Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/06/2012US8304890 Semiconductor device
11/06/2012US8304889 Power semiconductor module and fabrication method thereof
11/06/2012US8304888 Integrated circuit package with embedded components
11/06/2012US8304887 Module package with embedded substrate and leadframe
11/06/2012US8304886 Semiconductor device having integral structure of contact pad and conductive line
11/06/2012US8304885 Semiconductor device and electronic apparatus equipped with the semiconductor device
11/06/2012US8304884 Semiconductor device including spacer element
11/06/2012US8304883 Semiconductor device having multiple semiconductor elements
11/06/2012US8304882 Power semiconductor device
11/06/2012US8304881 Flip-chip, face-up and face-down wirebond combination package
11/06/2012US8304880 Integrated circuit packaging system with package-on-package and method of manufacture thereof
11/06/2012US8304879 Spiral staircase shaped stacked semiconductor package and method for manufacturing the same
11/06/2012US8304878 Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof
11/06/2012US8304877 Semiconductor device
11/06/2012US8304875 Semiconductor packages
11/06/2012US8304874 Stackable integrated circuit package system
11/06/2012US8304873 Manufacturing method for display device and display device
11/06/2012US8304872 Lead frame, method for manufacturing the same and semiconductor device
11/06/2012US8304871 Exposed die package for direct surface mounting
11/06/2012US8304870 Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
11/06/2012US8304869 Fan-in interposer on lead frame for an integrated circuit package on package system
11/06/2012US8304868 Multi-component electronic system having leadframe with support-free with cantilever leads
11/06/2012US8304867 Crack arrest vias for IC devices
11/06/2012US8304866 Fusion quad flat semiconductor package
11/06/2012US8304865 Leadframe and chip package
11/06/2012US8304864 Lead frame routed chip pads for semiconductor packages
11/06/2012US8304862 Semiconductor package and manufacturing method of the same
11/06/2012US8304857 Semiconductor device
11/06/2012US8304852 Semiconductor device
11/06/2012US8304807 Low-capacitance electrostatic discharge protection diodes
11/06/2012US8304806 ESD and EMC optimized HV-MOS transistor
11/06/2012US8304766 Semiconductor chip with a bonding pad having contact and test areas
11/06/2012US8304291 Semiconductor chip thermal interface structures
11/06/2012US8304289 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
11/06/2012US8304286 Integrated circuit packaging system with shielded package and method of manufacture thereof
11/06/2012US8304278 Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus
11/06/2012US8303756 Method for bonding a glass cap and mask for curing sealant
11/06/2012US8302289 Apparatus for preparing an antenna for use with a wireless communication device
11/01/2012WO2012148869A2 Contact metal for hybridization and related methods
11/01/2012WO2012148020A1 Method for forming a nanodiamond-impregnated dielectric layer for a highly heat dissipating metal substrate
11/01/2012WO2012147874A1 Resin composition for electronic component and electronic component device
11/01/2012WO2012147704A1 Tft substrate and method for correcting wiring fault on tft substrate
11/01/2012WO2012147610A1 Heat dissipating substrate
11/01/2012WO2012147544A1 Cooler for semiconductor module, and semiconductor module
11/01/2012WO2012147480A1 Method for producing electronic component module and electronic component module
11/01/2012WO2012147285A1 Wiring method for semiconductor integrated circuit and wiring device
11/01/2012WO2012147265A1 Boiling and cooling device
11/01/2012WO2012147243A1 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
11/01/2012WO2012146469A1 Resin compositions comprising modified epoxy resins with sorbic acid
11/01/2012WO2012146204A1 Electronic control unit assembly and vehicle comprising the same
11/01/2012WO2012145977A1 Semiconductor device and method of programming the same
11/01/2012WO2012145879A1 Mold for pre-plastic-sealing lead frames, process for pre-plastic-sealing and packaging structure
11/01/2012WO2012120185A3 Heat sink assembly for opto-electronic components and a method for producing the same
11/01/2012WO2012109265A3 Three-dimensional power supply module having reduced switch node ringing
11/01/2012WO2012106111A3 Circuit assemblies including thermoelectric modules
11/01/2012WO2012009520A9 Conductive sidewall for microbumps
11/01/2012US20120278469 Real-time feedback for policies for computing system management
11/01/2012US20120276822 Apparatus for grinding heated plane of cooler
11/01/2012US20120276754 Methods and systems for thermal-based laser processing a multi-material device
11/01/2012US20120276689 Glass Wafers for Semiconductor Fabrication Processes and Methods of Making Same
11/01/2012US20120275208 Reliable electrical fuse with localized programming and method of making the same
11/01/2012US20120274868 Semiconductor Package
11/01/2012US20120274273 Integrated-circuit battery devices
11/01/2012US20120273976 Moisture barrier coatings for organic light emitting diode devices
11/01/2012US20120273975 Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
11/01/2012US20120273974 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/01/2012US20120273973 Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
11/01/2012US20120273972 Semiconductor device
11/01/2012US20120273971 Semiconductor device and method of manufacturing the same
11/01/2012US20120273969 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273968 Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas
11/01/2012US20120273967 Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer
11/01/2012US20120273966 Integrated circuit interconnect structure
11/01/2012US20120273965 Semiconductor memory device and method of manufacturing the same
11/01/2012US20120273964 Manufacturing method of semiconductor device and semiconductor device
11/01/2012US20120273963 Microelectronic interconnect substrate and packaging techniques
11/01/2012US20120273962 Semiconductor device having air gap and method for manufacturing the same
11/01/2012US20120273961 Semiconductor apparatus
11/01/2012US20120273960 Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Encapsulant with TMV for Vertical Interconnect in POP
11/01/2012US20120273959 Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP
11/01/2012US20120273958 Multilayer interconnect structure and method for integrated circuits
11/01/2012US20120273957 Chip-packaging module for a chip and a method for forming a chip-packaging module
11/01/2012US20120273956 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273955 System comprising a semiconductor device and structure
11/01/2012US20120273954 Semiconductor device with protective material and method for encapsulating
11/01/2012US20120273953 Semiconductor device having groove-shaped via-hole
11/01/2012US20120273952 Microelectronic chip, component containing such a chip and manufacturing method
11/01/2012US20120273951 Contact Metal for Hybridization and Related Methods
11/01/2012US20120273950 Integrated circuit structure including copper-aluminum interconnect and method for fabricating the same
11/01/2012US20120273949 Method of forming oxide encapsulated conductive features
11/01/2012US20120273948 Integrated circuit structure including a copper-aluminum interconnect and method for fabricating the same
11/01/2012US20120273947 Chip package with a chip embedded in a wiring body
11/01/2012US20120273946 Semiconductor device
11/01/2012US20120273945 Integrated circuit device including a copper pillar capped by barrier layer
11/01/2012US20120273944 Power Semiconductor Package With Bottom Surface Protrusions
11/01/2012US20120273943 Solder Joint Flip Chip Interconnection Having Relief Structure
11/01/2012US20120273942 Flip-chip Mounting Structure and Flip-chip Mounting Method
11/01/2012US20120273941 Package structure having embedded electronic component and fabrication method thereof
11/01/2012US20120273940 Semiconductor apparatus and method for fabricating the same
11/01/2012US20120273939 Filled through-silicon via and the fabrication method thereof
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