| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/07/2015 | CN102428557B 其中通过使用连接到参考电势的额外接合线对接合线进行阻抗控制的微电子组件 Wherein the connection to the reference potential through the use of an additional bonding wire for bonding wire impedance control of microelectronic assembly |
| 01/07/2015 | CN102132406B 包含应力松弛间隙以提升芯片封装交互作用的稳定性的半导体设备 Comprising stress relaxation interaction gap in order to enhance the stability of the chip package semiconductor device |
| 01/07/2015 | CN101819974B 沟槽式金属氧化物半导体晶体管 Grooved metal-oxide-semiconductor transistors |
| 01/07/2015 | CN101771077B 具静电放电保护的水平扩散金属氧化物半导体晶体管元件 ESD protection levels with diffused metal oxide semiconductor transistor element |
| 01/07/2015 | CN101515590B 薄膜晶体管数组基板 The thin film transistor array substrate |
| 01/06/2015 | US8930724 Semiconductor device predictive dynamic thermal management |
| 01/06/2015 | US8930509 Real-time feedback for policies for computing system management |
| 01/06/2015 | US8929097 Power conversion apparatus |
| 01/06/2015 | US8929092 Circuit board, and semiconductor device having component mounted on circuit board |
| 01/06/2015 | US8929091 Method of manufacturing a printed circuit board (PCB) |
| 01/06/2015 | US8929090 Functional element built-in substrate and wiring substrate |
| 01/06/2015 | US8929089 Electronic circuit module component and method of manufacturing electronic circuit module component |
| 01/06/2015 | US8929086 Gel package structural enhancement of compression system board connections |
| 01/06/2015 | US8929080 Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
| 01/06/2015 | US8929078 Electronic control device |
| 01/06/2015 | US8929076 Heat-dissipation structure and electronic device using the same |
| 01/06/2015 | US8929073 Boiling refrigerant type cooling system |
| 01/06/2015 | US8929071 Low cost manufacturing of micro-channel heatsink |
| 01/06/2015 | US8928897 Portable handheld device with multi-core image processor |
| 01/06/2015 | US8928803 Solid state apparatus |
| 01/06/2015 | US8928159 Alignment marks in substrate having through-substrate via (TSV) |
| 01/06/2015 | US8928158 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same |
| 01/06/2015 | US8928157 Encapsulation techniques for leadless semiconductor packages |
| 01/06/2015 | US8928156 Semiconductor device and method for manufacturing semiconductor device |
| 01/06/2015 | US8928154 Semiconductor module |
| 01/06/2015 | US8928153 Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
| 01/06/2015 | US8928152 Semiconductor device including contact plug and method of manufacturing the same |
| 01/06/2015 | US8928151 Hybrid core through holes and vias |
| 01/06/2015 | US8928150 Multi-chip package and method of manufacturing the same |
| 01/06/2015 | US8928149 Interlayer conductor and method for forming |
| 01/06/2015 | US8928148 Semiconductor component and device provided with heat dissipation means |
| 01/06/2015 | US8928147 Semiconductor device and method of manufacturing the same |
| 01/06/2015 | US8928146 Bond pad configurations for controlling semiconductor chip package interactions |
| 01/06/2015 | US8928145 Formation of alpha particle shields in chip packaging |
| 01/06/2015 | US8928144 3D non-volatile memory device, memory system including the same, and method of manufacturing the same |
| 01/06/2015 | US8928143 Semiconductor device and method of manufacturing the same |
| 01/06/2015 | US8928142 Apparatus related to capacitance reduction of a signal port |
| 01/06/2015 | US8928141 Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained |
| 01/06/2015 | US8928140 Method of manufacturing an electronic system |
| 01/06/2015 | US8928139 Device having wirelessly enabled functional blocks |
| 01/06/2015 | US8928138 Complete power management system implemented in a single surface mount package |
| 01/06/2015 | US8928137 Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board |
| 01/06/2015 | US8928136 Lead frame semiconductor device |
| 01/06/2015 | US8928135 Power semiconductor module with connecting devices |
| 01/06/2015 | US8928134 Package on package bonding structure and method for forming the same |
| 01/06/2015 | US8928132 Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package |
| 01/06/2015 | US8928131 Semiconductor device and manufacturing method thereof |
| 01/06/2015 | US8928130 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same |
| 01/06/2015 | US8928129 Semiconductor packaging for a memory device and a fabricating method thereof |
| 01/06/2015 | US8928128 Semiconductor package with integrated electromagnetic shielding |
| 01/06/2015 | US8928127 Noise decoupling structure with through-substrate vias |
| 01/06/2015 | US8928125 Interconnects having sealing structures to enable selective metal capping layers |
| 01/06/2015 | US8928123 Through via structure including a conductive portion and aligned solder portion |
| 01/06/2015 | US8928121 Thermal stress reduction |
| 01/06/2015 | US8928120 Wafer edge protection structure |
| 01/06/2015 | US8928119 Three dimensional structure memory |
| 01/06/2015 | US8928118 Processes and structures for IC fabrication |
| 01/06/2015 | US8928117 Multi-chip package structure and method of forming same |
| 01/06/2015 | US8928115 Semiconductor package having internal shunt and solder stop dimples |
| 01/06/2015 | US8928113 Layout scheme and method for forming device cells in semiconductor devices |
| 01/06/2015 | US8928109 Semiconductor device |
| 01/06/2015 | US8928104 Image sensor packaging structure with black encapsulant |
| 01/06/2015 | US8928097 Noise shielding techniques for ultra low current measurements in biochemical applications |
| 01/06/2015 | US8928092 Semiconductor devices and methods of fabricating the same |
| 01/06/2015 | US8928087 Semiconductor device |
| 01/06/2015 | US8928085 Apparatus and method for electronic circuit protection |
| 01/06/2015 | US8928084 ESD protection device and method of forming an ESD protection device |
| 01/06/2015 | US8928049 High efficiency module |
| 01/06/2015 | US8928033 Semiconductor device |
| 01/06/2015 | US8928002 Semiconductor device and method of manufacturing semiconductor device |
| 01/06/2015 | US8927996 OLED display device that prevents shorting of interconnections during manufacture thereof |
| 01/06/2015 | US8927989 Voltage contrast inspection of deep trench isolation |
| 01/06/2015 | US8927988 Self-sealed fluidic channels for a nanopore array |
| 01/06/2015 | US8927987 Semiconductor device including external connection pads and test pads |
| 01/06/2015 | US8927880 Printed circuit board and method for manufacturing the same |
| 01/06/2015 | US8927873 Fin-integrated substrate and manufacturing method of fin-integrated substrate |
| 01/06/2015 | US8927872 Thermal pad and method of forming the same |
| 01/06/2015 | US8927442 SiCOH hardmask with graded transition layers |
| 01/06/2015 | US8927433 Conductive via hole and method for forming conductive via hole |
| 01/06/2015 | US8927427 Anticipatory implant for TSV |
| 01/06/2015 | US8927426 Semiconductor devices having through-vias and methods for fabricating the same |
| 01/06/2015 | US8927421 Interconnect structures and methods of manufacturing of interconnect structures |
| 01/06/2015 | US8927420 Mechanism of forming semiconductor device having support structure |
| 01/06/2015 | US8927419 Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive |
| 01/06/2015 | US8927418 Systems and methods for reducing contact resistivity of semiconductor devices |
| 01/06/2015 | US8927417 Semiconductor package signal routing using conductive vias |
| 01/06/2015 | US8927416 Semiconductor device and method of manufacturing the same |
| 01/06/2015 | US8927415 Graphene barrier layers for interconnects and methods for forming the same |
| 01/06/2015 | US8927414 Graphene structure and method of manufacturing the graphene structure, and graphene device and method of manufacturing the graphene device |
| 01/06/2015 | US8927413 Semiconductor structure and semiconductor fabricating process for the same |
| 01/06/2015 | US8927412 Multi-chip package and method of formation |
| 01/06/2015 | US8927411 System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme |
| 01/06/2015 | US8927402 Method for forming termination structure for gallium nitride Schottky diode |
| 01/06/2015 | US8927391 Package-on-package process for applying molding compound |
| 01/06/2015 | US8927378 Trench silicide contact with low interface resistance |
| 01/06/2015 | US8927345 Device package with rigid interconnect structure connecting die and substrate and method thereof |
| 01/06/2015 | US8927344 Die substrate with reinforcement structure |
| 01/06/2015 | US8927343 Package process |
| 01/06/2015 | US8927342 Leadframe for electronic components |
| 01/06/2015 | US8927341 Semiconductor device and production method therefor |