Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/10/2012CN102723320A Electronic component and radio frequency power amplifier
10/10/2012CN102723319A Semiconductor wire bonding structure and method
10/10/2012CN102723318A Semiconductor carrier plate
10/10/2012CN102723317A Reliable solder bump coupling within a chip scale package
10/10/2012CN102723316A 环路热管结构 Loop heat pipe structure
10/10/2012CN102723315A Core radiation structure and liquid crystal display device with core radiation structure
10/10/2012CN102723314A Insulation TO220AB power device based on aluminum radiating fin and production method
10/10/2012CN102723306A Microwave multi-chip packaging structure using silicon through hole and manufacture method thereof
10/10/2012CN102723293A Etching-first and packaging-later manufacturing method for chip inversion single-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/10/2012CN102723292A Flip chip double-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip double-faced three-dimensional circuit encapsulation structure
10/10/2012CN102723291A Flip chip double-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip double-faced three-dimensional circuit encapsulation structure
10/10/2012CN102723290A Packaging-first and etching-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
10/10/2012CN102723289A Normal chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching and normal chip single-faced three-dimensional circuit encapsulation structure
10/10/2012CN102723288A Flip chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip single-faced three-dimensional circuit encapsulation structure
10/10/2012CN102723287A Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/10/2012CN102723286A Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/10/2012CN102723285A Etching-first and packaging-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
10/10/2012CN102723284A Method for manufacturing front-mounted three-dimensional line on single side of chip by using first etching and later packaging and packaging structure of three-dimensional line
10/10/2012CN102723283A Etching-first and packaging-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/10/2012CN102723282A Etching-first and packaging-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/10/2012CN102723281A Flip chip double-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip double-faced three-dimensional circuit encapsulation structure
10/10/2012CN102723280A Flip-chip single-face three-dimensional circuit fabrication method by etching-first and packaging-second and packaging structure of flip-chip single-face three-dimensional circuit
10/10/2012CN102721905A Testing structure for improving failure analysis efficiency of breakdown voltage of insulator and using method thereof
10/10/2012CN102720997A Encapsulating structure of backlight module and LED (light-emitting diode)
10/10/2012CN102719096A Resin composition and preparation method thereof
10/10/2012CN102719058A One liquid type cyanate-epoxy composite resin composition
10/10/2012CN102214642B Combined type high-power semiconductor chip
10/10/2012CN102184873B Method for quickly preparing diamond-silicon carbide electronic packaging material
10/10/2012CN102169869B Reliability testing structure and method for detecting crystal orientation correlation of MOS (Metal Oxide Semiconductor) components
10/10/2012CN102088013B Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
10/10/2012CN102082073B Production device, production method, test apparatus and integrated circuit package
10/10/2012CN102034801B Semiconductor package structure
10/10/2012CN102026519B Radiating system
10/10/2012CN102017133B Chip-size double side connection package and method for manufacturing the same
10/10/2012CN101989596B Thermoelectric module and optical transmission apparatus
10/10/2012CN101989557B Manufacturing method of semiconductor device and semiconductor device
10/10/2012CN101971350B Thin film transistor and method for producing thin film transistor
10/10/2012CN101960589B Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
10/10/2012CN101866894B Electrode structure and light emitting element thereof
10/10/2012CN101859727B Interconnect structure
10/10/2012CN101847623B Power module
10/10/2012CN101847612B Semiconductor device and manufacturing method thereof
10/10/2012CN101842887B Method for contacting of electronic components, apparatus manufactured therefor and related equipments
10/10/2012CN101821312B Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition
10/10/2012CN101796106B Insulating sheet and multilayer structure
10/10/2012CN101794738B 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/10/2012CN101771024B Light-emitting diode (LED) and packaging method thereof
10/10/2012CN101771022B Circuit structure using graphene and manufacture method thereof
10/10/2012CN101714512B Method of fabricating semiconductor device having three-dimensional stacked structure
10/10/2012CN101690442B High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same
10/10/2012CN101662918B Heat radiating device
10/10/2012CN101650015B Light-emitting diode lamp
10/10/2012CN101641002B Radiator and radiation device using same
10/10/2012CN101622699B Interlayer insulation film, interconnect structure, and methods for production thereof
10/10/2012CN101599477B Semiconductor device and method of manufacturing the same
10/10/2012CN101593776B A self-protection structure of a power device within an expanded voltage range and method
10/10/2012CN101591472B Curable resin material composition, optical material, light-emitting device, method for producing light-emitting device, and electronic device
10/10/2012CN101572225B Semiconductor device and manufacturing method thereof
10/10/2012CN101558491B Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
10/10/2012CN101557696B Radiator unit
10/10/2012CN101553920B Methods and apparatus for a quad flat no-lead (QFN) package
10/10/2012CN101541155B Heat dissipating combination
10/10/2012CN101534624B Radiator combination
10/10/2012CN101516171B Radiation device
10/10/2012CN101451694B LED lamp
10/10/2012CN101447501B Semiconductor device and method of manufacturing the same
10/10/2012CN101419964B Device with a plurality of semiconductor chips
10/10/2012CN101399282B Solid-state image pickup device, method of manufacturing solid-state image pickup device, and image pickup device
10/10/2012CN101399247B COF package and tape substrate used in same
10/10/2012CN101378051B Semiconductor device and manufacturing method thereof
10/10/2012CN101232014B Organic illuminated display element and manufacturing method thereof
10/10/2012CN101097928B Thin film transistor array substrate and method of fabricating the same
10/09/2012USRE43720 Integrated circuit device having stacked dies and impedance balanced transmission lines
10/09/2012US8286118 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
10/09/2012US8284121 Flexible display and method for forming alignment key of the same
10/09/2012US8283792 Methods and systems for forming an alignment mark with optically mismatched alignment mark stack materials
10/09/2012US8283791 Semiconductor device and method for manufacturing same
10/09/2012US8283790 Electronic device
10/09/2012US8283789 Assembled circuit and electronic component
10/09/2012US8283788 Method of fabricating semiconductor device
10/09/2012US8283787 Semiconductor device
10/09/2012US8283786 Integrated circuit system with contact integration
10/09/2012US8283785 Interconnect regions
10/09/2012US8283784 Method for producing a power semiconductor module, and power semiconductor module comprising a connection device
10/09/2012US8283783 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
10/09/2012US8283780 Surface mount semiconductor device
10/09/2012US8283779 Peel-resistant semiconductor device with improved connector density, and method of manufacturing the same
10/09/2012US8283778 Thermally balanced via
10/09/2012US8283777 Compressive ring structure for flip chip packaging
10/09/2012US8283776 Microfabricated pillar fins for thermal management
10/09/2012US8283775 Wiring board, semiconductor device and method for manufacturing the same
10/09/2012US8283774 Chip on film type semiconductor package
10/09/2012US8283773 Semiconductor device having anti-warping sheet
10/09/2012US8283771 Multi-die integrated circuit device and method
10/09/2012US8283770 Semiconductor device and communication method
10/09/2012US8283768 Wafer Level package for heat dissipation and method of manufacturing the same
10/09/2012US8283767 Dual laminate package structure with embedded elements
10/09/2012US8283766 Ramp-stack chip package with static bends
10/09/2012US8283765 Semiconductor chip and stacked semiconductor package having the same
10/09/2012US8283764 Microelectronic assembly with an embedded waveguide adapter and method for forming the same
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