Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/03/2012CN102714189A Integrated void fill for through silicon via
10/03/2012CN102714188A Semiconductor module manufacturing method
10/03/2012CN102714187A Electronic component packaging base and electronic component packaging
10/03/2012CN102714186A Film for forming semiconductor protection film, and semiconductor device
10/03/2012CN102714176A Electronic device and method for manufacturing electronic device
10/03/2012CN102714173A Tunnel junction via
10/03/2012CN102714164A Semiconductor device and method for manufacturing same
10/03/2012CN102714163A Method for improving plating on non-concuctive substrates
10/03/2012CN102714031A Sensor having damping
10/03/2012CN102712812A 可固化组合物 The curable composition
10/03/2012CN102712756A Silicone resin
10/03/2012CN102712755A Polyimide resin composition, adhesive agent and laminate each comprising same, and device
10/03/2012CN102712754A Coverlay compositions and methods relating thereto
10/03/2012CN102712753A Thermally and dimensionally stable polyimide films and methods relating thereto
10/03/2012CN102712740A Underfill for high density interconnect flip chips
10/03/2012CN102712520A Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co fired ceramic materials and devices made therefrom
10/03/2012CN102712477A Method for forming carbon nanotubes, and carbon nanotube film-forming apparatus
10/03/2012CN102711384A Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device
10/03/2012CN102709282A Multi-die packages incorporating flip chip dies and associated packaging methods
10/03/2012CN102709275A Coaxial non-contact 3D-MCM vertical interconnection method
10/03/2012CN102709274A Electromagnetic interference shielding structure of integrated circuit substrate and manufacturing method thereof
10/03/2012CN102709273A Structure for shorting line connecting signla lines of the flat panel display device
10/03/2012CN102709272A Fault-tolerant unit and method for through-silicon via
10/03/2012CN102709271A Stacked wafer level package having a reduced size
10/03/2012CN102709270A MIM (Metal Insulator Metal) capacitor and forming method thereof
10/03/2012CN102709269A Memory architecture of 3d array with improved uniformity of bit line capacitances
10/03/2012CN102709268A Semiconductor device and manufacturing method of same
10/03/2012CN102709267A Lead frame in semiconductor
10/03/2012CN102709266A Inexpensive surface mount packaging structure of semiconductor optical device and method for packaging inexpensive surface mount packaging structure
10/03/2012CN102709265A Inexpensive surface mount packaging structure of semiconductor optical device and method for packaging inexpensive surface mount packaging structure
10/03/2012CN102709264A Radio frequency (RF) transceiving front end module and preparation method thereof
10/03/2012CN102709263A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2012CN102709262A Heat radiator shared by multiple chips and circuit board provided with same
10/03/2012CN102709261A Radiating module and manufacturing method thereof
10/03/2012CN102709260A Semiconductor packaging structure
10/03/2012CN102709259A Flip chip molding structure and method of non-array bump
10/03/2012CN102709258A Diamond-silicon composite material
10/03/2012CN102709257A Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece
10/03/2012CN102709256A Hollow lead-free plastic flat package
10/03/2012CN102709255A Metal structure sequentially-enhanced polymer composite material adapter plate
10/03/2012CN102709254A Method for reducing arc discharge of wafer, wafer structure and method for manufacturing integrated circuit
10/03/2012CN102709202A Chip scale package assembly in reconstitution panel process format
10/03/2012CN102709201A Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
10/03/2012CN102709200A Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
10/03/2012CN102361025B High-density integrated circuit packaging structure, packaging method for packaging structure, and integrated circuit
10/03/2012CN102214636B Framework of SMD (Surface Mount Device) type diode
10/03/2012CN102194865B High-power insulated gate bipolar translator (IGBT) flat pressed and connected packaging structure
10/03/2012CN102176441B Improved addressable test chip for physical failure analysis and manufacturing method thereof
10/03/2012CN102157485B Semiconductor packaging frame
10/03/2012CN102157477B Method for manufacturing semiconductor device
10/03/2012CN102130121B Serial connection structure of polycrystalline silicon diodes
10/03/2012CN102128437B LED (light-emitting diode) magnetic fluid radiating device
10/03/2012CN102097431B Chip and electro-static discharge (ESD) protection element thereof
10/03/2012CN102097406B Encapsulation insulating clad structure of single grain size semiconductor element and clad method
10/03/2012CN102082139B Semiconductor device having a multilayer interconnection structure
10/03/2012CN102074509B Integrated circuit chip packaging body and physical-layer interface arrangement assembly
10/03/2012CN102064154B Integrated circuit structure
10/03/2012CN102019543B Temperature-equalizing plate and manufacture method thereof
10/03/2012CN101996927B Multilayer interconnection structure and forming method thereof
10/03/2012CN101978492B Method for manufacturing electronic component module
10/03/2012CN101969043B Active element array substrate and manufacturing method thereof
10/03/2012CN101960587B Mounted board, mounted board set, and panel unit
10/03/2012CN101950751B Image sensor and encapsulating method thereof
10/03/2012CN101937893B Semiconductor device
10/03/2012CN101916717B Method for preparing reinforced heat transfer surface of direct liquid cooling chip
10/03/2012CN101911289B 3-d semiconductor die structure with containing feature and method
10/03/2012CN101878524B Source driver, source driver manufacturing method, and liquid crystal module
10/03/2012CN101877342B Circuit arrangement and design method
10/03/2012CN101868854B Liquid-cooled cooling device
10/03/2012CN101853835B Manufacturing method of flip chip package
10/03/2012CN101803017B Conformal shielding process using process gases
10/03/2012CN101765913B Reduced bottom roughness of stress buffering element of a semiconductor component
10/03/2012CN101762923B Electrophoretic display device and method of fabricating the same
10/03/2012CN101752314B Surface channel PMOS device with self-aligned contact hole and manufacturing method
10/03/2012CN101752313B Surface P-channel metal oxide semiconductor (PMOS) device with self-aligned contact hole and method for producing same
10/03/2012CN101740536B 半导体封装 The semiconductor package
10/03/2012CN101673734B Capacitor structure
10/03/2012CN101601130B Heat transport assembly
10/03/2012CN101582420B Focusing infrared receiver with built-in reflective cup
10/03/2012CN101540313B Switching assembly with bond connection
10/03/2012CN101465385B Capacitor structure
10/03/2012CN101399262B Power semiconductor arrangement and assembling method thereof
10/03/2012CN101375395B Heat dissipating material and semiconductor device using same
10/03/2012CN101022107B Versatile semiconductor test structure array
10/03/2012CN101015053B 半导体装置 Semiconductor device
10/02/2012US8279700 Semiconductor electrically programmable fuse (eFuse) having a polysilicon layer not doped with an impurity ion and a programming method thereof
10/02/2012US8279606 Processor loading system including a heat dissipater
10/02/2012US8278770 Overlay mark
10/02/2012US8278769 Compound semiconductor device and connectors
10/02/2012US8278768 Semiconductor device including wires connecting electrodes to an inner lead
10/02/2012US8278767 Optoelectronic component
10/02/2012US8278766 Wafer level stack structure for system-in-package and method thereof
10/02/2012US8278765 Test-key for checking interconnect
10/02/2012US8278764 Stub minimization for multi-die wirebond assemblies with orthogonal windows
10/02/2012US8278763 Semiconductor device
10/02/2012US8278762 Method of manufacturing photomask and method of repairing optical proximity correction
10/02/2012US8278761 Circuit layout structure
10/02/2012US8278760 Semiconductor integrated circuit and method for manufacturing same, and mask
10/02/2012US8278759 Structures for measuring misalignment of patterns
10/02/2012US8278758 Multilevel reservoirs for integrated circuit interconnects
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