Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/08/2012WO2012121545A3 Method for fixing electronic components
11/08/2012WO2012088480A3 Thermal loading mechanism
11/08/2012US20120282740 Electronic device and process for manufacturing electronic device
11/08/2012US20120282738 Circuit structure and manufacturing method thereof
11/08/2012US20120281362 Silicon nitride substrate, circuit substrate and electronic device using the same
11/08/2012US20120280409 Micromechanical Method and Corresponding Assembly for Bonding Semiconductor Substrates and Correspondingly Bonded Semiconductor Chip
11/08/2012US20120280408 Integrated circuit packaging system with formed interconnects and method of manufacture thereof
11/08/2012US20120280407 Integrated circuit packaging system with electrical interface and method of manufacture thereof
11/08/2012US20120280406 Semiconductor device
11/08/2012US20120280405 Semiconductor packages and methods of manufacuring the same
11/08/2012US20120280404 Stack packages having fastening element and halogen-free inter-package connector
11/08/2012US20120280403 Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
11/08/2012US20120280402 Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
11/08/2012US20120280401 Semiconductor device
11/08/2012US20120280400 Electronic circuits including planar electronic devices
11/08/2012US20120280399 Buffer pad in solder bump connections and methods of manufacture
11/08/2012US20120280398 Method for air gap interconnect integration using photo-patternable low k material
11/08/2012US20120280397 Semiconductor device and method of manufacturing the same
11/08/2012US20120280396 Semiconductor device having groove-shaped via-hole
11/08/2012US20120280395 3-D Integration using Multi Stage Vias
11/08/2012US20120280394 Semiconductor device with seg film active region
11/08/2012US20120280392 Semiconductor Component Havin a Plated Through-Hole and method for the Production Thereof
11/08/2012US20120280391 Semiconductor device conductive pattern structures and methods of manufacturing the same
11/08/2012US20120280390 Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
11/08/2012US20120280389 Chip package and fabrication method thereof
11/08/2012US20120280388 Copper pillar bump with non-metal sidewall protection structure and method of making the same
11/08/2012US20120280387 Three-dimensional stacked substrate arrangements
11/08/2012US20120280386 Package-on-package assembly with wire bonds to encapsulation surface
11/08/2012US20120280385 Electronic device packaging structure
11/08/2012US20120280384 Semiconductor structure and fabrication method thereof
11/08/2012US20120280383 Semiconductor device and method of producing same
11/08/2012US20120280382 Semiconductor packages
11/08/2012US20120280381 Window Interposed Die Packaging
11/08/2012US20120280380 High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same
11/08/2012US20120280379 Semiconductor device and method of manufacturing same
11/08/2012US20120280378 Col-based semiconductor package including electrical connections through a single layer leadframe
11/08/2012US20120280377 Integrated circuit packaging system with pad connection and method of manufacture thereof
11/08/2012US20120280376 Integrated circuit packaging system with pad connection and method of manufacture thereof
11/08/2012US20120280375 Semiconductor package and radiation lead frame
11/08/2012US20120280374 Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material
11/08/2012US20120280371 Circuit structure and manufacturing method thereof
11/08/2012US20120280366 Radio- and electromagnetic interference through-silicon vias for stacked- die packages, and methods of making same
11/08/2012US20120280364 Semiconductor device capable of preventing pattern peeling
11/08/2012US20120280351 Alignment for backside illumination sensor
11/08/2012US20120280287 Integrated Circuit Layouts with Power Rails under Bottom Metal Layer
11/08/2012US20120280253 Stress Regulated Semiconductor Devices and Associated Methods
11/08/2012US20120280246 High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe
11/08/2012US20120280231 Semiconductor device, and test method for same
11/08/2012US20120280116 Method for Producing a Housing for an Optoelectronic Semiconductor Device, Housing, and Optoelectronic Semiconductor Device
11/08/2012US20120280102 Clamp mechanism for clamping a heat sink
11/08/2012US20120279688 Heat dissipating module and heat dissipating method thereof
11/08/2012DE10335118B4 Halbleitervorrichtung Semiconductor device
11/08/2012DE102012206276A1 Verfahren zum Herstellen eines Leistungsmodul-Substrats und Leistungsmodul-Substrat A method for manufacturing a power module substrate, and the power module substrate
11/08/2012DE102011100543A1 Power electronic device used as power converter unit for wind power plant, has semiconductor module whose module-side cooling fluid inlet and coolant outlet are connected with coolant outlet and cooling liquid inlet of cooling module
11/08/2012DE102011100526A1 Leistungselektronische Anordnung mit Flüssigkeitskühlung Power electronic device with liquid cooling
11/08/2012DE102011100487A1 Integriertes passives Bauelement Integrated passive component
11/08/2012DE102011100457A1 Electronic part, has connection structure comprising foil with front and back surfaces, where front/back surface is formed such that front/back surface contacts chip/carrier element and is spaced from chip/carrier element, respectively
11/08/2012DE102011050420B3 Surge protection device for protection of electrical device against transient voltages, has temperature-dependent resistors arranged in series with current-controlled semiconductor components in a state thermally coupled to components
11/08/2012DE102009040444B4 Leistungsmodul Power module
11/08/2012DE102009029476B4 Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe An electronic device for switching currents and manufacturing method for the same
11/08/2012DE102008046728B4 Elektronikbauelement und Verfahren zur Herstellung Electronic component and methods for making
11/08/2012DE102006048230B4 Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung Light-emitting system, and method for producing such a backlighting
11/08/2012DE102006027481C5 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
11/08/2012DE102006024652B4 Bauelement mit TAB-Packung und zugehöriges Herstellungsverfahren Component with TAB package and manufacturing method thereof
11/08/2012DE102006011232B4 Substrat zum Montieren eines elektronischen Bauteils sowie elektronisches Bauteil Substrate for mounting an electronic component and electronic component
11/08/2012DE102005017849B4 Elektronisches Bauteil Electronic component
11/08/2012DE102004006989B4 Halbleitervorrichtung in Druckkontaktbauweise A semiconductor device in pressure contact design
11/08/2012CA2835079A1 Systems and methods for cooling of power electronic devices
11/07/2012EP2521176A1 High voltage cascoded III-nitride rectifier package comprising conductive clips between electrodes of components and the surface of a package support member
11/07/2012EP2521175A1 Electrical interconnection device of at least one electronic component with a power supply comprising means for reducing loop inductance between a first and a second terminal
11/07/2012EP2521174A2 Submount and method of manufacturing the same
11/07/2012EP2521173A2 Submount and method of manufacturing the same
11/07/2012EP2521172A1 High voltage cascoded III-nitride rectifier package with etched leadframe
11/07/2012EP2521171A1 High voltage cascoded III-nitride rectifier package with stamped leadframe
11/07/2012EP2521165A1 Wiring structure and method for forming same
11/07/2012EP2520415A1 Vacuum component support and corresponding component assembly machine
11/07/2012EP2520019A1 Amplifier component comprising a compensation element
11/07/2012EP2519970A2 Leadframe-based premolded package having acoustic air channel for microelectromechanical system (mems) device
11/07/2012EP2519480A2 Graphite-containing moulded body and method for the production thereof
11/07/2012EP2519479A2 Layered composite material for use in a redox flow battery
11/07/2012EP2159839B1 Liquid-cooled-type cooling device
11/07/2012CN202524704U Compound heat dissipation module
11/07/2012CN202523768U High-thermal conductivity and anti-static upright LED (Light-Emitting Diode) chip
11/07/2012CN202523707U Major loop thyristor module
11/07/2012CN202523706U Three-dimensional stack packaging structure of fan out wafer level semiconductor chip
11/07/2012CN202523705U Miniature power semiconductor module
11/07/2012CN202523704U Non-welding packaged power module
11/07/2012CN202523703U Chip
11/07/2012CN202523702U Semiconductor component packaging structure
11/07/2012CN202523701U Wafer packaging structure
11/07/2012CN202523700U AAP power module
11/07/2012CN202523699U Flat crimping and packaging structure of double-sided micro-channel liquid-cooling power semiconductor whole wafer
11/07/2012CN202523698U Air-cooling radiator for IGBT
11/07/2012CN202523697U Semiconductor packaging structure
11/07/2012CN1826845B Land grid array connector
11/07/2012CN102770978A Metal based electronic component package and the method of manufacturing the same
11/07/2012CN102770958A Improving the evenness by means of cutouts on the embossing points
11/07/2012CN102770957A Through mold via polymer block package
11/07/2012CN102770956A Thermosetting resin composition, b-stage thermally conductive sheet, and power module
11/07/2012CN102770867A Method and apparatus for interconnect layout in an integrated circuit
1 ... 302 303 304 305 306 307 308 309 310 311 312 313 314 315 316 317 318 319 320 321 322 ... 2262