Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/02/2012US8278757 Printed electronics
10/02/2012US8278756 Single chip semiconductor coating structure and manufacturing method thereof
10/02/2012US8278755 Heat dissipation structure for electronic device and fabrication method thereof
10/02/2012US8278754 Metal line in semiconductor device and method for forming the same
10/02/2012US8278753 Semiconductor device and production method thereof
10/02/2012US8278752 Microelectronic package and method for a compression-based mid-level interconnect
10/02/2012US8278751 Methods of adhering microfeature workpieces, including a chip, to a support member
10/02/2012US8278750 Heat conduction board and mounting method of electronic components
10/02/2012US8278749 Integrated antennas in wafer level package
10/02/2012US8278748 Wafer-level packaged device having self-assembled resilient leads
10/02/2012US8278747 Semiconductor apparatus having a two-side heat radiation structure
10/02/2012US8278746 Semiconductor device packages including connecting elements
10/02/2012US8278745 Through board stacking of multiple LGA-connected components
10/02/2012US8278744 Semiconductor device and method for manufacturing same
10/02/2012US8278743 Semiconductor device with heat spreader
10/02/2012US8278742 Thermal enhanced upper and dual heat sink exposed molded leadless package and method
10/02/2012US8278740 Method for manufacturing semiconductor device, semiconductor device, and electronic appliance
10/02/2012US8278736 Electrostatic discharge protection device
10/02/2012US8278733 Bonding pad structure and integrated circuit chip using such bonding pad structure
10/02/2012US8278732 Antifuse element for integrated circuit device
10/02/2012US8278716 Method of fabricating polysilicon, thin film transistor, method of fabricating the thin film transistor, and organic light emitting diode display device including the thin film transistor
10/02/2012US8278715 Electrostatic discharge protection device
10/02/2012US8278689 Memory and interconnect design in fine pitch
10/02/2012US8278678 Light emitting device
10/02/2012US8278568 Z-directed variable value components for printed circuit boards
10/02/2012US8278401 Radiation or thermally curable barrier sealants
10/02/2012US8278213 Semiconductor device and manufacturing method of the same
10/02/2012US8278154 Method of fabricating a semiconductor device package including a heat radiation plate
10/02/2012US8278148 Integrated circuit package system with leads separated from a die paddle
10/02/2012US8278147 Semiconductor device and manufacturing method thereof
10/02/2012US8278146 Manufacturing method of chip package with coplanarity controlling feature
10/02/2012US8276655 Heat conducting apparatus
10/02/2012US8276259 Method of constructing a differential inductor
10/02/2012CA2368950C Robust interconnect structure
09/2012
09/27/2012WO2012129554A2 Conductive paste composition and semiconductor devices made therewith
09/27/2012WO2012129153A2 Solder in cavity interconnection structures
09/27/2012WO2012128987A1 Thin film desiccant and method of fabrication
09/27/2012WO2012128832A1 Symmmetrical center tap inductor structure
09/27/2012WO2012128444A1 Encapsulating material moulding method
09/27/2012WO2012128360A1 Heat dissipating substrate, and element equipped with same
09/27/2012WO2012128210A1 Electronic component package, electronic component, and method for manufacturing electronic component package
09/27/2012WO2012128140A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate
09/27/2012WO2012128139A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate
09/27/2012WO2012127958A1 Composite member provided with substrate formed from composite material
09/27/2012WO2012127922A1 Field-effect transistor
09/27/2012WO2012127780A1 Flexible semiconductor device and method for producing same
09/27/2012WO2012127779A1 Flexible semiconductor device and method for producing same
09/27/2012WO2012127696A1 Power semiconductor module and power unit device
09/27/2012WO2012127614A1 Semiconductor device
09/27/2012WO2012126955A1 Thermal interface based on a material having low thermal resistance and manufacturing process
09/27/2012WO2012126852A1 Connection carrier for semiconductor chips and semiconductor component
09/27/2012WO2012126725A1 Integrated circuit comprising an electrical through-plating and method for producing an electrical through-plating
09/27/2012WO2012126379A1 Three-dimensional system-level packaging methods and structures
09/27/2012WO2012126377A1 System-level packaging methods and structures
09/27/2012WO2012126375A1 Fan-out high-density packaging methods and structures
09/27/2012WO2012126374A1 3d system-level packaging methods and structures
09/27/2012WO2012074570A3 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
09/27/2012US20120246603 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
09/27/2012US20120244704 Method for removing oxides
09/27/2012US20120243289 Electric fuse, semiconductor device, and information writing method of electric fuse
09/27/2012US20120243281 Power semiconductor device
09/27/2012US20120242953 Methods and apparatus for functional insert with power layer
09/27/2012US20120242402 Semiconductor device and wafer
09/27/2012US20120241986 Pin Routing in Standard Cells
09/27/2012US20120241985 Semiconductor chip with supportive terminal pad
09/27/2012US20120241984 Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die
09/27/2012US20120241983 Integrated circuit packaging system with a flip chip and method of manufacture thereof
09/27/2012US20120241981 Semiconductor device and method for manufacturing same
09/27/2012US20120241979 Integrated circuit packaging system with step mold and method of manufacture thereof
09/27/2012US20120241978 Semiconductor device and method of manufacturing the same
09/27/2012US20120241976 Semiconductor packaging process using through silicon vias
09/27/2012US20120241975 Method for decomposing lines of an electronic circuit
09/27/2012US20120241974 Semiconductor device
09/27/2012US20120241973 Integrated circuit packaging system with filled vias and method of manufacture thereof
09/27/2012US20120241972 Layout scheme for an input output cell
09/27/2012US20120241971 Semiconductor device
09/27/2012US20120241970 Semiconductor device
09/27/2012US20120241969 Semiconductor integrated circuit device
09/27/2012US20120241967 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
09/27/2012US20120241966 Integrated circuit packaging system with plated leads and method of manufacture thereof
09/27/2012US20120241965 Solder in cavity interconnection structures
09/27/2012US20120241964 Integrated circuit packaging system with interconnects and method of manufacture thereof
09/27/2012US20120241963 Self-aligned silicide formation on source/drain through contact via
09/27/2012US20120241962 Integrated circuit packaging system with lead frame etching and method of manufacture thereof
09/27/2012US20120241961 Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
09/27/2012US20120241960 Substrate for a microelectronic package and method of fabricating thereof
09/27/2012US20120241959 Magnetic integration double-ended converter
09/27/2012US20120241958 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
09/27/2012US20120241957 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
09/27/2012US20120241956 Techniques for packaging multiple device components
09/27/2012US20120241955 Chip scale package assembly in reconstitution panel process format
09/27/2012US20120241953 Unit for semiconductor device and semiconductor device
09/27/2012US20120241952 Apparatuses and methods to enhance passivation and ild reliability
09/27/2012US20120241951 Wafer bumping using printed under bump metalization
09/27/2012US20120241950 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
09/27/2012US20120241949 Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
09/27/2012US20120241948 Integrated circuit packaging system with pads and method of manufacture thereof
09/27/2012US20120241947 Integrated circuit packaging system with locking interconnects and method of manufacture thereof
09/27/2012US20120241946 Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
09/27/2012US20120241945 Semiconductor Device and Method of Forming Flipchip Interconnect Structure
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