Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/18/2012US20120261794 Design structure for interconnect structure containing various capping materials for electrical fuse and other related applications
10/18/2012US20120261793 Electrical fuse and method of making the same
10/18/2012US20120261791 Wide and Deep Oxide Trench in A Semiconductor Substrate with Interspersed Vertical Oxide Ribs
10/18/2012US20120261790 Substrate structure, semiconductor device, and method for manufacturing the same
10/18/2012US20120261787 Passive devices fabricated on glass substrates, methods of manufacture and design structures
10/18/2012US20120261786 Semiconductor device, ink cartridge, and electronic device
10/18/2012US20120261749 Semiconductor device and method of manufacturing the same
10/18/2012US20120261724 Stackable programmable passive device and a testing method
10/18/2012US20120261722 Stack Of Horizontally Extending And Vertically Overlapping Features, Methods Of Forming Circuitry Components, And Methods Of Forming An Array Of Memory Cells
10/18/2012US20120261662 Integrated circuit with test circuit
10/18/2012US20120261526 Frame-like holder for a solar panel, with a cable holder
10/18/2012DE19735430B4 MOS-Transistor MOS transistor
10/18/2012DE19502598B4 Eingangspuffer für CMOS-Schaltungen Input buffers for CMOS circuits
10/18/2012DE112010004890T5 Glaskern-Substrat für Bausteine mit integrierter Schaltung und Verfahren zu dessen Herstellung Glass core substrate for integrated circuit devices and methods for the preparation thereof
10/18/2012DE112010004888T5 Substrat für IC-Bausteine mit Mehrschichtglaskern und Verfahren zu seiner Herstellung Substrate for IC devices with multi-layer core glass and process for its preparation
10/18/2012DE112008000248B4 System mit im Waferbonding-Zwischenraum gebildeten Chipkühlkanälen System formed in wafer bonding gap chip cooling channels
10/18/2012DE112006001397B4 Kohlenstoff-Nanoröhren-Verdrahtungskontakte und Verfahren zu deren Herstellung Carbon nanotube interconnect contacts and processes for their preparation
10/18/2012DE10227008B4 Kühlvorrichtung für Halbleitermodule und Elektronikanordnung Cooling device for semiconductor modules and electronics assembly
10/18/2012DE102012206047A1 Wärmestrahler und Herstellungsverfahren dafür Heat radiator and manufacturing method thereof
10/18/2012DE102012103369A1 Ein Verfahren zum Ausbilden eines Halbleiterbauelements und ein Halbleiterbauelement A method of forming a semiconductor device and a semiconductor device
10/18/2012DE102012103242A1 Chip Anordnungen und Verfahren zum Herstellen einer Chip Anordnung Chip assemblies and methods for producing a chip arrangement
10/18/2012DE102011018724A1 Cooling device of electronic component, has several connectors having channel between openings connected to cavities of hollow structures so that cavities are interconnected through channels
10/18/2012DE102011016817A1 Device for cooling mechanical seal of agitator, has thermal barrier and cooling jacket that are arranged such that heat medium in thermal barrier and cooling jacket are migrated to plate assembly through heat pipes
10/18/2012DE102011016766A1 Contact element for flat electronic components e.g. organic LED used in lamp, has electrically contacting conductive contact pad arranged on contact layer of a jammed electronic component which is supported on bottom plate
10/18/2012DE102011016764A1 Contact arrangement for planar electronic modules for organic LED in lamp, has contact foot connected with mounting portion through bar, where bar changes directions of extension along connection between mounting portion and contact foot
10/18/2012DE102011007537A1 In einem Kunststoffkörper eingebettetes Funktionselement und Verfahren zur elektrischen Kontaktierung eines in einem Kunststoffkörper eingebetteten Funktionselements In a plastic body embedded functional element and method for the electrical contacting of an embedded in a plastic body function element
10/18/2012DE10066441B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components
10/17/2012EP2511966A2 Reflecting resin sheet, light emitting diode device and producing method thereof
10/17/2012EP2511965A2 Reflecting resin sheet, light emitting diode device and producing method thereof
10/17/2012EP2511760A1 Active matrix substrate and display device
10/17/2012EP2511091A2 A high solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
10/17/2012EP2510765A1 Electronic control device
10/17/2012EP2510544A1 Chip assembly with chip-scale packaging
10/17/2012EP2510543A1 Power electronic assembly with slotted heatsink
10/17/2012EP2510542A1 Igbt cooling method
10/17/2012EP2510540A1 Circuit device comprising a semiconductor component
10/17/2012EP2510053A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
10/17/2012CN202495446U Thyristor of novel structure
10/17/2012CN202495444U Anti-irradiation packaging structure for high-density system-integration computer module
10/17/2012CN202495443U Flip chip on chip packaging
10/17/2012CN202495442U Multi-circle pins aligned quad flat non-pin package
10/17/2012CN202495441U Semiconductor packaging structure
10/17/2012CN202495440U Heat radiating fins and heat radiating device
10/17/2012CN202495439U Semiconductor packaging structure and module thereof
10/17/2012CN202495438U Thermal-enhanced flip-chip quad flat non-lead package
10/17/2012CN202495437U LGA encapsulation structure
10/17/2012CN202495436U Semiconductor packaging structure and module thereof
10/17/2012CN202494979U Safe anti-noise type CPU (Central Processing Unit) radiator
10/17/2012CN102742010A Semiconductor device with a variable integrated circuit chip bump pitch
10/17/2012CN102742009A Dap ground bond enhancement
10/17/2012CN102742008A Substrate for power module, and power module
10/17/2012CN102742007A 紧凑型媒体播放器 Compact media player
10/17/2012CN102742006A Use of calcium oxide as a water scavenger in solar module applications
10/17/2012CN102742005A Edge sealants having balanced properties
10/17/2012CN102742004A Bonded semiconductor structures and methods of forming same
10/17/2012CN102741664A Sensor module and production method of a sensor module
10/17/2012CN102741449A Al alloy film for display device
10/17/2012CN102741372A Thermally conductive pressure-sensitive adhesive composition,thermally conductive pressure-sensitive adhesive sheet,and electronic component
10/17/2012CN102741348A Curable composition, cured article, and use of curable composition
10/17/2012CN102741315A Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
10/17/2012CN102741154A Semiconductor component and corresponding production method
10/17/2012CN102740600A Electronic component, electronic equipment, and soldering paste
10/17/2012CN102738148A Power transistor device vertical integration
10/17/2012CN102738138A IGBT (Insulated Gate Bipolar Transistor) power module specific to electromobile
10/17/2012CN102738134A 半导体装置 Semiconductor device
10/17/2012CN102738133A Semiconductor device and method of fabricating the same
10/17/2012CN102738132A Semiconductor package comprising optical semiconductor device
10/17/2012CN102738131A Semiconductor module, packaging structure and packaging method thereof
10/17/2012CN102738130A Die arrangement and method of forming die arrangement
10/17/2012CN102738129A Apparatus and method for increasing bandwidths of stacked dies
10/17/2012CN102738128A Large inductance integrated magnetic induction devices and methods of fabricating the same
10/17/2012CN102738127A Novel fractal PGS (Program Generation System) structure
10/17/2012CN102738126A Die arrangements and methods of manufacturing a die arrangement
10/17/2012CN102738125A New fractal PFS structure
10/17/2012CN102738124A Novel fractal pattern grounding shield structure
10/17/2012CN102738123A Integrated circuit with test circuit
10/17/2012CN102738122A Monitoring pattern, and pattern stitch monitoring method and wafer therewith
10/17/2012CN102738121A Inspection mark for overlay deviation and preparation method thereof
10/17/2012CN102738120A Semiconductor package assembly and manufacturing method thereof
10/17/2012CN102738119A Through-silicon vias for semicondcutor substrate and method of manufacture
10/17/2012CN102738118A 半导体器件 Semiconductor devices
10/17/2012CN102738117A Interconnection structure and forming method thereof
10/17/2012CN102738116A Electronic component-embeded board and method for manufacturing same
10/17/2012CN102738115A Integrated circuit device and method for manufacturing same
10/17/2012CN102738114A Non-salicide polysilicon fuse
10/17/2012CN102738113A Monolithic integrated capacitors for high-efficiency power converters
10/17/2012CN102738112A Packaging substrate and method of fabricating same
10/17/2012CN102738111A Chip packaging structure
10/17/2012CN102738110A Surface-mounted type lead frame
10/17/2012CN102738109A Lead frame and semiconductor device
10/17/2012CN102738108A Lead frame with molded inner leads
10/17/2012CN102738107A Electronic component, semiconductor package and electronic device
10/17/2012CN102738106A Electronic component, semiconductor package and electronic device
10/17/2012CN102738105A Semiconductor device and method of manufacturing the same
10/17/2012CN102738104A Via network structures and method therefor
10/17/2012CN102738103A Short and low loop wire bonding
10/17/2012CN102738102A Integrated circuit device
10/17/2012CN102738101A Semiconductor stereoscopic packaging structure
10/17/2012CN102738100A Positive tube holder for serial thyristors
10/17/2012CN102738099A Novel high-reliability power module