Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/30/2012US8299531 CMOS ESD clamp with input and separate output voltage terminal for ESD protection
10/30/2012US8299514 High density integrated circuitry for semiconductor memory having memory cells with a minimum capable photolithographic feature dimension
10/30/2012US8299503 Memory cell for modification of revision identifier in an integrated circuit chip
10/30/2012US8299464 Comparator receiving expected and mask data from circuit pads
10/30/2012US8299463 Test structure for charged particle beam inspection and method for defect determination using the same
10/30/2012US8298963 Semiconductor device and manufacturing method of the same
10/30/2012US8298962 Device made of single-crystal silicon
10/30/2012US8298944 Warpage control for die with protruding TSV tips during thermo-compressive bonding
10/30/2012US8298930 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
10/30/2012US8298919 Manufacturing method of semiconductor device and semiconductor device
10/30/2012US8298917 Process for wet singulation using a dicing singulation structure
10/30/2012US8298903 Monitor pattern of semiconductor device and method of manufacturing semiconductor device
10/30/2012US8298880 Method for manufacturing coating film with coating liquid
10/30/2012US8298868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
10/30/2012US8298866 Wafer level package and fabrication method
10/30/2012US8298857 Negative feedback avalanche diode
10/30/2012US8297517 Antenna circuit constituent body for IC card/tag and IC card
10/30/2012US8296941 Conformal shielding employing segment buildup
10/29/2012DE202012007882U1 Vorrichtung zum Kühlen von elektronischen Bauteilen in einem Gehäuse Apparatus for cooling of electronic components in a housing
10/26/2012WO2012145484A1 Interposer having molded low cte dielectric
10/26/2012WO2012145480A1 Reinforced fan-out wafer-level package
10/26/2012WO2012145477A1 Multiple die face-down stacking for two or more die
10/26/2012WO2012145373A1 Vias in porous substrates
10/26/2012WO2012145370A1 Multi-chip module with stacked face-down connected dies
10/26/2012WO2012145201A1 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
10/26/2012WO2012145149A1 Above motherboard interposer with peripheral circuits
10/26/2012WO2012145115A1 Stacked chip-on-board module with edge connector
10/26/2012WO2012145114A1 Flip-chip, face-up and face-down wirebond combination package
10/26/2012WO2012145038A1 Method of direct silicon tiling of a tiled image sensor array
10/26/2012WO2012144995A1 Heterogeneous electrocaloric effect heat transfer device
10/26/2012WO2012144951A1 A starting substrate for semiconductor engineering having substrate-through connections and a method for making same
10/26/2012WO2012144673A1 Apparatus for manufacturing semiconductor device
10/26/2012WO2012144538A1 Electronic apparatus
10/26/2012WO2012144493A1 Solder resist, solder resist starting material, led substrate, light-emitting module, apparatus having light-emitting module, method for producing led substrate, method for producing light-emitting module, and method for producing apparatus having light-emitting module
10/26/2012WO2012144355A1 Encapsulating liquid resin composition, semiconductor device using encapsulating liquid resin composition, and method for producing semiconductor device
10/26/2012WO2012143964A1 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
10/26/2012WO2012143784A2 Semiconductor device and manufacturing method thereof
10/26/2012WO2012143060A1 Improvements in or relating to thyristor clamped assemblies
10/26/2012WO2012142737A1 Dissipation utilizing flow of refreigerant
10/26/2012WO2012142701A1 A routing layer for mitigating stress in a semiconductor die
10/26/2012WO2012118297A3 Cooling apparatus in which a heat pipe and heat sink are coupled, and the structure of which enables improved productivity
10/26/2012WO2012095330A3 Cooling device for a super conductor and super conducting synchronous machine
10/26/2012WO2012064636A4 Contact pad and method of manufacturing the same
10/25/2012US20120272112 Semiconductor devices and semiconductor packages
10/25/2012US20120269489 Dram package, dram module including dram package, graphic module including dram package and multimedia device including dram package
10/25/2012US20120269006 Semiconductor device
10/25/2012US20120268899 Reinforced fan-out wafer-level package
10/25/2012US20120268670 Contact structure and semiconductor device
10/25/2012US20120267803 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
10/25/2012US20120267802 Position determination in a lithography system using a substrate having a partially reflective position mark
10/25/2012US20120267801 Integrated circuit package system employing mold flash prevention technology
10/25/2012US20120267800 Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Level Chip Scale Package
10/25/2012US20120267798 Multiple die face-down stacking for two or more die
10/25/2012US20120267797 Flip-chip, face-up and face-down wirebond combination package
10/25/2012US20120267796 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
10/25/2012US20120267795 Semiconductor device
10/25/2012US20120267794 Structure and design structure for high-q value inductor and method of manufacturing the same
10/25/2012US20120267793 Semiconductor device and method for manufacturing the same
10/25/2012US20120267792 Semiconductor device
10/25/2012US20120267791 Multi chip package, manufacturing method thereof, and memory system having the multi chip package
10/25/2012US20120267790 Semiconductor integrated circuit
10/25/2012US20120267789 Vias in porous substrates
10/25/2012US20120267788 Hybrid TSV and Method for Forming the Same
10/25/2012US20120267787 Wafer Level Chip Scale Package Method Using Clip Array
10/25/2012US20120267786 Microelectronic devices with through-silicon vias and associated methods of manufacturing
10/25/2012US20120267785 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby
10/25/2012US20120267784 Semiconductor Device and Bonding Wire
10/25/2012US20120267783 Stacked-substrate structure
10/25/2012US20120267782 Package-on-package semiconductor device
10/25/2012US20120267781 Mechanisms for forming copper pillar bumps using patterned anodes
10/25/2012US20120267780 Chip package and method for forming the same
10/25/2012US20120267779 Semiconductor package
10/25/2012US20120267778 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
10/25/2012US20120267777 Multi-chip module with stacked face-down connected dies
10/25/2012US20120267776 Chip stack package
10/25/2012US20120267775 System and Method to Manufacture an Implantable Electrode
10/25/2012US20120267774 Method of manufacturing a semiconductor device and semiconductor device
10/25/2012US20120267773 Functional Capping
10/25/2012US20120267772 Semiconductor device and method of manufacturing the same
10/25/2012US20120267771 Stacked chip-on-board module with edge connector
10/25/2012US20120267770 Device and method including a soldering process
10/25/2012US20120267769 Integrated circuit package with segregated tx and rx data channels
10/25/2012US20120267768 Formation of alpha particle shields in chip packaging
10/25/2012US20120267765 Wafer-leveled chip packaging structure and method thereof
10/25/2012US20120267756 Semiconductor Package with Embedded Spiral Inductor
10/25/2012US20120267755 Semiconductor device with electric fuse having a flowing-out region
10/25/2012US20120267751 Interposer having molded low cte dielectric
10/25/2012US20120267740 Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus
10/25/2012US20120267626 Transmission Line Characterization Using EM Calibration
10/25/2012US20120267600 Memory cell repair
10/25/2012US20120267490 Trapezoidal rib mounting bracket
10/25/2012US20120267346 Support assembly
10/25/2012US20120267082 Cooling system assembly for a crop sprayer
10/25/2012US20120266462 Sealed electronic housing and method for the sealed assembly of such a housing
10/25/2012DE202011103481U1 Überschlagsschutz für eine Anordnung eines Halbleiterbauelements auf einem Substrat Rollover protection for an arrangement of a semiconductor device on a substrate
10/25/2012DE112006000954B4 Halbleiterpaket und Verfahren zur Herstellung Semiconductor package and method for producing
10/25/2012DE10223526B4 Kühlvorrichtung von hoher Leistung Cooling device of high performance
10/25/2012DE102012206360A1 Kühlvorrichtung Cooler
10/25/2012DE102012103517A1 Dummy-Strukturen und Verfahren Dummy structures and procedures
10/25/2012DE102012103157A1 Halbleitervorrichtung und Bonddraht Semiconductor device and bonding wire