Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/09/2012US8283763 Power semiconductor module and fabrication method thereof
10/09/2012US8283762 Lead frame based semiconductor package and a method of manufacturing the same
10/09/2012US8283761 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
10/09/2012US8283760 Lead frame interconnect scheme with high power density
10/09/2012US8283759 Lead frame having outer leads coated with a four layer plating
10/09/2012US8283758 Microelectronic packages with enhanced heat dissipation and methods of manufacturing
10/09/2012US8283757 Quad flat package with exposed common electrode bars
10/09/2012US8283756 Electronic component with buffer layer
10/09/2012US8283755 Multichip semiconductor device, chip therefor and method of formation thereof
10/09/2012US8283754 Seal ring structure with metal pad
10/09/2012US8283751 Split-channel antifuse array architecture
10/09/2012US8283735 Packaged device and producing method thereof
10/09/2012US8283729 Semiconductor device and method of manufacturing the same
10/09/2012US8283728 Semiconductor device
10/09/2012US8283727 Circuit with electrostatic discharge protection
10/09/2012US8283726 System and method for I/O ESD protection with polysilicon regions fabricated by processes for making core transistors
10/09/2012US8283725 Semiconductor device
10/09/2012US8283706 Optimization of critical dimensions and pitch of patterned features in and above a substrate
10/09/2012US8283695 Devices with adjustable dual-polarity trigger- and holding-votage/current for high level of electrostatic discharge protection in sub-micron mixed signal CMOS/BiCMOS integrated
10/09/2012US8283664 Disguising test pads in a semiconductor package
10/09/2012US8283663 Multichip device
10/09/2012US8283573 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
10/09/2012US8283211 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
10/05/2012DE202012103524U1 Flüssigkeitskühlelement Liquid cooling element
10/04/2012WO2012135832A2 Voltage switchable dielectric for die-level electrostatic discharge (esd) protection
10/04/2012WO2012135406A2 High density microelectronics packaging
10/04/2012WO2012134801A2 Stacked via structure for metal fuse applications
10/04/2012WO2012134710A1 Semiconductor chip with supportive terminal pad
10/04/2012WO2012134666A1 An interposer having an inductor
10/04/2012WO2012134637A1 Induced thermal gradients
10/04/2012WO2012133839A1 Substrate with built-in functional element, electronic device provided with said substrate, method for producing substrate with built-in functional element
10/04/2012WO2012133818A1 Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate
10/04/2012WO2012133587A1 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
10/04/2012WO2012133557A1 Fluorine-containing resin composition for optical element sealing, and cured product
10/04/2012WO2012133548A1 Curable resin composition and cured product
10/04/2012WO2012133400A1 Method for forming copper wire
10/04/2012WO2012133384A1 Liquid resin composition, semiconductor package, and method for manufacturing semiconductor package
10/04/2012WO2012133098A1 Semiconductor device and manufacturing method for same
10/04/2012WO2012133001A1 Sintered mo part for heat sink plate for semiconductor device and semiconductor device including same
10/04/2012WO2012132937A1 Cu-co-si-based copper alloy strip for electron material, and method for manufacturing same
10/04/2012WO2012132926A1 Method for manufacturing thermally conductive sheet, and thermally conductive sheet
10/04/2012WO2012132871A1 Cu ALLOY FILM, AND DISPLAY DEVICE AND ELECTRONIC DEVICE EACH EQUIPPED WITH SAME
10/04/2012WO2012132709A1 Power module semiconductor device
10/04/2012WO2012132657A1 Heat-conductive, pressure-sensitive adhesive composition, heat-conductive, pressure-sensitive adhesive sheet formed body, method for producing each, and electronic component
10/04/2012WO2012132656A1 Heat-conductive, pressure-sensitive adhesive composition, heat-conductive, pressure-sensitive adhesive sheet formed body, method for producing each, and electronic component
10/04/2012WO2012132592A1 Metal foil provided with electrically resistive film, and method for producing same
10/04/2012WO2012132487A1 Method for producing organic transistor
10/04/2012WO2012132383A1 Laminate sheet manufacturing device and method for manufacturing laminate sheet
10/04/2012WO2012132207A1 Semiconductor device, method of manufacturing semiconductor device, and soi substrate
10/04/2012WO2012132206A1 Semiconductor device and method for manufacturing semiconductor device
10/04/2012WO2012132019A1 Three-dimensionally mounted semiconductor device and method for manufacturing same
10/04/2012WO2012131919A1 Semiconductor device and method for manufacturing same
10/04/2012WO2012131713A1 An improved heat sink
10/04/2012WO2012131692A1 A heat sink and a method of fixing the same
10/04/2012WO2012131519A1 Thermal interface pad material with perforated liner
10/04/2012WO2012131075A1 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
10/04/2012WO2012130730A1 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
10/04/2012WO2012130696A1 Electronic module and method for the production thereof
10/04/2012WO2012129959A1 Voltage regulator brush holder assembly
10/04/2012WO2012129822A1 Packaging substrate with insulator-filled well structure and manufacturing method thereof
10/04/2012WO2012129819A1 Radio frequency emitting front end module in global system for mobile communication manufactured with quad flat non-leaded package
10/04/2012WO2012129747A1 Circulation heat dissipation system for led street lamp
10/04/2012WO2012087556A3 Device packaging with substrates having embedded lines and metal defined pads
10/04/2012WO2012082227A3 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
10/04/2012WO2012050646A3 Biomimetic chemical sensors using nanoelectronic readout of olfactory receptors
10/04/2012US20120250335 Illumination apparatus and fan unit for illumination apparatus
10/04/2012US20120249380 Integrated circuit package including miniature antenna
10/04/2012US20120249159 Stacked Via Structure For Metal Fuse Applications
10/04/2012US20120248634 Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device
10/04/2012US20120248633 Thin-film device, method of manufacturing the same, and method of manufacturing image display apparatus
10/04/2012US20120248632 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
10/04/2012US20120248631 Method for manufacturing semiconductor devices having a glass substrate
10/04/2012US20120248630 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
10/04/2012US20120248629 Semiconductor device and method of making semiconductor device
10/04/2012US20120248628 Semiconductor device and method of fabricating the same
10/04/2012US20120248627 Heat conduction for chip stacks and 3-d circuits
10/04/2012US20120248626 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
10/04/2012US20120248625 Semiconductor package comprising an optical semiconductor device
10/04/2012US20120248624 Semiconductor device and manufacturing method thereof
10/04/2012US20120248623 Via network structures and method therefor
10/04/2012US20120248622 Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods
10/04/2012US20120248621 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
10/04/2012US20120248620 Semiconductor device
10/04/2012US20120248619 Chip packaging structure
10/04/2012US20120248618 Semiconductor device and method of manufacturing the same
10/04/2012US20120248617 MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES
10/04/2012US20120248616 Electronic component, electronic equipment, and soldering paste
10/04/2012US20120248615 Mems device and manufacturing process thereof
10/04/2012US20120248614 Methods for forming a semiconductor structure and related structures
10/04/2012US20120248613 Semiconductor device and a method of manufacturing the same
10/04/2012US20120248612 Method for the production of an electronic component and electronic component produced according to this method
10/04/2012US20120248611 Interconnecting structure production method, and interconnecting structure
10/04/2012US20120248610 Semiconductor memory device and method of fabricating the same
10/04/2012US20120248609 Semiconductor device and method of manufacturing the same
10/04/2012US20120248608 Self-forming, self-aligned barriers for back-end interconnects and methods of making same
10/04/2012US20120248607 Semiconductor die having fine pitch electrical interconnects
10/04/2012US20120248606 Integrated circuit device
10/04/2012US20120248605 Semiconductor device and manufacturing method thereof
10/04/2012US20120248604 Selective electromigration improvement for high current c4s
10/04/2012US20120248603 Semiconductor device and a method of manufacturing the same
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