Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/07/2012CN102770801A Strengthened structural module and method of fabrication
11/07/2012CN102770216A Dispenser for highly viscous fluid
11/07/2012CN102770006A Liquid-cooled power semiconductor module
11/07/2012CN102770004A Ceramic heat radiator and manufacturing method thereof
11/07/2012CN102769040A Thin-film transistor, array substrate, array substrate manufacturing method and display device
11/07/2012CN102769016A Anti-radiation complementary metal oxide semiconductor (CMOS) device and preparation method thereof
11/07/2012CN102769015A Integrated circuit layouts with power rails under bottom metal layer
11/07/2012CN102769010A Large-current high-density contact pin type rectifier bridge
11/07/2012CN102769009A Semiconductor packaging piece
11/07/2012CN102769008A Kelvin test loop capable of increasing testable device of unit test block
11/07/2012CN102769007A Pad structure of integrated circuit package
11/07/2012CN102769006A Semiconductor structure and fabrication method thereof
11/07/2012CN102769005A Semiconductor packaging structure and manufacture method thereof
11/07/2012CN102769004A Electronic component packaging structure
11/07/2012CN102769003A High performance electronics assembly with liquid cooling
11/07/2012CN102769002A Semiconductor device, formation method thereof and package structure
11/07/2012CN102769001A Heat sink
11/07/2012CN102769000A Internal embedded element packaging structure and manufacturing method
11/07/2012CN102768999A High-power integral wafer IGBT (insulated gate bipolar transistor) packaging structure
11/07/2012CN102768998A Substrate for high-power electronic device module
11/07/2012CN102768997A High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing
11/07/2012CN102768996A Semiconductor packaging structure and manufacture method thereof
11/07/2012CN102768965A Semiconductor device and manufacturing method of the same
11/07/2012CN102768963A Circuit structure and manufacturing method thereof
11/07/2012CN102768962A Integrated circuit package and assembling method therefor
11/07/2012CN102768960A Package structure and manufacturing method thereof
11/07/2012CN102768959A Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
11/07/2012CN102768958A Integrated circuit packaging system with pad connection and method of manufacture thereof
11/07/2012CN102768848A Semiconductor device, semiconductor module and method of manufacturing the same
11/07/2012CN102214641B Wafer-level semiconductor device packages with stacking functionality
11/07/2012CN102201390B Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof
11/07/2012CN102184913B Anti-static device
11/07/2012CN102130155B Manufacturing method of silicon control rectifier structure
11/07/2012CN102117827B Parasitic vertical PNP device in bipolar complementary metal oxide semiconductor (BiCMOS) process
11/07/2012CN102097417B Integrated power semiconductor power module
11/07/2012CN102054715B Method of fabricating backside-illuminated image sensor
11/07/2012CN102054667B Method for applying photoresist lifting-off technology to protect photoetching alignment marks
11/07/2012CN102044520B Package carrier plate, package structure and manufacturing process of package carrier plate
11/07/2012CN102013420B Semiconductor encapsulating structure and encapsulating method thereof
11/07/2012CN101982878B Embedded type assembly substrate and manufacturing method thereof
11/07/2012CN101971234B Active matrix substrate, display device, and method for manufacturing active matrix substrate
11/07/2012CN101958293B Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
11/07/2012CN101933139B Semiconductor device and method for fabricating the same
11/07/2012CN101894857B Organic light emitting device
11/07/2012CN101887879B Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/07/2012CN101859741B Device mounting structure, method of mounting device, liquid-jet head, connector, and semiconductor device
11/07/2012CN101728367B Image sensing module for reducing whole thickness and preventing electromagnetic interference
11/07/2012CN101683017B Cooling device
11/07/2012CN101681907B Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
11/07/2012CN101562178B 半导体发光装置 Semiconductor light emitting device
11/07/2012CN101546734B Semiconductor element
11/07/2012CN101533822B Mounting structure and electro optical device
11/07/2012CN101515554B Semiconductor device manufacturing mehtod, semiconductor device, and wiring board
11/07/2012CN101499454B Printed circuit board and method of manufacturing the same
11/07/2012CN101483381B Combined structure
11/07/2012CN101419920B Method for manufacturing a semiconductor component and structure therefor
11/07/2012CN101393899B Semiconductor device
11/07/2012CN101366117B Method for placing chip on lead frame for small package speed sensor
11/07/2012CN101304015B Semiconductor device and manufacturing method thereof
11/07/2012CN101288350B Multilayered printed circuit board and method for manufacturing the same
11/07/2012CN101241891B Semiconductor device and method of manufacturing the same
11/07/2012CN101010994B Method for manufacturing an electronics module
11/06/2012US8307060 Real-time feedback for policies for computing system management
11/06/2012US8306598 Analyte monitoring device and methods of use
11/06/2012US8305761 Heat removal in compact computing systems
11/06/2012US8305754 Heat dissipation structure of electronic device
11/06/2012US8305722 Dual-directional electrostatic discharge protection method
11/06/2012US8304924 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device
11/06/2012US8304923 Chip packaging structure
11/06/2012US8304922 Semiconductor package system with thermal die bonding
11/06/2012US8304921 Integrated circuit packaging system with interconnect and method of manufacture thereof
11/06/2012US8304920 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer
11/06/2012US8304919 Integrated circuit system with stress redistribution layer and method of manufacture thereof
11/06/2012US8304918 Method for manufacturing electronic device and electronic device
11/06/2012US8304917 Multi-chip stacked package and its mother chip to save interposer
11/06/2012US8304916 Half-through vias for suppression of substrate modes
11/06/2012US8304915 Semiconductor device and method for manufacturing the same
11/06/2012US8304914 Flash memory device with word lines of uniform width and method for manufacturing thereof
11/06/2012US8304913 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
11/06/2012US8304912 Structure and method for MOSFET gate electrode landing pad
11/06/2012US8304911 Semiconductor structure and manufacturing method of the same
11/06/2012US8304910 Semiconductor device and method of producing the same
11/06/2012US8304909 IC solder reflow method and materials
11/06/2012US8304908 Semiconductor device having a multilevel interconnect structure and method for fabricating the same
11/06/2012US8304907 Top layers of metal for integrated circuits
11/06/2012US8304906 Partial air gap formation for providing interconnect isolation in integrated circuits
11/06/2012US8304905 Semiconductor device
11/06/2012US8304904 Semiconductor device with solder bump formed on high topography plated Cu pads
11/06/2012US8304903 Wirebond-less semiconductor package
11/06/2012US8304902 Semiconductor device
11/06/2012US8304901 Semiconductor device having a groove and a junction termination extension layer surrounding a guard ring layer
11/06/2012US8304900 Integrated circuit packaging system with stacked lead and method of manufacture thereof
11/06/2012US8304899 Element wafer and method for manufacturing the same
11/06/2012US8304898 Integrated circuit package system with overhang film
11/06/2012US8304897 Thermal interface material design for enhanced thermal performance and improved package structural integrity
11/06/2012US8304896 Embedded die package and process flow using a pre-molded carrier
11/06/2012US8304895 Semiconductor package and method of fabricating the same
11/06/2012US8304894 Super high-density module with integrated wafer level packages
11/06/2012US8304892 Semiconductor package having substrate with solder ball connections and method of fabricating the same
11/06/2012US8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof