Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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11/01/2012 | US20120273938 Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar |
11/01/2012 | US20120273937 Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer |
11/01/2012 | US20120273936 Micro Bump And Method For Forming The Same |
11/01/2012 | US20120273935 Semiconductor Device and Method of Making a Semiconductor Device |
11/01/2012 | US20120273934 Reduced-stress bump-on-trace (bot) structures |
11/01/2012 | US20120273933 Three-dimensional system-in-a-package |
11/01/2012 | US20120273932 Power supply module and packaging and integrating method thereof |
11/01/2012 | US20120273931 Integrated circuit chip package and manufacturing method thereof |
11/01/2012 | US20120273930 Semiconductor package structure and method of fabricating the same |
11/01/2012 | US20120273929 Multi-die packages incorporating flip chip dies and associated packaging methods |
11/01/2012 | US20120273928 Chip on film type semiconductor package |
11/01/2012 | US20120273927 Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package |
11/01/2012 | US20120273926 Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die |
11/01/2012 | US20120273919 Semiconductor cell and method for forming the same |
11/01/2012 | US20120273917 High Voltage Resistance Coupling Structure |
11/01/2012 | US20120273873 Package with multiple dies |
11/01/2012 | US20120273843 Semiconductor memory device and repair method thereof |
11/01/2012 | US20120273841 Methods for Cell Phasing and Placement in Dynamic Array Architecture and Implementation of the Same |
11/01/2012 | US20120273831 Semiconductor device, process for producing same, and display device |
11/01/2012 | US20120273799 Semiconductor device and fabrication method for the same |
11/01/2012 | US20120273782 Interposers of 3-dimensional integrated circuit package systems and methods of designing the same |
11/01/2012 | US20120273781 Device and Method For RF Characterization of Nanostructures and High Impedance Devices |
11/01/2012 | US20120273775 Semiconductor-on-diamond devices and methods of forming |
11/01/2012 | US20120273172 Heat dissipation device |
10/31/2012 | EP2519089A1 Circuit module |
10/31/2012 | EP2519085A1 Many-up wiring substrate, wiring substrate, and electronic device |
10/31/2012 | EP2518766A2 Power module with press-fit clamps |
10/31/2012 | EP2518765A2 Switching assembly with contact springs |
10/31/2012 | EP2518764A2 Group III nitride based flip-chip integrated circuit and method for fabricating |
10/31/2012 | EP2518759A1 Etchant and method for manufacturing semiconductor device using same |
10/31/2012 | EP2517247A1 Method for producing an infrared light detector |
10/31/2012 | EP2517242A2 Semiconductor chip device with solder diffusion protection |
10/31/2012 | EP2517241A1 Window interposed die packaging |
10/31/2012 | EP2517240A2 Microelectronic assembly with joined bond elements having lowered inductance |
10/31/2012 | EP2517239A1 Method for producing an electronic component and electronic component produced according to said method |
10/31/2012 | EP2517238A1 Method of vertically mounting an integrated circuit |
10/31/2012 | EP2517232A2 A method to form lateral pad on edge of wafer |
10/31/2012 | EP2489956A9 Cooling system of an electric construction element that heats up |
10/31/2012 | EP1215724B1 Wire bonded semiconductor device with low capacitance coupling |
10/31/2012 | DE112011100120T5 Integrierte Hohlraumfüllung mit einer Silizium-Durchkontaktierung Integrated cavity filling using a Through-silicon via |
10/31/2012 | DE112010003451T5 Selektives Züchten von Nanoröhren innerhalb von Durchgangskontakten unter Verwendungeines lonenstrahls Selective growth of nanotubes within passage contacts using one ion beam |
10/31/2012 | DE10359200B4 Verfahren zur Reduzierung eines Überdeckungsfehlers A method for reducing an overlay error |
10/31/2012 | DE102012206024A1 Verfahren zum Bilden oxideingekapselter leitfähiger Merkmale A method of forming conductive features oxideingekapselter |
10/31/2012 | DE102011100037A1 Strahlung emittierender Halbleiterchip mit integriertem ESD-Schutz Radiation-emitting semiconductor chip with integrated ESD protection |
10/31/2012 | DE102011088715A1 Integrierter Transformator Integrated transformer |
10/31/2012 | DE102011075009A1 Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche und Vorrichtung mit einer Kontaktfläche und einer damit verbundenen Gegenkontaktfläche Arranged on a carrier contact face for connection to a further carrier which is arranged on a counter-contact surface, and with a contact surface and an associated counter-contact surface |
10/31/2012 | DE102011018851A1 Connection-less building block e.g. quad-flat no-leads building block has contacts with through hole, which is extended along vertical dimension of lower surface along transverse complete vertical dimension of contact |
10/31/2012 | DE102011017790A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device |
10/31/2012 | DE102011017521A1 Elektrische Anordnung mit Beschichtung und Getriebeanordnung mit einer solchen Anordung An electrical assembly with coating and gear arrangement with such arrangement |
10/31/2012 | CN202514229U Bridged special-shaped conductive heat radiating fin |
10/31/2012 | CN202514169U Efficient heat dissipation type printed circuit board (PCB) |
10/31/2012 | CN202513159U Device realized by adopting Bipolar low-voltage technology |
10/31/2012 | CN202513158U Electric encapsulation structure with chip arranged on light-sensing component |
10/31/2012 | CN202513156U LED device with shared voltage-limiting unit and individual voltage-equalizing resistor |
10/31/2012 | CN202513151U Novel rectifier bridge connecting piece |
10/31/2012 | CN202513150U Solar battery pack |
10/31/2012 | CN202513149U Structural module of array substrate alignment mark, array substrate and display device |
10/31/2012 | CN202513148U Improved packaging structure of semiconductor chip |
10/31/2012 | CN202513147U Novel chip packaging mechanism |
10/31/2012 | CN202513146U Semiconductor chip-packaging structure |
10/31/2012 | CN202513145U Chip packaging structure |
10/31/2012 | CN202513144U Combined high-voltage high-power field effect tube |
10/31/2012 | CN202513143U Jumper of bridge rectifier |
10/31/2012 | CN202513142U Stirling heat pipe radiator |
10/31/2012 | CN202513141U Combined structure of heat-radiating device |
10/31/2012 | CN202513140U Improved packaging structure of wire bonding chip |
10/31/2012 | CN202513139U Lead-combination chip package structure |
10/31/2012 | CN202513138U Chip on film chip package structure |
10/31/2012 | CN202513137U Heat dissipation device of isolated gate bipolar transistor in photovoltaic grid-connected inverter |
10/31/2012 | CN202513136U Substrate for encapsulating semiconductor |
10/31/2012 | CN202504006U Capsulate structure for electronic ear tag |
10/31/2012 | CN102763496A Cooling structure for electronic device |
10/31/2012 | CN102763492A Metallization having high power compatibility and high electrical conductivity |
10/31/2012 | CN102763327A Acoustic wave device |
10/31/2012 | CN102763221A Method for producing an infrared light detector |
10/31/2012 | CN102763217A Semiconductor die package structure |
10/31/2012 | CN102763216A Thermally conductive sheet |
10/31/2012 | CN102763215A Method of vertically mounting an integrated circuit |
10/31/2012 | CN102763206A Module manufacturing method |
10/31/2012 | CN102763205A High frequency module manufacturing method |
10/31/2012 | CN102762779A Metal laminate structure and production method for same |
10/31/2012 | CN102762770A Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein |
10/31/2012 | CN102762659A One-pack epoxy resin composition, and use thereof |
10/31/2012 | CN102760742A Electronic device and manufacturing method thereof |
10/31/2012 | CN102760728A Chip testing structure and testing method |
10/31/2012 | CN102760727A Testing device and method of electromigration of interconnection line |
10/31/2012 | CN102760726A Semiconductor detection structure, as well as forming method and detection method thereof |
10/31/2012 | CN102760725A Metal silicide bridging test structure, forming method and test method |
10/31/2012 | CN102760724A Integrally-packaged power semiconductor device |
10/31/2012 | CN102760723A Semiconductor device |
10/31/2012 | CN102760722A Integrated circuit structure including a copper-aluminum interconnect and method for fabricating the same |
10/31/2012 | CN102760721A Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program |
10/31/2012 | CN102760720A Electronic programmable fuse wire vacant active area adding method and electronic programmable fuse wire |
10/31/2012 | CN102760719A Antifuse element for integrated circuit device |
10/31/2012 | CN102760718A Semiconductor device, display device, and electronic device |
10/31/2012 | CN102760717A SOT223-3L packaging lead frame |
10/31/2012 | CN102760716A TO-252 package lead framework structure |
10/31/2012 | CN102760715A Package structure having embedded electronic component and fabrication method thereof |
10/31/2012 | CN102760714A Electrode structure and IGBT (Insulated Gate Bipolar Translator) module adopting same |
10/31/2012 | CN102760713A Chip-packaging module for a chip and a method for forming a chip-packaging module |