Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/26/2012CN102693954A Carrier tape for ultra-thin non-contact module
09/26/2012CN102693953A Semiconductor apparatus and method for manufacturing the same
09/26/2012CN102693952A Packaging structure of TVS diode and method for manufacturing TVS diode
09/26/2012CN102693951A semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
09/26/2012CN102693950A Radiation module structure and manufacture method thereof
09/26/2012CN102693949A Heat spreader
09/26/2012CN102693948A Packing structure
09/26/2012CN102693947A Semiconductor device and method for manufacturing same
09/26/2012CN102693936A Package Interconnects
09/26/2012CN102693922A Patterns of passivation material on bond pads and methods of manufacture thereof
09/26/2012CN102693746A 半导体器件 Semiconductor devices
09/26/2012CN102690982A Si-Al alloy composite encapsulating component
09/26/2012CN102181129B Epoxy resin composition for semiconductor encapsulation
09/26/2012CN102064173B Electrostatic protective device for silicon controlled rectifier
09/26/2012CN102064155B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/26/2012CN102037560B Method for making microstructures by converting porous silicon into porous metal or ceramics
09/26/2012CN102033371B Array substrate and manufacturing method thereof
09/26/2012CN101989600B Semiconductor structure and manufacturing method thereof
09/26/2012CN101989595B Power device module
09/26/2012CN101959377B Shell structure
09/26/2012CN101950729B Wafer level packaging of electronic component and manufacturing method thereof
09/26/2012CN101937855B Manufacture method for buried capsulation structure of component and capsulation structure thereof
09/26/2012CN101903437B Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device
09/26/2012CN101878527B Wafer level packaging using flip chip mounting
09/26/2012CN101877349B Semiconductor module and portable device
09/26/2012CN101853827B Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
09/26/2012CN101741073B Structures for electrostatic discharge protection
09/26/2012CN101730376B Circuit structure with shielding effect and manufacturing method thereof
09/26/2012CN101696791B Method for manufacturing LED street lamp and street lamp thereof
09/26/2012CN101694837B Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof
09/26/2012CN101673738B Semiconductor device
09/26/2012CN101651130B Nitrogen-containing metal cap for interconnect structures
09/26/2012CN101630640B Photoresist burr edge-forming method and TFT-LCD array substrate-manufacturing method
09/26/2012CN101621046B Semiconductor package using through-electrodes having voids
09/26/2012CN101621011B Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
09/26/2012CN101617403B A high power integrated RF amplifier
09/26/2012CN101617319B Semiconductor device with backside tamper protection
09/26/2012CN101615600B High-thermal conductivity electronic packaging material and preparation method thereof
09/26/2012CN101544833B Curable silicone rubber composition and semiconductor devices
09/26/2012CN101527292B Chip packaging structure
09/26/2012CN101499443B Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
09/26/2012CN101458994B Staged capacitor construction, production method thereof, and substrate applying the same
09/26/2012CN101366116B Dual-damascene process to fabricate thick wire structure
09/26/2012CN101339444B Voltage regulator and manufacture method thereof
09/26/2012CN101273453B Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
09/26/2012CN101207097B Electrical terminal
09/26/2012CN101097919B Semiconductor component and method for manufacturing semiconductor component
09/26/2012CN101047333B Switchable on-die decoupling cell
09/25/2012US8276002 Power delivery in a heterogeneous 3-D stacked apparatus
09/25/2012US8275439 Analyte monitoring device and methods of use
09/25/2012US8274794 Three-dimensional SoC structure formed by stacking multiple chip modules
09/25/2012US8274600 Camera module package
09/25/2012US8274309 Programmable structured arrays
09/25/2012US8274165 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
09/25/2012US8274164 Less expensive high power plastic surface mount package
09/25/2012US8274163 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
09/25/2012US8274162 Apparatus and method for reduced delamination of an integrated circuit module
09/25/2012US8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement
09/25/2012US8274160 Active area bonding compatible high current structures
09/25/2012US8274159 Group III nitride based flip-chip integrated circuit and method for fabricating
09/25/2012US8274158 Structure, method and system for assessing bonding of electrodes in FCB packaging
09/25/2012US8274157 Semiconductor device and a method of manufacturing the same
09/25/2012US8274156 Optoelectronic semiconductor device
09/25/2012US8274155 Semiconductor device and method of manufacturing semiconductor device
09/25/2012US8274153 Electronic component built-in wiring substrate
09/25/2012US8274152 Semiconductor device having a contact hole extending from an upper surface of an insulating film and reaching one of a plurality of impurity regions constituting a transistor and method of manufacturing the same
09/25/2012US8274151 Object including a graphic element transferred on a support and method for making such an object
09/25/2012US8274150 Chip bump structure and method for forming the same
09/25/2012US8274149 Semiconductor device package having a buffer structure and method of fabricating the same
09/25/2012US8274148 Semiconductor module
09/25/2012US8274147 Method and system for intra-printed circuit board communication via waveguides
09/25/2012US8274146 High frequency interconnect pad structure
09/25/2012US8274145 Semiconductor package system with patterned mask over thermal relief
09/25/2012US8274144 Helical springs electrical connecting a plurality of packages
09/25/2012US8274143 Semiconductor device, method of forming the same, and electronic device
09/25/2012US8274142 Semiconductor device having stacked multiple substrates and method for producing same
09/25/2012US8274141 Semiconductor memory card and semiconductor memory device
09/25/2012US8274140 Semiconductor chip package assembly with deflection-resistant leadfingers
09/25/2012US8274135 Fuse of semiconductor device
09/25/2012US8274134 Semiconductor device with electric fuse having interconnects and via
09/25/2012US8274133 Semiconductor package and method for making the same
09/25/2012US8274129 Power transistor with improved high-side operating characteristics and reduced resistance and related apparatus and method
09/25/2012US8274080 Semiconductor wafer including guard ring patterns and process monitoring patterns
09/25/2012US8273671 Glass material for radio-frequency applications
09/25/2012US8273656 Method of forming conductive layer and semiconductor device
09/25/2012US8273608 Method of forming a copper-compatible fuse target
09/25/2012US8273605 Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate
09/25/2012US8273458 Adhesive for bonding circuit members, circuit board and process for its production
09/25/2012US8273457 Adhesive for bonding circuit members, circuit board and process for its production
09/25/2012US8273445 Reinforced assembly carrier
09/25/2012US8273022 Analyte monitoring device and methods of use
09/25/2012US8272230 Temperature control unit for electronic component and handler apparatus
09/20/2012WO2012124783A1 Pressure unit
09/20/2012WO2012124780A1 Epoxy resin composition, method for producing same, and semiconductor device using same
09/20/2012WO2012124737A1 Moisture-proof insulative coating with visible light-blocking properties
09/20/2012WO2012124437A1 Sensor package
09/20/2012WO2012124435A1 Polyester resin composition for electrical / electronic part-sealing material, sealed product and production method therefor
09/20/2012WO2012124239A1 Semiconductor device and method for manufacturing semiconductor device
09/20/2012WO2012124209A1 Semiconductor module and manufacturing method therefor
09/20/2012WO2012124180A1 Liquid resin composition
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