015098A1 Flaches Wärmerohr und dessen Herstellungsverfahren Flat heat pipe and its manufacturing method
09/20/2012DE102011015097A1 Cooling unit e.g. vapor-chamber-cooler or a flat heat pipe, comprises a hydrophilic layer, and a metal body comprising an inner space, where the inner space comprises a vaporization zone, a condensation zone and a connection zone
09/20/2012DE102011005669A1 Wärmeleitfolie für die Entwärmung und Fixierung elektronischer Bauelemente Thermal pad for heat removal and fixation of electronic components
09/20/2012DE102011005642A1 Verfahren zum Schutz von reaktiven Metalloberflächen von Halbleiterbauelementen während des Transports durch Bereitstellen einer zusätzlichen Schutzschicht A method for the protection of reactive metal surfaces of semiconductor devices during transport by providing an additional protective layer
09/20/2012CA2830284A1 Liquid-cooled led illuminating lamp
09/20/2012CA2822484A1 Mems-based getter microdevice
09/19/2012EP2500955A1 Substrate for light-emitting elements and light-emitting device
09/19/2012EP2500947A1 Semiconductor device and process for manufacturing same
09/19/2012EP2500940A1 Systems including an I/O stack and methods for fabricating such systems
09/19/2012EP2500939A2 Power semiconductor module and its attachment structure
09/19/2012EP2500938A1 Package for a semiconductor device, and a method of manufacturing such package
09/19/2012EP2500937A2 Electronic circuit with double insulating layer and method for manufacturing same
09/19/2012EP2500936A1 Insulating structure and method for manufacturing same
09/19/2012EP2500935A2 Stackable chip with through electrodes, manufacturing method thereof, and infrared sensor
09/19/2012EP2500934A2 Film-like wafer mold material, molded wafer, and semiconductor device
09/19/2012EP2500931A1 Semiconductor device and method for manufacturing semiconductor device
09/19/2012EP2500930A1 Etching liquid for etching silicon substrate rear surface in through silicon via process and method for manufacturing semiconductor chip having through silicon via using the etching liquid
09/19/2012EP2500704A1 Sensor device and method for producing sensor device
09/19/2012EP2499667A1 PARALLELIZED CHECK POINTING USING MATs AND THROUGH SILICON VIAs (TSVs)
09/19/2012EP2499665A1 Electric device and method of bonding chip to external electric circuit
09/19/2012CN202444434U Three-phase rectifier bridge
09/19/2012CN202444404U Multilayer copper bar fixing structure of driver
09/19/2012CN202443969U Line plate type three-phase rectification bridge
09/19/2012CN202443968U 半导体封装构造 Semiconductor package
09/19/2012CN202443967U Wafer superposition packaging structure
09/19/2012CN202443966U Multi-base-island exposure type multi-circle-pin electrostatic release ring passive component ball grid array packaging structure
09/19/2012CN202443965U Metal-graphite composite heat-sink device
09/19/2012CN202443964U Single-phase rectifier bridge
09/19/2012CN202443963U Semiconductor substrate package structure
09/19/2012CN202443962U Wafer level semiconductor packaging structure
09/19/2012CN202443225U TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and LCD
09/19/2012CN1874889B Sandwiched thermal heat treatment
09/19/2012CN102687599A Multi-chip wiring board and process for producing same,and wiring board and process for producing same
09/19/2012CN102687268A Semiconductor structure with heat spreader and method of its manufacture
09/19/2012CN102687267A Parallelized check pointing using mats and through silicon vias (TSVs)
09/19/2012CN102687264A 半导体装置 Semiconductor device
09/19/2012CN102687255A Recessed semiconductor substrates
09/19/2012CN102687251A Etchant and method for manufacturing semiconductor device using same
09/19/2012CN102687220A Method and device for cooling a jacketed medium-voltage electrical installation
09/19/2012CN102686773A Film forming method and film forming apparatus
09/19/2012CN102686634A Curable epoxy resin composition
09/19/2012CN102686021A Electronic device
09/19/2012CN102686013A Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
09/19/2012CN102683568A Heat conductive composite substrate having heat dissipation properties and manufacturing method thereof
09/19/2012CN102683546A Semiconductor package structure and manufacturing method thereof
09/19/2012CN102683392A Metal wire structure and groove manufacturing method
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