Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/01/2012US20120273938 Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar
11/01/2012US20120273937 Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer
11/01/2012US20120273936 Micro Bump And Method For Forming The Same
11/01/2012US20120273935 Semiconductor Device and Method of Making a Semiconductor Device
11/01/2012US20120273934 Reduced-stress bump-on-trace (bot) structures
11/01/2012US20120273933 Three-dimensional system-in-a-package
11/01/2012US20120273932 Power supply module and packaging and integrating method thereof
11/01/2012US20120273931 Integrated circuit chip package and manufacturing method thereof
11/01/2012US20120273930 Semiconductor package structure and method of fabricating the same
11/01/2012US20120273929 Multi-die packages incorporating flip chip dies and associated packaging methods
11/01/2012US20120273928 Chip on film type semiconductor package
11/01/2012US20120273927 Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package
11/01/2012US20120273926 Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die
11/01/2012US20120273919 Semiconductor cell and method for forming the same
11/01/2012US20120273917 High Voltage Resistance Coupling Structure
11/01/2012US20120273873 Package with multiple dies
11/01/2012US20120273843 Semiconductor memory device and repair method thereof
11/01/2012US20120273841 Methods for Cell Phasing and Placement in Dynamic Array Architecture and Implementation of the Same
11/01/2012US20120273831 Semiconductor device, process for producing same, and display device
11/01/2012US20120273799 Semiconductor device and fabrication method for the same
11/01/2012US20120273782 Interposers of 3-dimensional integrated circuit package systems and methods of designing the same
11/01/2012US20120273781 Device and Method For RF Characterization of Nanostructures and High Impedance Devices
11/01/2012US20120273775 Semiconductor-on-diamond devices and methods of forming
11/01/2012US20120273172 Heat dissipation device
10/2012
10/31/2012EP2519089A1 Circuit module
10/31/2012EP2519085A1 Many-up wiring substrate, wiring substrate, and electronic device
10/31/2012EP2518766A2 Power module with press-fit clamps
10/31/2012EP2518765A2 Switching assembly with contact springs
10/31/2012EP2518764A2 Group III nitride based flip-chip integrated circuit and method for fabricating
10/31/2012EP2518759A1 Etchant and method for manufacturing semiconductor device using same
10/31/2012EP2517247A1 Method for producing an infrared light detector
10/31/2012EP2517242A2 Semiconductor chip device with solder diffusion protection
10/31/2012EP2517241A1 Window interposed die packaging
10/31/2012EP2517240A2 Microelectronic assembly with joined bond elements having lowered inductance
10/31/2012EP2517239A1 Method for producing an electronic component and electronic component produced according to said method
10/31/2012EP2517238A1 Method of vertically mounting an integrated circuit
10/31/2012EP2517232A2 A method to form lateral pad on edge of wafer
10/31/2012EP2489956A9 Cooling system of an electric construction element that heats up
10/31/2012EP1215724B1 Wire bonded semiconductor device with low capacitance coupling
10/31/2012DE112011100120T5 Integrierte Hohlraumfüllung mit einer Silizium-Durchkontaktierung Integrated cavity filling using a Through-silicon via
10/31/2012DE112010003451T5 Selektives Züchten von Nanoröhren innerhalb von Durchgangskontakten unter Verwendungeines lonenstrahls Selective growth of nanotubes within passage contacts using one ion beam
10/31/2012DE10359200B4 Verfahren zur Reduzierung eines Überdeckungsfehlers A method for reducing an overlay error
10/31/2012DE102012206024A1 Verfahren zum Bilden oxideingekapselter leitfähiger Merkmale A method of forming conductive features oxideingekapselter
10/31/2012DE102011100037A1 Strahlung emittierender Halbleiterchip mit integriertem ESD-Schutz Radiation-emitting semiconductor chip with integrated ESD protection
10/31/2012DE102011088715A1 Integrierter Transformator Integrated transformer
10/31/2012DE102011075009A1 Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche und Vorrichtung mit einer Kontaktfläche und einer damit verbundenen Gegenkontaktfläche Arranged on a carrier contact face for connection to a further carrier which is arranged on a counter-contact surface, and with a contact surface and an associated counter-contact surface
10/31/2012DE102011018851A1 Connection-less building block e.g. quad-flat no-leads building block has contacts with through hole, which is extended along vertical dimension of lower surface along transverse complete vertical dimension of contact
10/31/2012DE102011017790A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
10/31/2012DE102011017521A1 Elektrische Anordnung mit Beschichtung und Getriebeanordnung mit einer solchen Anordung An electrical assembly with coating and gear arrangement with such arrangement
10/31/2012CN202514229U Bridged special-shaped conductive heat radiating fin
10/31/2012CN202514169U Efficient heat dissipation type printed circuit board (PCB)
10/31/2012CN202513159U Device realized by adopting Bipolar low-voltage technology
10/31/2012CN202513158U Electric encapsulation structure with chip arranged on light-sensing component
10/31/2012CN202513156U LED device with shared voltage-limiting unit and individual voltage-equalizing resistor
10/31/2012CN202513151U Novel rectifier bridge connecting piece
10/31/2012CN202513150U Solar battery pack
10/31/2012CN202513149U Structural module of array substrate alignment mark, array substrate and display device
10/31/2012CN202513148U Improved packaging structure of semiconductor chip
10/31/2012CN202513147U Novel chip packaging mechanism
10/31/2012CN202513146U Semiconductor chip-packaging structure
10/31/2012CN202513145U Chip packaging structure
10/31/2012CN202513144U Combined high-voltage high-power field effect tube
10/31/2012CN202513143U Jumper of bridge rectifier
10/31/2012CN202513142U Stirling heat pipe radiator
10/31/2012CN202513141U Combined structure of heat-radiating device
10/31/2012CN202513140U Improved packaging structure of wire bonding chip
10/31/2012CN202513139U Lead-combination chip package structure
10/31/2012CN202513138U Chip on film chip package structure
10/31/2012CN202513137U Heat dissipation device of isolated gate bipolar transistor in photovoltaic grid-connected inverter
10/31/2012CN202513136U Substrate for encapsulating semiconductor
10/31/2012CN202504006U Capsulate structure for electronic ear tag
10/31/2012CN102763496A Cooling structure for electronic device
10/31/2012CN102763492A Metallization having high power compatibility and high electrical conductivity
10/31/2012CN102763327A Acoustic wave device
10/31/2012CN102763221A Method for producing an infrared light detector
10/31/2012CN102763217A Semiconductor die package structure
10/31/2012CN102763216A Thermally conductive sheet
10/31/2012CN102763215A Method of vertically mounting an integrated circuit
10/31/2012CN102763206A Module manufacturing method
10/31/2012CN102763205A High frequency module manufacturing method
10/31/2012CN102762779A Metal laminate structure and production method for same
10/31/2012CN102762770A Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein
10/31/2012CN102762659A One-pack epoxy resin composition, and use thereof
10/31/2012CN102760742A Electronic device and manufacturing method thereof
10/31/2012CN102760728A Chip testing structure and testing method
10/31/2012CN102760727A Testing device and method of electromigration of interconnection line
10/31/2012CN102760726A Semiconductor detection structure, as well as forming method and detection method thereof
10/31/2012CN102760725A Metal silicide bridging test structure, forming method and test method
10/31/2012CN102760724A Integrally-packaged power semiconductor device
10/31/2012CN102760723A Semiconductor device
10/31/2012CN102760722A Integrated circuit structure including a copper-aluminum interconnect and method for fabricating the same
10/31/2012CN102760721A Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
10/31/2012CN102760720A Electronic programmable fuse wire vacant active area adding method and electronic programmable fuse wire
10/31/2012CN102760719A Antifuse element for integrated circuit device
10/31/2012CN102760718A Semiconductor device, display device, and electronic device
10/31/2012CN102760717A SOT223-3L packaging lead frame
10/31/2012CN102760716A TO-252 package lead framework structure
10/31/2012CN102760715A Package structure having embedded electronic component and fabrication method thereof
10/31/2012CN102760714A Electrode structure and IGBT (Insulated Gate Bipolar Translator) module adopting same
10/31/2012CN102760713A Chip-packaging module for a chip and a method for forming a chip-packaging module