Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2012
10/31/2012CN102760712A Semiconductor package
10/31/2012CN102760711A 半导体器件及其编程方法 Semiconductor device and programming
10/31/2012CN102760710A Through-silicon via structure and formation method thereof
10/31/2012CN102760709A Loop heat pipe structure
10/31/2012CN102760708A Phase change turbocharging radiating cooling device
10/31/2012CN102760707A ECU (Electronic Control Unit) assembly and vehicle comprising same
10/31/2012CN102760706A Heat-dissipation device
10/31/2012CN102760705A Heat radiator
10/31/2012CN102760704A Chip on film type semiconductor package
10/31/2012CN102760703A Composite substrate for high-power component
10/31/2012CN102760702A Substrate and electronic device using same
10/31/2012CN102760700A Method for forming self-aligned contact and integrated circuit with a self-aligned contact
10/31/2012CN102760695A Multilayer interconnect structure and method for integrated circuits
10/31/2012CN102760694A Method of forming oxide encapsulated conductive features
10/31/2012CN102760689A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/31/2012CN102760688A Dual damascene structure and formation method thereof as well as semiconductor device
10/31/2012CN102760687A Semiconductor device with air space and manufacture method thereof
10/31/2012CN102760686A Semiconductor device and forming method of interconnection structure
10/31/2012CN102760668A Single-side three-dimensional circuit chip upside-down-charging packaging-before-etching method and packaging structure thereof
10/31/2012CN102760667A Semiconductor packaging method for forming two-sided electromagnetic shielding layer as well as construction thereof
10/31/2012CN102760665A Semiconductor packaging structure and method for making the same
10/31/2012CN102760664A Semiconductor device and method of making a semiconductor device
10/31/2012CN102756456A Die for pre-plastic package of a lead frame and encapsulation structure
10/31/2012CN102306632B Planarization method suitable for photoetching technology
10/31/2012CN102222659B 半导体集成电路 The semiconductor integrated circuit
10/31/2012CN102034794B Test structure and method for testing semiconductor substrate
10/31/2012CN102034748B Integrated circuit device and preparation method thereof
10/31/2012CN101996898B Cmos image sensor and manufacturing method thereof
10/31/2012CN101924079B Semiconductor chip package structure
10/31/2012CN101887896B Semiconductor chip and method of repair design of the same
10/31/2012CN101853840B Structure of embedded line substrate and manufacturing method thereof
10/31/2012CN101752355B Light-emitting device
10/31/2012CN101740474B Method for manufacturing semiconductor device and dual-damascene structure
10/31/2012CN101697344B Method for reducing current on bonded leads of power supply pads of chip
10/31/2012CN101697339B Mechanism for monitoring CMP sinking degree of damascene and resistivity test method thereof
10/31/2012CN101694836B Method of manufacturing semiconductor device
10/31/2012CN101542394B Photosensitive siloxane composition, hardened film formed therefrom and device having the hardened film
10/31/2012CN101517737B Flip-chip interconnection through chip vias
10/31/2012CN101512756B Semiconductor die package including stacked dice and heat sink structures
10/31/2012CN101416312B Method and circuits for sensing on-chip voltage in powerup mode
10/31/2012CN101369562B Plate-type heat-pipe radiator and use thereof
10/31/2012CN101271906B Photoreceptor integrated circuit and optoelectronic component comprising the same
10/31/2012CN101241900B Semiconductor integrated circuit
10/30/2012US8301214 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
10/30/2012US8300279 Image reading devices
10/30/2012US8300128 Solid-state image pickup device and electronic apparatus
10/30/2012US8299925 RFID tag and manufacturing method thereof
10/30/2012US8299706 Hermetic encapsulation of organic, electro-optical elements
10/30/2012US8299633 Semiconductor chip device with solder diffusion protection
10/30/2012US8299632 Routing layer for mitigating stress in a semiconductor die
10/30/2012US8299631 Semiconductor element and display device provided with the same
10/30/2012US8299630 Microstructure with reactive bonding
10/30/2012US8299629 Wafer-bump structure
10/30/2012US8299627 Semiconductor packages and electronic systems including the same
10/30/2012US8299625 Borderless interconnect line structure self-aligned to upper and lower level contact vias
10/30/2012US8299624 Semiconductor device, circuit substrate, and electronic device
10/30/2012US8299623 Semiconductor package
10/30/2012US8299622 IC having viabar interconnection and related method
10/30/2012US8299621 Semiconductor device having wiring layer with a wide wiring and fine wirings
10/30/2012US8299620 Semiconductor device with welded leads and method of manufacturing the same
10/30/2012US8299617 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects
10/30/2012US8299616 T-shaped post for semiconductor devices
10/30/2012US8299615 Methods and structures for controlling wafer curvature
10/30/2012US8299614 Interconnection structure, a thin film transistor substrate, and a manufacturing method thereof, as well as a display device
10/30/2012US8299612 IC devices having TSVS including protruding tips having IMC blocking tip ends
10/30/2012US8299611 Ball-limiting-metallurgy layers in solder ball structures
10/30/2012US8299610 Semiconductor device having RF shielding and method therefor
10/30/2012US8299609 Product chips and die with a feature pattern that contains information relating to the product chip
10/30/2012US8299608 Enhanced thermal management of 3-D stacked die packaging
10/30/2012US8299607 Semiconductor device
10/30/2012US8299606 Semiconductor device includes a ceramic substrate and heat sink
10/30/2012US8299605 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
10/30/2012US8299603 Power semiconductor device
10/30/2012US8299602 Semiconductor device including leadframe with increased I/O
10/30/2012US8299601 Power semiconductor module and manufacturing method thereof
10/30/2012US8299600 Semiconductor device and manufacturing method thereof
10/30/2012US8299599 Semiconductor device
10/30/2012US8299598 Grid array packages and assemblies including the same
10/30/2012US8299597 Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package
10/30/2012US8299596 Integrated circuit packaging system with bump conductors and method of manufacture thereof
10/30/2012US8299595 Integrated circuit package system with package stacking and method of manufacture thereof
10/30/2012US8299594 Stacked ball grid array package module utilizing one or more interposer layers
10/30/2012US8299593 Stack package made of chip scale packages
10/30/2012US8299592 Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules
10/30/2012US8299591 Semiconductor package and stacked semiconductor package having the same
10/30/2012US8299590 Semiconductor assembly having reduced thermal spreading resistance and methods of making same
10/30/2012US8299589 Packaging device of image sensor
10/30/2012US8299588 Structure and method for uniform current distribution in power supply module
10/30/2012US8299587 Lead frame package structure for side-by-side disposed chips
10/30/2012US8299586 Semiconductor device and method of manufacturing the same
10/30/2012US8299585 Power semiconductor device
10/30/2012US8299584 Alignment of wafers for 3D integration
10/30/2012US8299583 Two-sided semiconductor structure
10/30/2012US8299581 Passivation layer extension to chip edge
10/30/2012US8299580 Semiconductor wafer and a method of separating the same
10/30/2012US8299570 Efuse containing sige stack
10/30/2012US8299568 Damage propagation barrier
10/30/2012US8299566 Through wafer vias and method of making same
10/30/2012US8299533 Vertical NPNP structure in a triple well CMOS process
10/30/2012US8299532 ESD protection device structure
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