Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2012
09/27/2012US20120241943 Diamond Particle Mololayer Heat Spreaders and Associated Methods
09/27/2012US20120241942 Semiconductor device and method of manufacturing the same
09/27/2012US20120241941 Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die
09/27/2012US20120241940 Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation
09/27/2012US20120241939 Apparatus for Thermally Enhanced Semiconductor Package
09/27/2012US20120241938 Organic packaging carrier
09/27/2012US20120241937 Package structure having micro-electromechanical element
09/27/2012US20120241936 Integrated circuit packaging system with package-on-package and method of manufacture thereof
09/27/2012US20120241935 Package-on-package structure
09/27/2012US20120241934 Semiconductor apparatus and method for manufacturing the same
09/27/2012US20120241933 Semiconductor memory card
09/27/2012US20120241932 Semiconductor device
09/27/2012US20120241931 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241930 Folded leadframe multiple die package
09/27/2012US20120241929 Leadframe-based mold array package heat spreader and fabrication method therefor
09/27/2012US20120241928 Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
09/27/2012US20120241927 Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
09/27/2012US20120241926 Integrated circuit packaging system with leveling standoff and method of manufacture thereof
09/27/2012US20120241925 Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
09/27/2012US20120241924 Semiconductor device having antenna and method for manufacturing thereof
09/27/2012US20120241923 Ic wafer having electromagnetic shielding effects and method for making the same
09/27/2012US20120241922 Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof
09/27/2012US20120241921 Integrated circuit packaging system with interposer shield and method of manufacture thereof
09/27/2012US20120241917 Semiconductor chip, method for manufacturing semiconductor chip, and semiconductor device
09/27/2012US20120241915 Semiconductor Device and Method of Forming Leadframe With Notched Fingers for Stacking Semiconductor Die
09/27/2012US20120241914 Reduction of fluorine contamination of bond pads of semiconductor devices
09/27/2012US20120241901 Package interconnects
09/27/2012US20120241888 Semiconductor device using close proximity wireless communication
09/27/2012US20120241876 System and method for improving frequency response
09/27/2012US20120241211 Electronic component, electronic device, and method for manufacturing the electronic component
09/27/2012DE112010004897T5 System zum Verbessern der Verbindungen eines kernlosen Aufbaus und zugehörige Verfahren A system for improving the connections of a coreless structure and associated method
09/27/2012DE112009005394T5 Kühlstruktur einer Halbleitervorrichtung The cooling structure of a semiconductor device
09/27/2012DE10393769B4 Halbleiterbauelement mit Klemmen zum Verbinden mit externen Elementen A semiconductor device having terminals for connection with external elements
09/27/2012DE102012200569A1 Halbleitergerät, welches eine Luftbrücke hat, und Verfahren zum Herstellen desselben Of the same semiconductor device which has an air bridge, and methods for preparing
09/27/2012DE102011090118A1 Halbleitervorrichtung Semiconductor device
09/27/2012DE102011088581A1 Gehäuseverbindungen Housing compounds
09/27/2012DE102011015162A1 High current-conducting metal interconnect for e.g. insulated gate bipolar transistor utilized in integrated circuit, has main current-carrying thick upper metal film recessed to certain amount at edge opposite to lower metal film
09/27/2012DE102011014967A1 Elektrisches Vielschichtbauelement Electrical multilayer component
09/27/2012DE102011014965A1 Elektrisches Vielschichtbauelement Electrical multilayer component
09/27/2012DE102011014584A1 Anschlussträger für Halbleiterchips und Halbleiterbauelement Connection carrier for semiconductor chips and semiconductor device
09/27/2012DE102011005890A1 Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse Electronic device with circuit boards in a rack-mounted housing
09/27/2012DE102011005642B4 Verfahren zum Schutz von reaktiven Metalloberflächen von Halbleiterbauelementen während des Transports durch Bereitstellen einer zusätzlichen Schutzschicht A method for the protection of reactive metal surfaces of semiconductor devices during transport by providing an additional protective layer
09/27/2012DE102009035437B4 Halbleiterbauelement mit einem Verspannungspuffermaterial, das über einem Metallisierungssystem mit kleinem ε gebildet ist A semiconductor device having a stress buffer material that is formed over a metallization system with small ε
09/27/2012DE102009019029B4 Verfahren zur Herstellung eines Sensormoduls A process for producing a sensor module
09/27/2012DE102008051081B4 Wärmeableitmodul und Anordnung mit einem solchen Wärmeableitmodul Wärmeableitmodul and arrangement with such Wärmeableitmodul
09/26/2012EP2503859A1 Through-wired substrate and manufacturing method therefor
09/26/2012EP2503595A1 Power semiconductor module and method of manufacturing a power semiconductor module
09/26/2012EP2503594A1 Signal routing optimized IC package ball/pad layout
09/26/2012EP2503593A1 Heat dissipating device and method for manufacturing heat dissipating device
09/26/2012EP2503390A2 Phase shift mask, semiconductor device and method of manufacturing the same
09/26/2012EP2502280A1 Assemblies comprising a polyimide film and an electrode, and methods relating thereto
09/26/2012EP2502270A1 Devices with crack stops
09/26/2012EP2502269A2 Interposer films useful in semiconductor packaging applications, and methods relating thereto
09/26/2012EP2502268A2 Apparatus and method for processing a substrate
09/26/2012EP2501743A1 Wire wrap compositions and methods relating thereto
09/26/2012EP2501742A1 Thermally and dimensionally stable polyimide films and methods relating thereto
09/26/2012EP2501741A1 Coverlay compositions and methods relating thereto
09/26/2012DE202012007280U1 Leistungshalbleiterspannstapel Power semiconductor chip stack
09/26/2012CN202455723U Network communication device
09/26/2012CN202454562U Diode
09/26/2012CN202454561U 整流二极管 Rectifier diode
09/26/2012CN202454556U Stacked chip packaging structure, synchronous rectification module and converter module
09/26/2012CN202454555U Thin film transistor structure, array substrate and display device
09/26/2012CN202454554U Packaging structure of special half-bridge driving integrated circuit for compact fluorescent lamp
09/26/2012CN202454553U IDF type large matrix SOP16 lead frame structure
09/26/2012CN202454552U QFP (quad flat pack) grounding pad
09/26/2012CN202454551U Electroformed wafer bumping
09/26/2012CN202454550U Multi-layer intensive transistor radiator
09/26/2012CN202454549U Heat dissipation structure of ceramic packaging power component based on aluminum base silicon carbide
09/26/2012CN202454548U Transistor radiator
09/26/2012CN202454547U High-power device with composite passive film
09/26/2012CN202454546U 半导体器件 Semiconductor devices
09/26/2012CN1909226B Package substrate
09/26/2012CN102696173A Base of surface-mount-type electronic component-use package, and surface-mount-type electronic component-use package
09/26/2012CN102696106A Electronic devices and components for high efficiency power circuits
09/26/2012CN102696105A Chip package with a chip embedded in a wiring body
09/26/2012CN102696104A Method for producing an electronic component and electronic component produced according to said method
09/26/2012CN102696103A Cooling module for cooling electronic components
09/26/2012CN102696102A Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
09/26/2012CN102696097A Etchant and method for manufacturing semiconductor device using same
09/26/2012CN102695731A Actinic-radiation curable composition and uses thereof
09/26/2012CN102695407A Miniature electromagnetic interference protection structure and manufacture method thereof
09/26/2012CN102695405A Wafer level electromagnetic protection structure and manufacturing method thereof
09/26/2012CN102694379A Plane voltage protection assembly
09/26/2012CN102693974A Infrared remote control receiving amplifier with double-layer structure
09/26/2012CN102693969A Insulated gate bipolar translator (IGBT) power module
09/26/2012CN102693968A Chip stacking and packaging structure
09/26/2012CN102693967A Semiconductor memory card
09/26/2012CN102693966A 电力用半导体装置以及逆变器装置 A power semiconductor device and an inverter device
09/26/2012CN102693965A Package-on-package structure
09/26/2012CN102693964A Semiconductor device
09/26/2012CN102693963A semiconductor device and method of manufacturing the same
09/26/2012CN102693962A Integrated circuit wafer having electromagnetic shielding effect and manufacture method thereof
09/26/2012CN102693961A Semiconductor apparatus
09/26/2012CN102693960A Semiconductor apparatus
09/26/2012CN102693959A Grid resistor test structure for MOS transistor
09/26/2012CN102693958A Copper interconnection structure adopting novel diffusion impervious layer and preparation method thereof
09/26/2012CN102693957A Electric fuse, semiconductor device, and information writing method of electric fuse
09/26/2012CN102693956A Signal transforming circuit
09/26/2012CN102693955A Packaging carrier board and manufacturing method thereof
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