Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/17/2012CN102738098A Heat radiation device and electronic part provided with the same
10/17/2012CN102738097A Heat-dissipation device composite structure
10/17/2012CN102738096A Cooling structure
10/17/2012CN102738095A Semiconductor device and manufacturing method of the semiconductor device
10/17/2012CN102738094A Semiconductor packaging structure for stacking and manufacturing method thereof
10/17/2012CN102738093A Ceramic substrate
10/17/2012CN102738092A Power module and power module fixing method towards cooler
10/17/2012CN102738091A Separation device of electronic components
10/17/2012CN102738090A Light emitting device-light receiving device assembly, and manufacturing method thereof
10/17/2012CN102738089A Semiconductor packaging structure and module thereof
10/17/2012CN102738088A Flip chip device
10/17/2012CN102738087A Chip connection structure
10/17/2012CN102738086A Assembly of stacked devices with semiconductor components
10/17/2012CN102738075A Method for adding idle contact hole of electronic programmable fuse and electronic programmable fuse
10/17/2012CN102738073A Distance piece and manufacturing method thereof
10/17/2012CN102738072A Semiconductor assembly with through-silicon via and manufacturing method thereof
10/17/2012CN102738070A Manufacturing method of semiconductor device and semiconductor device
10/17/2012CN102738067A Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different cte insulating layers
10/17/2012CN102738065A Layout scheme and method for forming device cells in semiconductor devices
10/17/2012CN102738026A Methods of forming bonded semiconductor structures and semiconductor structures formed by such methods
10/17/2012CN102738025A Method of forming bonded semiconductor structure, and semiconductor structure formed by such method
10/17/2012CN102738024A Semiconductor packaging and lead frames thereof
10/17/2012CN102738019A Technology for producing secondary plastic package of AAQFN product on basis of framework carrier open pore and die film
10/17/2012CN102738018A Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology
10/17/2012CN102738013A Chip packaging body and method for manufacturing the same
10/17/2012CN102738012A Method for producing sensor unit
10/17/2012CN102737891A Electromechanical integration switch
10/17/2012CN102737842A Thin film capacitor, mounting substrate, and method of manufacturing the mounting substrate
10/17/2012CN102736711A Structure improvement of condensation device and heat dissipation module of condensation device
10/17/2012CN102735228A Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus
10/17/2012CN102729830A Electric vehicle control device
10/17/2012CN102728957A Method for generating laser beam irradiation trajectory
10/17/2012CN102157458B Electronic component, semiconductor package and electronic device
10/17/2012CN102127663B Gold bonding wire and preparation method thereof
10/17/2012CN102117797B Anti-single-particle irradiation reinforcement circuit of CMOS integrated circuit
10/17/2012CN102110678B Semiconductor package and manufacturing method thereof
10/17/2012CN102097333B Method for designing circuit board, circuit board and electronic device
10/17/2012CN102082130B Semiconductor package piece and manufacturing method thereof
10/17/2012CN102053430B Liquid crystal display device
10/17/2012CN101978490B Electronic component module and method of manufacturing the electronic component module
10/17/2012CN101872747B Electronic component module
10/17/2012CN101847614B QFN/DFN (Quad Flat No-lead /Dual Flat No-lead) no-die chip packaging structure
10/17/2012CN101784156B Circuit board and preparation method thereof
10/17/2012CN101740525B Encapsulation structure for wafer backside
10/17/2012CN101714542B Circuit device
10/17/2012CN101606237B Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
10/17/2012CN101562176B A device of a chip module comprising a frequency enlarging device and a method
10/17/2012CN101540324B Semiconductor device
10/17/2012CN101517845B Socket, module board, and inspection system using the module board
10/17/2012CN101494227B Semiconductor device and electronic apparatus
10/17/2012CN101419990B Flexible thin-film solar cell component
10/17/2012CN101291973B 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material
10/17/2012CN101141063B Esd protection circuit using self-biased current trigger technique and pumping source mechanism
10/16/2012US8288877 Actuator enhanced alignment of self-assembled microstructures
10/16/2012US8288876 Bonding wire profile for minimizing vibration fatigue failure
10/16/2012US8288875 Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch
10/16/2012US8288874 Stackable semiconductor assemblies and methods of manufacturing such assemblies
10/16/2012US8288873 Stack package having flexible conductors
10/16/2012US8288872 Through silicon via layout
10/16/2012US8288871 Reduced-stress bump-on-trace (BOT) structures
10/16/2012US8288870 Semiconductor chip package and method for designing the same
10/16/2012US8288869 Semiconductor package with substrate having single metal layer and manufacturing methods thereof
10/16/2012US8288868 Substrate bonding method and semiconductor device
10/16/2012US8288866 Techniques for modular chip fabrication
10/16/2012US8288865 Semiconductor module having semiconductor device mounted on device mounting substrate
10/16/2012US8288864 Microwave module
10/16/2012US8288863 Semiconductor package device with a heat dissipation structure and the packaging method thereof
10/16/2012US8288862 Multiple die stack package
10/16/2012US8288861 Encapsulation for an organic electronic component, its production process and its use
10/16/2012US8288860 Memory device system with stacked packages
10/16/2012US8288859 Semiconductor device packages including a semiconductor device and a redistribution element
10/16/2012US8288858 Semiconductor device
10/16/2012US8288857 Anti-tamper microchip package based on thermal nanofluids or fluids
10/16/2012US8288856 Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
10/16/2012US8288855 Semiconductor memory device and semiconductor memory card
10/16/2012US8288854 Semiconductor package and method for making the same
10/16/2012US8288853 Three-dimensional package and method of making the same
10/16/2012US8288852 Semiconductor device
10/16/2012US8288851 Method and system for hermetically sealing packages for optics
10/16/2012US8288850 Method for packaging micromachined devices
10/16/2012US8288849 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint
10/16/2012US8288848 Semiconductor chip package including a lead frame
10/16/2012US8288847 Dual die semiconductor package
10/16/2012US8288846 Power management integrated circuit
10/16/2012US8288845 Package including proximately-positioned lead frame
10/16/2012US8288844 Integrated circuit packaging system with package stacking and method of manufacture thereof
10/16/2012US8288843 Semiconductor light-emitting device and method for manufacturing same
10/16/2012US8288842 Method for dicing semiconductor wafers
10/16/2012US8288828 Via contact structure having dual silicide layers
10/16/2012US8288792 Semiconductor chip assembly with post/base/post heat spreader
10/16/2012US8288791 Housing body and method for production thereof
10/16/2012US8288772 Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate
10/16/2012US8288666 Encasement technique for electronic circuits
10/16/2012US8288665 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
10/16/2012US8288664 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
10/16/2012US8288207 Method of manufacturing semiconductor devices
10/16/2012US8288177 SER testing for an IC chip using hot underfill
10/16/2012US8288003 Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material
10/16/2012US8287454 Analyte monitoring device and methods of use
10/16/2012US8286694 Chemically compatible, lightweight heat pipe
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