| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/08/2015 | US20150008566 Method and structure of panelized packaging of semiconductor devices |
| 01/08/2015 | US20150008565 High-frequency package |
| 01/08/2015 | US20150008525 Semiconductor device |
| 01/08/2015 | US20150008511 Bond pad stack for transistors |
| 01/08/2015 | US20150008445 III-Nitride Device and FET in a Package |
| 01/08/2015 | US20150008443 Semiconductor device |
| 01/08/2015 | US20150008435 Sensor and method for fabricating the same |
| 01/08/2015 | US20150008430 Semiconductor device and manufacturing method thereof |
| 01/08/2015 | US20150008254 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
| 01/08/2015 | US20150008251 Method and apparatus for measuring a free air ball size during wire bonding |
| 01/08/2015 | DE112013001928T5 Isolierschicht, Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung Insulating layer, A method of manufacturing a semiconductor device and semiconductor device |
| 01/08/2015 | DE112013001798T5 Kühleinheiten für photovoltaische Module Cooling units for photovoltaic modules |
| 01/08/2015 | DE112008001410B4 Halbleiterelementkühlstruktur und Verwendung davon Semiconductor element cooling structure and use thereof |
| 01/08/2015 | DE102014213069A1 Verfahren zum Herstellen eines markierten einkristallinen Substrats und Halbleiterbauelement mit Markierung A method of manufacturing a labeled single-crystal substrate and semiconductor device with marking |
| 01/08/2015 | DE102014213064A1 Einrichtung zum Erfassen eines vorausrichtenden Elements an einem Wafer Means for detecting a forward-directing element to a wafer |
| 01/08/2015 | DE102014212720A1 Sensor mit abdichtender Beschichtung Sensor with sealing coating |
| 01/08/2015 | DE102014212376A1 Halbleitervorrichtung Semiconductor device |
| 01/08/2015 | DE102014109223A1 Lead-Frame Tasche Lead Frame Bag |
| 01/08/2015 | DE102013213348A1 Leistungshalbleitermodul und elektrischer Antrieb mit einem Leistungshalbleitermodul The power semiconductor module and electrical drive with a power semiconductor module |
| 01/08/2015 | DE102013212925A1 Kontrollvorrichtung und Verfahren zum Überwachen einer Funktion eines Halbleiterbauelements während dessen Betrieb sowie Elektrische Baugruppe mit einer Kontrollvorrichtung Control device and method for monitoring a function of a semiconductor device during its operation, as well as electrical assembly with a control device |
| 01/08/2015 | DE102013107057A1 Organische Leuchtdiode und Anordnung mit einer solchen Leuchtdiode Organic light-emitting diode array and with such a light-emitting diode |
| 01/08/2015 | DE102013106937A1 Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement A method for producing an optoelectronic component and optoelectronic component |
| 01/08/2015 | DE102013106855A1 Verfahren zum Herstellen eines optoelektronischen Bauelements, optoelektronisches Bauelement und Verwendung einer flüssigen ersten Legierung zum Herstellen eines optoelektronischen Bauelements A method of manufacturing an optoelectronic component, an optoelectronic component and first use of a liquid alloy for fabricating an optoelectronic component |
| 01/08/2015 | DE102011075515B4 Verbessertes Leistungshalbleiterbauelementmodul Improved power semiconductor device module |
| 01/08/2015 | DE102010054761B4 Abgedichtete elektronische Steuereinrichtung und Verfahren zum Herstellen derselben Sealed electronic control device and method for manufacturing the same |
| 01/08/2015 | DE102010016455B4 Halbleiterbauelement, Herstellungsverfahren für ein Halbleiterbauelement, sowie integrierte Leistungsschaltung A semiconductor device manufacturing method for a semiconductor device, and power integrated circuit |
| 01/08/2015 | DE102007020249B4 Halbleiterbauelement, Halbleitersensorstruktur sowie Vorrichtung und Verfahren zum Herstellen eines Halbleiterbauelement Semiconductor device, the semiconductor sensor structure as well as apparatus and method for manufacturing a semiconductor device |
| 01/08/2015 | DE102006029682B4 Halbleiterstruktur und Verfahren zur Herstellung der Struktur Semiconductor structure and method for making the structure |
| 01/07/2015 | EP2822032A2 Semiconductor device |
| 01/07/2015 | EP2822031A2 Semiconductor device and method for manufacturing the same |
| 01/07/2015 | EP2821456A1 Putty-like heat transfer material and method for producing same |
| 01/07/2015 | EP2820924A1 Circuit board assembly |
| 01/07/2015 | EP2820713A1 Semiconductor module with integrated waveguide for radar signals |
| 01/07/2015 | EP2820675A1 Integrated circuit with electromagnetic energy anomaly detection and processing |
| 01/07/2015 | EP2820674A1 Semiconductor module having integrated antenna structures |
| 01/07/2015 | EP2820673A1 Substrate with enlarged chip island |
| 01/07/2015 | EP2820672A2 Wire arrangement for an electronic circuit and method of manufacturing the same |
| 01/07/2015 | EP2820671A1 Structure and method for strain-relieved tsv |
| 01/07/2015 | EP2820472A1 Methods and apparatus to form electronic circuitry on ophthalmic devices |
| 01/07/2015 | CN204090411U 热管装配结构及其手机 Heat pipe assembly structure and cell phone |
| 01/07/2015 | CN204090289U 线路板的列引脚封装结构和线路板 PCB column pin package and board structure |
| 01/07/2015 | CN204088327U 鳍式场效晶体管 Fin field-effect transistors |
| 01/07/2015 | CN204088305U 新型高密度可堆叠封装结构 New high-density stackable package |
| 01/07/2015 | CN204088304U 半导体测试结构 Semiconductor test structure |
| 01/07/2015 | CN204088303U 一种红外遥控接收放大器 An infrared remote control receiver amplifier |
| 01/07/2015 | CN204088302U 一种减少薄铝层芯片损伤的芯片封装结构 A method of reducing damage to the thin aluminum layer chip chip package |
| 01/07/2015 | CN204088301U 基于铜球预压平的芯片封装装置 Based on the pre-flattened copper ball chip packaging equipment |
| 01/07/2015 | CN204088300U 两片式矩阵型md直插式框架 Two-matrix type md-line frame |
| 01/07/2015 | CN204088299U 一种新型sot223-3l封装引线框架 A new package leadframe sot223-3l |
| 01/07/2015 | CN204088298U 一种新型sop-8l封装引线框架 A new sop-8l leadframe package |
| 01/07/2015 | CN204088297U 大功率二极管器件 High-power diode device |
| 01/07/2015 | CN204088296U 一种芯片电极引出的铜跳片 A chip electrode lead-copper jumper |
| 01/07/2015 | CN204088295U 具有大功率半导体模块和冷却装置的结构以及冷却系统 Having the power semiconductor module and the cooling device and the cooling system of the structure |
| 01/07/2015 | CN204088294U 半导体激光发射器带热沉陶瓷外壳 Semiconductor laser transmitter with ceramic heat sink shell |
| 01/07/2015 | CN204088293U 半导体芯片封装结构 The semiconductor chip package structure |
| 01/07/2015 | CN204088292U 芯片封装结构 Chip package |
| 01/07/2015 | CN204088291U 用于保护芯片的密封环结构和芯片单元 Used to protect the chip seal ring structure and the chip unit |
| 01/07/2015 | CN204075623U 一种电脑显示器背板左侧基板的结构 Structure of a computer monitor back on the left side of the substrate |
| 01/07/2015 | CN104272888A 冷却器、电气元器件单元及制冷装置 Coolers, electrical components unit and refrigeration equipment |
| 01/07/2015 | CN104272481A 压电有源冷却设备 Piezoelectric active cooling device |
| 01/07/2015 | CN104272457A 具有偏移再分布层固位焊盘的晶片级封装管芯 Wafer level package having an offset die redistribution layer retention pad |
| 01/07/2015 | CN104272456A 镀铝铜结合导线及制作其的方法 Copper wire and aluminum combine their production methods |
| 01/07/2015 | CN104272455A 镀铝铜结合导线及制作其的方法 Copper wire and aluminum combine their production methods |
| 01/07/2015 | CN104272454A 半导体模块以及半导体装置 The semiconductor module and semiconductor device |
| 01/07/2015 | CN104272453A 使用相变材料和散热器对集成电路的热管理 Using a phase change material and heat sink for thermal management of integrated circuits |
| 01/07/2015 | CN104271641A 树脂-线性有机硅氧烷嵌段共聚物的组合物 Resin - linear organosiloxane composition block copolymer |
| 01/07/2015 | CN104269397A 一种全局曝光像素单元中防漏光存储电容及其形成方法 A Global exposure pixel unit leak optical storage capacitor and method of forming |
| 01/07/2015 | CN104269396A 寄生晶闸管以及静电保护电路 Parasitic thyristor and electrostatic protection circuit |
| 01/07/2015 | CN104269395A 一种低介电常数介质刻蚀与铜互连的结构及集成方法 A low dielectric constant and dielectric etch copper interconnect structures and integrated approach |
| 01/07/2015 | CN104269394A 电容器及其制备方法 Capacitor and its preparation method |
| 01/07/2015 | CN104269393A 一体金属框架静电释放圈用于指纹传感器结构及制造方法 One metal frame for electrostatic discharge ring fingerprint sensor structure and method of manufacture |
| 01/07/2015 | CN104269392A 一种功率器件 A power devices |
| 01/07/2015 | CN104269391A 一种焊盘结构及其制备方法 One kind of pad structure and its preparation method |
| 01/07/2015 | CN104269390A 半导体组件及制造半导体组件的方法 The method of manufacturing a semiconductor device, a semiconductor component |
| 01/07/2015 | CN104269389A 适于氧化钒或掺杂氧化钒薄膜的电极材料及其制备方法 Suitable electrode material and method of vanadium oxide or doped vanadium oxide thin films |
| 01/07/2015 | CN104269388A 垂直集成系统 Vertical integration system |
| 01/07/2015 | CN104269387A 一种直流换流阀散热器电极的提取方法 A DC converter valve radiator electrode extraction method |
| 01/07/2015 | CN104269386A 一种多芯片封装粘结层导热齿结构 A multi-chip package tooth structure thermal adhesive layer |
| 01/07/2015 | CN104269385A 封装组件及其制造方法 Packaging component and manufacturing method thereof |
| 01/07/2015 | CN104269384A 嵌入式芯片 Embedded chips |
| 01/07/2015 | CN104269383A 整流桥及其外壳、边框与底板的过渡焊接技术 Rectifier bridge and its casing, frame and chassis welding technology transition |
| 01/07/2015 | CN104269382A 基于高温共烧陶瓷技术的x波段高可靠表贴型陶瓷外壳 Based on high-temperature co-fired ceramic technology, x-band high-reliability surface-mount ceramic shell |
| 01/07/2015 | CN104263291A 粘接剂组合物、膜状粘接剂和电路部件的连接结构 Connection structure adhesive composition, adhesive film and the circuit member |
| 01/07/2015 | CN104262970A 用于产生透明硅氧烷材料和光学器件的硅氧烷组合物 Creation of transparent silicone material and optics silicone composition |
| 01/07/2015 | CN102931094B 具有增大焊接接触面的晶圆级封装结构及制备方法 Welding the contact surface has an increased wafer level package structure and method of preparation |
| 01/07/2015 | CN102884617B 半导体装置 Semiconductor device |
| 01/07/2015 | CN102879961B 一种显示面板及显示装置 A display panel and a display device |
| 01/07/2015 | CN102832183B 一种采用弹性装置的无外引脚扁平半导体封装结构 One kind of elastic means no external pin flat semiconductor package |
| 01/07/2015 | CN102782857B 半导体装置 Semiconductor device |
| 01/07/2015 | CN102738102B 集成电路装置 The integrated circuit device |
| 01/07/2015 | CN102723320B 一种电子元器件及一种射频功率放大器 An electronic components and A radio frequency power amplifiers |
| 01/07/2015 | CN102709265B 半导体光器件表面贴装封装结构及其封装方法 Semiconductor optical device surface mount package and packaging method |
| 01/07/2015 | CN102693956B 信号变压电路 Signal transformer circuit |
| 01/07/2015 | CN102683299B 树脂密封型半导体装置及树脂密封用模具 Resin sealing type semiconductor device and the resin sealing mold |
| 01/07/2015 | CN102623412B 半导体晶片、半导体条、半导体晶片的制造方法、半导体条的制造方法、半导体元件的制造方法 The method of manufacturing a semiconductor wafer, a semiconductor article manufacturing method of a semiconductor wafer, a semiconductor manufacturing method of the semiconductor element |
| 01/07/2015 | CN102623305B 金属-多层绝缘体-金属电容器及其制造方法、集成电路 Metals - multilayer insulator - metal capacitor and method for manufacturing integrated circuits |
| 01/07/2015 | CN102612253B 内连线结构及使用该结构的装置、线路结构与方法 Interconnection structure and use of the device, circuit structure and method of the structure |
| 01/07/2015 | CN102576682B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 01/07/2015 | CN102548210B 内藏电容基板模块 Built-in capacitor circuit board module |
| 01/07/2015 | CN102543921B 焊垫结构及其制造方法 Pad structure and manufacturing method |