Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/23/2012US8294271 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder
10/23/2012US8294270 Copper alloy via bottom liner
10/23/2012US8294269 Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
10/23/2012US8294268 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device
10/23/2012US8294267 Elongated structure element with second material on its end portions that differs from the first material in electrical conductivity, chemical reactivity, composition
10/23/2012US8294266 Conductor bump method and apparatus
10/23/2012US8294265 Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor
10/23/2012US8294264 Radiate under-bump metallization structure for semiconductor devices
10/23/2012US8294263 Light-emitting diode packaging structure and module and assembling method thereof
10/23/2012US8294262 LED chip package
10/23/2012US8294261 Protruding TSV tips for enhanced heat dissipation for IC devices
10/23/2012US8294260 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
10/23/2012US8294259 Interconnect pattern for transceiver package
10/23/2012US8294258 Power semiconductor module
10/23/2012US8294257 Power block and power semiconductor module using same
10/23/2012US8294256 Chip package structure and method of making the same
10/23/2012US8294255 Semiconductor package
10/23/2012US8294254 Chip scale surface mounted semiconductor device package and process of manufacture
10/23/2012US8294253 Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure
10/23/2012US8294252 Stacked semiconductor substrates
10/23/2012US8294251 Stacked semiconductor package with localized cavities for wire bonding
10/23/2012US8294250 Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate
10/23/2012US8294249 Lead frame package
10/23/2012US8294248 Chip on leads
10/23/2012US8294247 High-power device having thermocouple embedded therein and method for manufacturing the same
10/23/2012US8294239 Effective eFuse structure
10/23/2012US8294220 Method for forming silicide contacts
10/23/2012US8294214 Semiconductor device with signal wirings and dummy wirings that pass through under electrode pads and in which the number of dummy wirings near the peripheral portion of the device being greater than at a more centrally located portion
10/23/2012US8294167 Light emitting diode with high electrostatic discharge and fabrication method thereof
10/23/2012US8294152 Electronic circuit including pixel electrode comprising conductive film
10/23/2012US8294149 Test structure and methodology for three-dimensional semiconductor structures
10/23/2012US8293586 Method of manufacturing an electronic system
10/23/2012US8293585 Solid-state imaging device and method for making the same
10/23/2012US8293581 Semiconductor chip with protective scribe structure
10/23/2012US8293580 Method of forming package-on-package and device related thereto
10/23/2012US8293579 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
10/23/2012US8293578 Hybrid bonding techniques for multi-layer semiconductor stacks
10/23/2012US8293575 Manufacturing method of semiconductor device
10/23/2012US8293553 Method for producing an area having reduced electrical conductivity within a semiconductor layer and optoelectronic semiconductor element
10/23/2012US8293545 Critical dimension for trench and vias
10/23/2012US8292159 Fabrication method of semiconductor integrated circuit device
10/23/2012US8291966 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
10/22/2012DE202012008533U1 Wärmerohr, Kühlmodul und elektronische Verbindung Heat pipe cooling module and electronic connection
10/18/2012WO2012142601A2 Lead frame strip for reduced mold sticking during degating
10/18/2012WO2012142592A1 Through package via structures in panel-based silicon substrates and methods of making the same
10/18/2012WO2012141908A1 Low temperature deposition of silicon oxide films
10/18/2012WO2012141089A1 Display device and method for manufacturing same
10/18/2012WO2012141003A1 Semiconductor device and method for manufacturing same
10/18/2012WO2012140936A1 Electronic component and method for manufacturing electronic component
10/18/2012WO2012140934A1 High-frequency package
10/18/2012WO2012140908A1 Laminate sheet, circuit board, and semiconductor package
10/18/2012WO2012140907A1 Laminate sheet, circuit board, semiconductor package, and method for producing laminate sheet
10/18/2012WO2012140750A1 Method for manufacturing semiconductor device, resin sealing device, and semiconductor device
10/18/2012WO2012140271A1 Hemt transistors consisting of (iii-b)-n wide bandgap semiconductors comprising boron
10/18/2012WO2012140156A1 Functional element embedded in a plastic body and method for making electrical contact with a functional element embedded in a plastic body
10/18/2012WO2012139935A1 Cooling device for an electronic module of a household appliance, and assembly and domestic appliance comprising a cooling device
10/18/2012WO2012139437A1 Two-point clamping device for high-power thyristor
10/18/2012WO2012102496A3 Cooling element having improved assembly productivity and battery modules including same
10/18/2012WO2012089314A3 A method for fabricating a semiconductor device
10/18/2012WO2012078709A3 Compliant interconnects in wafers
10/18/2012US20120264240 Semiconductor device and manufacturing method thereof
10/18/2012US20120262883 Heat radiator and manufacturing method thereof
10/18/2012US20120262040 Solar panel housing
10/18/2012US20120261841 Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same
10/18/2012US20120261840 Semiconductor device
10/18/2012US20120261839 Dicing tape-integrated wafer back surface protective film
10/18/2012US20120261838 Multi-chip package and method of providing die-to-die interconnects in same
10/18/2012US20120261837 Semiconductor device
10/18/2012US20120261836 Active area bonding compatible high current structures
10/18/2012US20120261835 Semiconductor device
10/18/2012US20120261834 Semiconductor device
10/18/2012US20120261833 Semiconductor device having a multilayer interconnection structure
10/18/2012US20120261832 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261830 Mems device etch stop
10/18/2012US20120261829 Middle of line structures and methods for fabrication
10/18/2012US20120261828 Interconnect structure and method for fabricating on-chip interconnect structures by image reversal
10/18/2012US20120261827 Through-silicon vias for semicondcutor substrate and method of manufacture
10/18/2012US20120261826 Tsv structure and method for forming the same
10/18/2012US20120261825 Semiconductor device
10/18/2012US20120261824 Metal density aware signal routing
10/18/2012US20120261823 Interconnect structures with engineered dielectrics with nanocolumnar porosity
10/18/2012US20120261821 Wafer level package having a stress relief spacer and manufacturing method thereof
10/18/2012US20120261819 Bridging arrangement and method for manufacturing a bridging arrangement
10/18/2012US20120261818 Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
10/18/2012US20120261817 Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
10/18/2012US20120261816 Device package substrate and method of manufacturing the same
10/18/2012US20120261815 Sealed surface acoustic wave element package
10/18/2012US20120261814 Packaging an Electronic Device
10/18/2012US20120261813 Reinforced via farm interconnect structure, a method of forming a reinforced via farm interconnect structure and a method of redesigning an integrated circuit chip to include such a reinforced via farm interconnect structure
10/18/2012US20120261812 Semiconductor chip with patterned underbump metallization
10/18/2012US20120261811 Semiconductor device
10/18/2012US20120261810 Integrated circuit package system with waferscale spacer
10/18/2012US20120261809 Chip package and manufacturing method thereof
10/18/2012US20120261808 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
10/18/2012US20120261807 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device
10/18/2012US20120261806 Lead frame strip for reduced mold sticking during degating
10/18/2012US20120261805 Through package via structures in panel-based silicon substrates and methods of making the same
10/18/2012US20120261801 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261796 Die arrangements and methods of manufacturing a die arrangement
10/18/2012US20120261795 Anti-fuse device structure and electroplating circuit structure and method
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