Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/04/2012US20120248602 Semiconductor device
10/04/2012US20120248601 Semiconductor Device and Method of Forming a Land Grid Array Flip Chip Bump System
10/04/2012US20120248600 Semiconductor device having plural stacked chips
10/04/2012US20120248599 Reliable solder bump coupling within a chip scale package
10/04/2012US20120248598 Semiconductor bonding apparatus
10/04/2012US20120248597 Semiconductor device with stop layers and fabrication method using ceria slurry
10/04/2012US20120248596 Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
10/04/2012US20120248595 System comprising a semiconductor device and structure
10/04/2012US20120248594 Junction box and manufacturing method thereof
10/04/2012US20120248593 Package structure for dc-dc converter
10/04/2012US20120248592 Lead component and method for manufacturing the same, and semiconductor package
10/04/2012US20120248591 Lead frame and semiconductor device
10/04/2012US20120248590 Semiconductor package and lead frame therefor
10/04/2012US20120248589 Lead frame with coined inner leads
10/04/2012US20120248588 Lead frame
10/04/2012US20120248587 Miniature Microwave Component for Surface-Mounting
10/04/2012US20120248586 Semiconductor apparatus for preventing crosstalk between signal lines
10/04/2012US20120248585 Electromagnetic interference shielding structure for integrated circuit substrate and method for fabricating the same
10/04/2012US20120248582 Voltage Switchable Dielectric for Die-Level Electrostatic Discharge (ESD) Protection
10/04/2012US20120248581 Semiconductor device and manufacturing method thereof
10/04/2012US20120248580 Semiconductor device and method of manufacturing semiconductor device
10/04/2012US20120248568 Method for controlling the electrical conduction between two metallic portions and associated device
10/04/2012US20120248567 Layered structure with fuse
10/04/2012US20120248553 Sensor device and manufacturing method thereof
10/04/2012US20120248546 Methods of forming secured metal gate antifuse structures
10/04/2012US20120248539 Flip chip semiconductor device
10/04/2012US20120248504 Arrays Of Memory Cells And Methods Of Forming An Array Of Vertically Stacked Tiers Of Memory Cells
10/04/2012US20120248493 Electrical and/or electronic device with elastic contact element
10/04/2012US20120248441 Space and Cost Efficient Incorporation of Specialized Input-Output Pins on Integrated Circuit Substrates
10/04/2012US20120248440 Semiconductor module
10/04/2012US20120248439 Semiconductor packages
10/04/2012US20120248438 Fault-tolerant unit and method for through-silicon via
10/04/2012US20120248437 Semiconductor Device And Test Method For Semiconductor Device
10/04/2012US20120248436 Reduced pattern loading for doped epitaxial process and semiconductor structure
10/04/2012US20120248271 Panel Lock Solar Clamp
10/04/2012DE202012006094U1 Halterung für ein Halbleiterpaket Holder for a semiconductor package
10/04/2012DE112011100140T5 DIMM-Flüssigkühleinheit DIMM liquid cooling unit
10/04/2012DE112011100099T5 Halbleiterbauelement Semiconductor device
10/04/2012DE102012201889A1 Electrical power module has electronic components for electrically coupling contact elements, and punched grid that is arranged for coupling contact elements and one side of electronic component
10/04/2012DE102012102666A1 Kühlkörper und mit dem Kühlkörper ausgestattetes Elektronikbauteil Heat sink and equipped with the heatsink electronic component
10/04/2012DE102011075661A1 Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung Thermoelectric assembly and method of making a thermoelectric device
10/04/2012DE102011015912A1 Anordnung zum Temperieren eines wärmeerzeugenden Bauteils und Verfahren zum Herstellen einer Anordnung Arrangement for controlling the temperature of a heat generating component and method for manufacturing an array
10/04/2012DE102011006329A1 Elektronikmodul sowie Verfahren zu dessen Herstellung Electronics module and method for its production
10/04/2012DE102011001680A1 Verfahren zum Herstellen eines Beleuchtungskörpers auf LED-Basis A method for producing a LED-based lighting fixture
10/04/2012DE102009049102B4 Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement A semiconductor device having through-hole plating and method for making a via hole in a semiconductor device
10/04/2012DE102009002993B4 Leistungshalbleitermodul mit beabstandeten Schaltungsträgern Power semiconductor module having spaced circuit boards
10/04/2012DE102008008515B4 Modul mit siliziumbasierter Schicht und Herstellungsverfahren Module with silicon-based film and production method
10/04/2012DE102007052821B4 Verfahren zur Herstellung eines Subträgers und eines optoelektronischen Bauelements A process for the preparation of a subcarrier and an optoelectronic component
10/04/2012DE102007019795B4 Chipmodul und Verfahren zum Herstellen dieses Chipmoduls Chip module and method of manufacturing this chip module
10/04/2012DE102006051454B4 Halbleitervorrichtung Semiconductor device
10/04/2012DE102004025616B4 Halbleiterbauteil mit Kühlsystem A semiconductor device comprising the cooling system
10/04/2012DE10030289B4 Träger für Bauteile und Herstellungsverfahren Support for components and manufacturing processes
10/04/2012CA2831916A1 High density microelectronics packaging
10/03/2012EP2506305A1 Photodiode array and method for manufacturing the same
10/03/2012EP2506302A1 Wiring substrate, imaging device and imaging device module
10/03/2012EP2506300A2 Dual compartment semiconductor package with temperature sensor
10/03/2012EP2506299A1 Semiconductor device and method of producing same
10/03/2012EP2506298A1 Production method for electronic device, electronic device, production method for electronic device package, and electronic device package
10/03/2012EP2506113A2 Media content device with customized panel
10/03/2012EP2505913A1 An active thermal management device and thermal management method
10/03/2012EP2505613A1 Composition, cured product, and electronic device
10/03/2012CN202473931U High-power controllable silicon
10/03/2012CN202473908U Chip stacking structure used in system integration module
10/03/2012CN202473906U Bi-interface intelligent card carrier tape with no cavity
10/03/2012CN202473905U Wafer level columnar bump packaging structure
10/03/2012CN202473904U Transistor lead frame plate
10/03/2012CN202473903U Loading frame for semiconductor devices
10/03/2012CN202473902U Composite substrate heat pipe heat radiator
10/03/2012CN202473901U Plate-band-type integrated circuit water cooling heat radiating assembly
10/03/2012CN202473900U Integrated circuit (IC) radiator
10/03/2012CN202473899U Heat radiation module
10/03/2012CN202473898U Chip packaging structure
10/03/2012CN202473897U System integrated circuit packaging structure
10/03/2012CN202473896U Semiconductor packaging die strip
10/03/2012CN202473895U Chip packaging structure having good heat dissipating efficiency
10/03/2012CN202473894U Semiconductor plastic-packaged component with heat radiating plate
10/03/2012CN202473893U Junction box locating device
10/03/2012CN202473892U Airtight packaging structure of transistor tube seat and base pin
10/03/2012CN202473891U Insulating and heat radiating housing of high voltage circuit power device
10/03/2012CN202473890U Wafer level packaging structure
10/03/2012CN202473889U Chip level packaging structure
10/03/2012CN202472709U High temperature resistant acid and alkali resistant flexible electronic tag
10/03/2012CN102714930A Liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated substrate
10/03/2012CN102714929A Substrate with integrated fins and method of manufacturing substrate with integrated fins
10/03/2012CN102714489A Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member
10/03/2012CN102714259A Substrate for mounting light-emitting element, and light-emitting device
10/03/2012CN102714221A Circuit board, display device, and process for production of circuit board
10/03/2012CN102714211A Solid-state image pickup device
10/03/2012CN102714202A Semiconductor device and production method for same
10/03/2012CN102714201A Semiconductor package and method
10/03/2012CN102714200A Leadframe-based premolded package having acoustic air channel for microelectromechanical system device
10/03/2012CN102714199A Slotted configuration for optimized placement of micro-components using adhesive bonding
10/03/2012CN102714198A Power module production method, and power module produced thereby
10/03/2012CN102714197A Microfabricated pillar fins for thermal management
10/03/2012CN102714195A 半导体装置 Semiconductor device
10/03/2012CN102714194A Method and system for exposing delicate structures of a device encapsulated in a mold compound
10/03/2012CN102714193A IGBT cooling method
10/03/2012CN102714192A Interposer films useful in semiconductor packaging applications, and methods relating thereto
10/03/2012CN102714191A Silicon nitride substrate, circuit substrate and electronic device using same
10/03/2012CN102714190A Package assembly having a semiconductor substrate
1 ... 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 335 ... 2262