Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/25/2012DE102012008068A1 Optionen für mehrere Ebenen eines Leistungs-MOSFET Options for multiple levels of a power MOSFET
10/25/2012DE102011018544A1 Method for connecting mating face of substrate, electronic portion and mating face of electronic portion for electronic component, involves forming film between mating face(s) and adhering mating face(s) with intermediate film
10/25/2012DE102011018450A1 Semiconductor device i.e. complementary metal-oxide semiconductor device, for dual CPU assembly, has n-doped region, and transistor structure including potential terminal that is connected with tub terminal over resistor
10/25/2012DE102010050764B4 ESD-Schutzschaltung ESD protection circuit
10/25/2012DE102007017546B4 Mehrzahl von Multichipmodulen und Verfahren zur Herstellung Plurality of multichip modules, and methods for preparing
10/25/2012DE102005030466B4 Halbleiterwafer mit Verdrahtungsstrukturen und Halbleiterbauelement sowie Verfahren zur Herstellung desselben Of the same semiconductor wafer having wiring patterns, and semiconductor device and methods for preparing
10/25/2012DE10157240B4 Kühlkörper und Verfahren zur Herstellung desselben Of the same heat sink and method for the production
10/24/2012EP2515435A2 Power amplifier
10/24/2012EP2515332A2 Bondwireless Power Module with Three-Dimensional Current Routing
10/24/2012EP2515331A1 Engine start control apparatus
10/24/2012EP2515330A1 Electronic component package
10/24/2012EP2515329A1 Method for producing electronic device, electronic device, method for producing electronic device package, and electronic device package
10/24/2012EP2515326A1 Etchant and method for manufacturing semiconductor device using same
10/24/2012EP2513970A2 Apparatus and method for embedding components in small-form-factor, system-on-packages
10/24/2012EP2513969A1 Via structure integrated in electronic substrate
10/24/2012EP2513968A1 Panel based lead frame packaging method and device
10/24/2012EP2513967A2 Apparatus and method for controlling semiconductor die warpage
10/24/2012EP2513958A2 Hermetic electrical feedthrough
10/24/2012EP2513957A2 Method for producing an electronic unit and electronic unit
10/24/2012EP2513956A1 Circuit board with via trace connection and method of making the same
10/24/2012EP2159838B1 Liquid-cooled-type cooling device
10/24/2012CN202502993U Power supply chip
10/24/2012CN202502992U Nut power terminal, power module containing the same and circuit system
10/24/2012CN202502991U Semiconductor package structure
10/24/2012CN202502990U Highly reliable chip-level package structure
10/24/2012CN1988083B Thin-film capacitor and method for fabricating the same, electronic device and circuit board
10/24/2012CN1901208B Array substrate for display device
10/24/2012CN102754535A Method for manufacturing an electronic box
10/24/2012CN102754204A Power electronic module with non-linear resistive field grading and method for its manufacturing
10/24/2012CN102754203A Bond pad with multiple layer over pad metallization and method of formation
10/24/2012CN102754202A Heat radiation device and electronic equipment using the same
10/24/2012CN102754195A Circuit board with via trace connection and method of making the same
10/24/2012CN102754194A Substrate wiring method and semiconductor manufacturing device
10/24/2012CN102753735A Heat sink material
10/24/2012CN102753620A Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
10/24/2012CN102753481A Spherical hydrotalcite compound and resin composition for electronic component encapsulation
10/24/2012CN102752958A Multilayered printed circuit board and method for manufacturing the same
10/24/2012CN102751268A MOSFET pair with stack capacitor and manufacturing method thereof
10/24/2012CN102751267A Semiconductor packaging structure for stacking and manufacturing method thereof
10/24/2012CN102751265A Substrate stacking structure
10/24/2012CN102751264A Capacitor structure with metal bilayer and method for using the same
10/24/2012CN102751263A Static-proof integrated circuit structure
10/24/2012CN102751262A Light-attack-preventing semiconductor component for protection circuit and running method
10/24/2012CN102751261A Chip stack package
10/24/2012CN102751260A Compact vertical inductors extending in vertical planes
10/24/2012CN102751259A Integrated circuit device and method of manufacturing the same
10/24/2012CN102751258A 半导体集成电路 The semiconductor integrated circuit
10/24/2012CN102751257A Chip on board (COB) module and manufacture method thereof
10/24/2012CN102751256A Packaging substrate of embedded passive assembly and manufacture method of packaging substrate
10/24/2012CN102751255A Semiconductor bond pad structure, manufacturing method thereof and integrated circuit
10/24/2012CN102751254A Semiconductor packaging piece, stack packaging piece using semiconductor packaging piece and manufacturing method of semiconductor packaging piece
10/24/2012CN102751253A Semiconductor Device and Bonding Wire
10/24/2012CN102751252A Array package and arranging structure thereof
10/24/2012CN102751251A Semiconductor package and stacked semiconductor package having
10/24/2012CN102751250A Cooling device
10/24/2012CN102751249A Heat radiator and manufacturing method thereof
10/24/2012CN102751248A Packaging structure with embedded perforation chip and manufacture method thereof
10/24/2012CN102751247A High-compactness low-temperature cofired ceramic package structure and ceramic material thereof
10/24/2012CN102751246A Power semiconductor module and manufacturing method thereof
10/24/2012CN102751235A Semiconductor device and fabricating method thereof
10/24/2012CN102751234A Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus
10/24/2012CN102751215A Lower epitaxial layer resistance measuring structure for ultra-structural power device structure
10/24/2012CN102751205A Semiconductor device and method of manufacturing the same
10/24/2012CN102751203A Semiconductor encapsulation structure and manufacture method of semiconductor encapsulation structure
10/24/2012CN102751201A Method of manufacturing power module substrate and power module substrate
10/24/2012CN102751177A Capacitor structure and preparation method thereof
10/24/2012CN102748971A Flexible heat-transfer device based on low-melting metal joints
10/24/2012CN102157524B 半导体集成电路 The semiconductor integrated circuit
10/24/2012CN102130021B Silicon carbide power module and packaging method thereof
10/24/2012CN102122621B Method for tightly combining heat radiation fin with heat pipe
10/24/2012CN102054788B Circuitry component
10/24/2012CN101924040B Chip repairing method and chip stack structure
10/24/2012CN101901824B Organic electro-luminescence display device and method for fabricating the same
10/24/2012CN101834176B Half-bridge drive circuit chip
10/24/2012CN101809088B Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
10/24/2012CN101784176B Insulated heat radiation structure of electronic part
10/24/2012CN101720165B Component built-in wiring substrate and manufacturing method thereof
10/24/2012CN101692448B Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof
10/24/2012CN101582439B Organic light emitting display and method for making the same
10/24/2012CN101557100B Bidirectional and reverse blocking battery switch
10/24/2012CN101488517B Organic light emitting display device and its forming method
10/24/2012CN101383366B Image sensor and method for manufacturing same
10/24/2012CN101364604B Display device
10/24/2012CN101126016B Heat interface materials
10/23/2012US8296576 Method for scrambling the current consumption of an integrated circuit
10/23/2012US8295900 Terminal apparatus with built-in fault current limiter for superconducting cable system
10/23/2012US8295832 Method and system for providing information to a home system regarding a wireless unit roaming in a visited system
10/23/2012US8294284 Package stacking through rotation
10/23/2012US8294283 Semiconductor device and manufacturing method thereof
10/23/2012US8294282 Semiconductor device and adhesive sheet
10/23/2012US8294281 Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device
10/23/2012US8294280 Panelized backside processing for thin semiconductors
10/23/2012US8294279 Chip package with dam bar restricting flow of underfill
10/23/2012US8294278 Methods for pitch reduction
10/23/2012US8294277 Semiconductor memory device with wiring layout pattern structure
10/23/2012US8294276 Semiconductor device and fabricating method thereof
10/23/2012US8294275 Chip package and method for forming the same
10/23/2012US8294274 Semiconductor contact barrier
10/23/2012US8294273 Methods for fabricating and filling conductive vias and conductive vias so formed
10/23/2012US8294272 Power module
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