Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/11/2012WO2012137880A1 Resin composition, hardened coating films therefrom, and photosemiconductor device using same
10/11/2012WO2012137760A1 Semiconductor device and method for manufacturing semiconductor device
10/11/2012WO2012137714A1 Semiconductor device and method for manufacturing semiconductor device
10/11/2012WO2012137620A1 Semiconductor device
10/11/2012WO2012137574A1 Semiconductor device, method for manufacturing same, and portable telephone
10/11/2012WO2012137439A1 Encapsulated semiconductor device and method for producing same
10/11/2012WO2012137392A1 Semiconductor integrated circuit device
10/11/2012WO2012137338A1 Resin material, method for producing same, method for repairing same, and members using same
10/11/2012WO2012137333A1 Molded module and electric power steering apparatus
10/11/2012WO2012136719A1 Improved matching techniques for wide-bandgap power transistors
10/11/2012WO2012136579A1 Ceramic printed circuit board comprising an al cooling body
10/11/2012WO2012136331A1 Electronic component with heat-dissipating block and board employing said component
10/11/2012WO2012135915A1 Hybrid solar cell contact
10/11/2012WO2012025888A3 Light source mount
10/11/2012US20120257435 Non-salicide polysilicon fuse
10/11/2012US20120256679 Multi-layered semiconductor apparatus
10/11/2012US20120256325 Silicone resin composition and optical semiconductor device using the composition
10/11/2012US20120256324 Method for Improving Performance of Etch Stop Layer
10/11/2012US20120256323 Method for processing a semiconductor wafer or die, and particle deposition device
10/11/2012US20120256321 Layered chip package and method of manufacturing same
10/11/2012US20120256320 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/11/2012US20120256319 Method of manufacturing semiconductor device, semiconductor device, and electronic apparatus
10/11/2012US20120256318 Semiconductor device
10/11/2012US20120256317 Barrier Layer for Integrated Circuit Contacts
10/11/2012US20120256315 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
10/11/2012US20120256314 Short and low loop wire bonding
10/11/2012US20120256313 Solder ball contact susceptible to lower stress
10/11/2012US20120256312 Semiconductor device and method for fabricating the same
10/11/2012US20120256311 Semiconductor device and method of manufacturing the same
10/11/2012US20120256310 Semiconductor device
10/11/2012US20120256309 Integrated Circuit Having Pitch Reduced Patterns Relative To Photolithography Features
10/11/2012US20120256308 Method for Sealing a Micro-Cavity
10/11/2012US20120256307 Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus
10/11/2012US20120256306 Exposed die package for direct surface mounting
10/11/2012US20120256305 Integrated Circuit Package Security Fence
10/11/2012US20120256301 Self-aligned nano-structures
10/11/2012US20120256300 Semiconductor device and method for fabricating semiconductor device
10/11/2012US20120256299 Arc residue-free etching
10/11/2012US20120256295 Multilayer select devices and methods related thereto
10/11/2012US20120256293 One-time programmable devices and methods of forming the same
10/11/2012US20120256290 Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device
10/11/2012US20120256280 Packaging for fingerprint sensors and methods of manufacture
10/11/2012US20120256274 Schottky Diodes Having Metal Gate Electrodes And Methods of Formation Thereof
10/11/2012US20120256243 Semiconductor device for reducing interconnect pitch
10/11/2012US20120256236 Integrated cmos porous sensor
10/11/2012US20120256235 Layout scheme and method for forming device cells in semiconductor devices
10/11/2012US20120256194 Semiconductor device
10/11/2012US20120256180 Method of evaluating a semiconductor wafer dicing process
10/11/2012US20120255714 Hybrid fan drive with electric motor
10/11/2012DE102012205742A1 Vertikale Halbleiteranordnung und Verfahren zur Herstellung Vertical semiconductor device and process for producing
10/11/2012DE102012103024A1 Schottky-Dioden mit Metallgateelektroden und Verfahren zu deren Ausbildung Schottky diodes with metal gate electrodes and methods for their formation
10/11/2012DE102012006924A1 LED-Beleuchtungsmodul mit gleichförmiger Lichtabgabe LED lighting module with uniform light output
10/11/2012DE102011086048A1 Gehäuseseitige Trennschicht zur Stressentkopplung von vergossenen Elektroniken Housing-side interface for stress decoupling of potted electronics
10/11/2012DE102011016554A1 Waferlevel-Package und Verfahren zur Herstellung Wafer level package and method for producing
10/11/2012DE102008035252B4 Kühleinrichtung, Kühlmittel-Umlenker eines Kühlsystems und Leistungsmodul Cooler, coolant diverter a cooling system and power module
10/11/2012DE102008029829B4 Vertikal nach oben kontaktierender Halbleiter und Verfahren zu dessen Herstellung Vertically upwards contacted semiconductor and process for its preparation
10/10/2012EP2509106A1 A microstructure device comprising semiconductor devices stacked face to face and coupled by electromagnetic near field and method of forming the microstructure device
10/10/2012EP2509105A1 Semiconductor device having improved performance for high RF output powers
10/10/2012EP2509104A2 Ceramic heat sink module and manufacturing method thereof
10/10/2012EP2509103A1 Apparatus and method for thermal connection
10/10/2012EP2508569A1 Silicone resin composition and optical semiconductor device using the composition
10/10/2012EP2508546A1 Epoxy resin composition
10/10/2012EP2508545A1 Thermosetting resin composition and photosemiconductor encapsulation material
10/10/2012EP2508054A1 Power electronics unit and inverter assembly
10/10/2012EP2507833A1 Bypass capacitor circuit and method of providing a bypass capacitance for an integrated circuit die
10/10/2012EP2507832A1 Methods and apparatus for inductors with integrated passive and active elements
10/10/2012EP2507830A2 Slotted configuration for optimized placement of micro-components using adhesive bonding
10/10/2012EP2507829A1 Compact media player
10/10/2012EP2507828A1 Pre-stressed gamma densitometer window and method of fabrication
10/10/2012EP2507825A1 Sealed electronic housing and method for the sealed assembly of such a housing
10/10/2012EP2235667B1 Manufacture of a smart card
10/10/2012CN202488944U Heat radiation apparatus applying latent heat functional fluid
10/10/2012CN202488943U Radiating fin and radiating fin combination
10/10/2012CN202487575U Composite diode structure
10/10/2012CN202487568U Semiconductor module
10/10/2012CN202487567U PCB-based solid-state storage device
10/10/2012CN202487566U 半导体封装结构 The semiconductor package structure
10/10/2012CN202487565U 半导体装置 Semiconductor device
10/10/2012CN202487564U 3D lead frame structure
10/10/2012CN202487563U Radiator and communication device
10/10/2012CN202487562U Fixing structure of radiating molding set
10/10/2012CN202487561U Reverse type transistor installing and fixing mechanism
10/10/2012CN202487560U Cooling clamp and memory device using cooling clamp
10/10/2012CN202487559U Heat-radiating column
10/10/2012CN202487558U Mounting structure of chip radiator
10/10/2012CN202487557U Power diode mounting structure
10/10/2012CN202486686U Heat radiating device of computer chip
10/10/2012CN1856877B Conductor track connection structure and associated production method
10/10/2012CN102726129A Electronic component
10/10/2012CN102725845A Microelectronic device and method of manufacturing same
10/10/2012CN102725844A Conducting path, semiconductor device using conducting path, and method for producing conducting path and semiconductor device
10/10/2012CN102725843A Apparatus and method for processing a substrate
10/10/2012CN102725839A Interconnection structure made of redirected carbon nanotubes
10/10/2012CN102725836A Semiconductor device
10/10/2012CN102725618A Sensor device and method for producing sensor device
10/10/2012CN102725356A 可固化组合物 The curable composition
10/10/2012CN102723327A Novel rectifier bridge for soybean milk maker
10/10/2012CN102723323A Structure for assaying plane growth rate of metal nickel silicon compound on hydrazinium and application thereof
10/10/2012CN102723322A Testing structure for monitoring communication between emitter and base due to contact hole in germanium-silicon process
10/10/2012CN102723321A Photoelectric coupler lead frame and photoelectric coupler