Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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10/30/2012 | US8299531 CMOS ESD clamp with input and separate output voltage terminal for ESD protection |
10/30/2012 | US8299514 High density integrated circuitry for semiconductor memory having memory cells with a minimum capable photolithographic feature dimension |
10/30/2012 | US8299503 Memory cell for modification of revision identifier in an integrated circuit chip |
10/30/2012 | US8299464 Comparator receiving expected and mask data from circuit pads |
10/30/2012 | US8299463 Test structure for charged particle beam inspection and method for defect determination using the same |
10/30/2012 | US8298963 Semiconductor device and manufacturing method of the same |
10/30/2012 | US8298962 Device made of single-crystal silicon |
10/30/2012 | US8298944 Warpage control for die with protruding TSV tips during thermo-compressive bonding |
10/30/2012 | US8298930 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof |
10/30/2012 | US8298919 Manufacturing method of semiconductor device and semiconductor device |
10/30/2012 | US8298917 Process for wet singulation using a dicing singulation structure |
10/30/2012 | US8298903 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
10/30/2012 | US8298880 Method for manufacturing coating film with coating liquid |
10/30/2012 | US8298868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole |
10/30/2012 | US8298866 Wafer level package and fabrication method |
10/30/2012 | US8298857 Negative feedback avalanche diode |
10/30/2012 | US8297517 Antenna circuit constituent body for IC card/tag and IC card |
10/30/2012 | US8296941 Conformal shielding employing segment buildup |
10/29/2012 | DE202012007882U1 Vorrichtung zum Kühlen von elektronischen Bauteilen in einem Gehäuse Apparatus for cooling of electronic components in a housing |
10/26/2012 | WO2012145484A1 Interposer having molded low cte dielectric |
10/26/2012 | WO2012145480A1 Reinforced fan-out wafer-level package |
10/26/2012 | WO2012145477A1 Multiple die face-down stacking for two or more die |
10/26/2012 | WO2012145373A1 Vias in porous substrates |
10/26/2012 | WO2012145370A1 Multi-chip module with stacked face-down connected dies |
10/26/2012 | WO2012145201A1 Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
10/26/2012 | WO2012145149A1 Above motherboard interposer with peripheral circuits |
10/26/2012 | WO2012145115A1 Stacked chip-on-board module with edge connector |
10/26/2012 | WO2012145114A1 Flip-chip, face-up and face-down wirebond combination package |
10/26/2012 | WO2012145038A1 Method of direct silicon tiling of a tiled image sensor array |
10/26/2012 | WO2012144995A1 Heterogeneous electrocaloric effect heat transfer device |
10/26/2012 | WO2012144951A1 A starting substrate for semiconductor engineering having substrate-through connections and a method for making same |
10/26/2012 | WO2012144673A1 Apparatus for manufacturing semiconductor device |
10/26/2012 | WO2012144538A1 Electronic apparatus |
10/26/2012 | WO2012144493A1 Solder resist, solder resist starting material, led substrate, light-emitting module, apparatus having light-emitting module, method for producing led substrate, method for producing light-emitting module, and method for producing apparatus having light-emitting module |
10/26/2012 | WO2012144355A1 Encapsulating liquid resin composition, semiconductor device using encapsulating liquid resin composition, and method for producing semiconductor device |
10/26/2012 | WO2012143964A1 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device |
10/26/2012 | WO2012143784A2 Semiconductor device and manufacturing method thereof |
10/26/2012 | WO2012143060A1 Improvements in or relating to thyristor clamped assemblies |
10/26/2012 | WO2012142737A1 Dissipation utilizing flow of refreigerant |
10/26/2012 | WO2012142701A1 A routing layer for mitigating stress in a semiconductor die |
10/26/2012 | WO2012118297A3 Cooling apparatus in which a heat pipe and heat sink are coupled, and the structure of which enables improved productivity |
10/26/2012 | WO2012095330A3 Cooling device for a super conductor and super conducting synchronous machine |
10/26/2012 | WO2012064636A4 Contact pad and method of manufacturing the same |
10/25/2012 | US20120272112 Semiconductor devices and semiconductor packages |
10/25/2012 | US20120269489 Dram package, dram module including dram package, graphic module including dram package and multimedia device including dram package |
10/25/2012 | US20120269006 Semiconductor device |
10/25/2012 | US20120268899 Reinforced fan-out wafer-level package |
10/25/2012 | US20120268670 Contact structure and semiconductor device |
10/25/2012 | US20120267803 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
10/25/2012 | US20120267802 Position determination in a lithography system using a substrate having a partially reflective position mark |
10/25/2012 | US20120267801 Integrated circuit package system employing mold flash prevention technology |
10/25/2012 | US20120267800 Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Level Chip Scale Package |
10/25/2012 | US20120267798 Multiple die face-down stacking for two or more die |
10/25/2012 | US20120267797 Flip-chip, face-up and face-down wirebond combination package |
10/25/2012 | US20120267796 Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
10/25/2012 | US20120267795 Semiconductor device |
10/25/2012 | US20120267794 Structure and design structure for high-q value inductor and method of manufacturing the same |
10/25/2012 | US20120267793 Semiconductor device and method for manufacturing the same |
10/25/2012 | US20120267792 Semiconductor device |
10/25/2012 | US20120267791 Multi chip package, manufacturing method thereof, and memory system having the multi chip package |
10/25/2012 | US20120267790 Semiconductor integrated circuit |
10/25/2012 | US20120267789 Vias in porous substrates |
10/25/2012 | US20120267788 Hybrid TSV and Method for Forming the Same |
10/25/2012 | US20120267787 Wafer Level Chip Scale Package Method Using Clip Array |
10/25/2012 | US20120267786 Microelectronic devices with through-silicon vias and associated methods of manufacturing |
10/25/2012 | US20120267785 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby |
10/25/2012 | US20120267784 Semiconductor Device and Bonding Wire |
10/25/2012 | US20120267783 Stacked-substrate structure |
10/25/2012 | US20120267782 Package-on-package semiconductor device |
10/25/2012 | US20120267781 Mechanisms for forming copper pillar bumps using patterned anodes |
10/25/2012 | US20120267780 Chip package and method for forming the same |
10/25/2012 | US20120267779 Semiconductor package |
10/25/2012 | US20120267778 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device |
10/25/2012 | US20120267777 Multi-chip module with stacked face-down connected dies |
10/25/2012 | US20120267776 Chip stack package |
10/25/2012 | US20120267775 System and Method to Manufacture an Implantable Electrode |
10/25/2012 | US20120267774 Method of manufacturing a semiconductor device and semiconductor device |
10/25/2012 | US20120267773 Functional Capping |
10/25/2012 | US20120267772 Semiconductor device and method of manufacturing the same |
10/25/2012 | US20120267771 Stacked chip-on-board module with edge connector |
10/25/2012 | US20120267770 Device and method including a soldering process |
10/25/2012 | US20120267769 Integrated circuit package with segregated tx and rx data channels |
10/25/2012 | US20120267768 Formation of alpha particle shields in chip packaging |
10/25/2012 | US20120267765 Wafer-leveled chip packaging structure and method thereof |
10/25/2012 | US20120267756 Semiconductor Package with Embedded Spiral Inductor |
10/25/2012 | US20120267755 Semiconductor device with electric fuse having a flowing-out region |
10/25/2012 | US20120267751 Interposer having molded low cte dielectric |
10/25/2012 | US20120267740 Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus |
10/25/2012 | US20120267626 Transmission Line Characterization Using EM Calibration |
10/25/2012 | US20120267600 Memory cell repair |
10/25/2012 | US20120267490 Trapezoidal rib mounting bracket |
10/25/2012 | US20120267346 Support assembly |
10/25/2012 | US20120267082 Cooling system assembly for a crop sprayer |
10/25/2012 | US20120266462 Sealed electronic housing and method for the sealed assembly of such a housing |
10/25/2012 | DE202011103481U1 Überschlagsschutz für eine Anordnung eines Halbleiterbauelements auf einem Substrat Rollover protection for an arrangement of a semiconductor device on a substrate |
10/25/2012 | DE112006000954B4 Halbleiterpaket und Verfahren zur Herstellung Semiconductor package and method for producing |
10/25/2012 | DE10223526B4 Kühlvorrichtung von hoher Leistung Cooling device of high performance |
10/25/2012 | DE102012206360A1 Kühlvorrichtung Cooler |
10/25/2012 | DE102012103517A1 Dummy-Strukturen und Verfahren Dummy structures and procedures |
10/25/2012 | DE102012103157A1 Halbleitervorrichtung und Bonddraht Semiconductor device and bonding wire |