Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/14/2012CN102054719B Method and structure for measuring circuit offset by using circuit substrate
11/14/2012CN101989590B New bump structure
11/14/2012CN101981213B Copper alloy material for electric and electronic apparatuses, and electric and electronic components
11/14/2012CN101964338B Semiconductor packaging part and manufacturing method thereof as well as chip-redistribution encapsulant
11/14/2012CN101913591B Single-layer carbon nanotube and alinged single-layer carbon nanotube bulk structure, and their production process, production apparatus and use
11/14/2012CN101887880B Multilayer printed wiring board
11/14/2012CN101877343B T-connections, methodology for designing T-connections, and compact modeling of T-connections
11/14/2012CN101866897B Solid-state imaging device comprising through-electrode
11/14/2012CN101859712B Hybrid loader and manufacturing method thereof
11/14/2012CN101847620B 功率模块 Power Modules
11/14/2012CN101826490B Packaging structure and test method of semiconductor elements
11/14/2012CN101794781B Monolithic semiconductor switches and method for manufacturing
11/14/2012CN101755337B 半导体模块 Semiconductor Modules
11/14/2012CN101743638B Light receiving device and method of manufacturing light receiving device
11/14/2012CN101673507B Scanning system of organic light emission display
11/14/2012CN101626002B Bond pad structure of integrated circuit
11/14/2012CN101625464B Liquid crystal display
11/14/2012CN101617394B Process integration scheme to lower overall dielectric constant in beol interconnect structures
11/14/2012CN101599484B Resin sealed semiconductor device and manufacturing method therefor
11/14/2012CN101556954B Semiconductor device having vertical pillar transistors and method for manufacturing the same
11/14/2012CN101552255B Power semiconductor module with hermetically sealed switching assembly and corresponding production method
11/14/2012CN101547586B Heat sink, heat sink combination and fixing device thereof
11/14/2012CN101546743B Mounting structure of semiconductor device and electronic apparatus using same
11/14/2012CN101491170B Heatsink attachment mechanism
11/14/2012CN101488484B Device mounting board, semiconductor module, and mobile device
11/14/2012CN101459156B 半导体器件 Semiconductor devices
11/14/2012CN101442053B Semiconductor device having storage nodes on active regions and method of fabricating the same
11/14/2012CN101393917B Semiconductor device having reduced thickness, electronic product employing the same, and methods of fabricating the same
11/14/2012CN101388393B Polarity switching construction for point converting system
11/14/2012CN101383333B 半导体封装 The semiconductor package
11/14/2012CN101341501B Method of manufacturing rfid devices
11/14/2012CN101337308B Solder
11/14/2012CN101241887B Power semiconductor module with contact springs
11/14/2012CN101231971B CMOS image sensors with a bonding pad and methods of forming the same
11/14/2012CN101045858B Insulator with high thermal conductivity and method for producing the same
11/13/2012US8312397 Method for generating layout pattern of semiconductor device and layout pattern generating apparatus
11/13/2012US8310855 Semiconductor device
11/13/2012US8310830 Electronic device and frequency converter of motor
11/13/2012US8310575 Solid-state imaging device and imaging apparatus
11/13/2012US8310413 Electroluminescent display devices
11/13/2012US8310155 Devices including, methods using, and compositions of reflowable getters
11/13/2012US8310154 Devices including, methods using, and compositions of reflowable getters
11/13/2012US8310069 Semiconductor package having marking layer
11/13/2012US8310068 TCP-type semiconductor device
11/13/2012US8310067 Ball grid array package enhanced with a thermal and electrical connector
11/13/2012US8310066 Semiconductor apparatus
11/13/2012US8310065 Semiconductor device and wafer structure
11/13/2012US8310064 Semiconductor devices including voltage switchable materials for over-voltage protection
11/13/2012US8310063 Semiconductor package structure and manufacturing process thereof
11/13/2012US8310062 Stacked semiconductor package
11/13/2012US8310061 Stacked die parallel plate capacitor
11/13/2012US8310060 Lead frame land grid array
11/13/2012US8310059 Semiconductor integrated circuit
11/13/2012US8310058 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
11/13/2012US8310057 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/13/2012US8310056 Semiconductor device
11/13/2012US8310055 Semiconductor devices having narrow conductive line patterns and related methods of forming such semiconductor devices
11/13/2012US8310053 Method of manufacturing a device with a cavity
11/13/2012US8310052 Semiconductor device and method for manufacturing same
11/13/2012US8310051 Package-on-package with fan-out WLCSP
11/13/2012US8310050 Electronic device package and fabrication method thereof
11/13/2012US8310049 Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof
11/13/2012US8310048 Microelectronic devices
11/13/2012US8310047 Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink
11/13/2012US8310046 Wafer stacked package waving bertical heat emission path and method of fabricating the same
11/13/2012US8310045 Semiconductor package with heat dissipation devices
11/13/2012US8310044 Semiconductor device and method of manufacturing the same
11/13/2012US8310043 Semiconductor chip assembly with post/base heat spreader with ESD protection layer
11/13/2012US8310042 Heatsink moldlocks
11/13/2012US8310041 Stacked semiconductor package and stacking method thereof
11/13/2012US8310040 Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
11/13/2012US8310039 Semiconductor device
11/13/2012US8310037 Light emitting apparatus and fabrication method thereof
11/13/2012US8310034 Semiconductor device
11/13/2012US8310032 Wafer and method of manufacturing semiconductor device
11/13/2012US8310023 Light emitting diode package and fabrication method thereof
11/13/2012US8310011 Field effect resistor for ESD protection
11/13/2012US8310010 Semiconductor device
11/13/2012US8309957 Replacement of scribeline padframe with saw-friendly design
11/13/2012US8309951 Test structure for determining gate-to-body tunneling current in a floating body FET
11/13/2012US8309865 Resin-molded article fit with a metal plate
11/13/2012US8309451 Semiconductor device and method of providing common voltage bus and wire bondable redistribution
11/13/2012US8309435 Crack stops for semiconductor devices
11/13/2012US8309402 Method of fabricating oxide material layer with openings attached to device layers
11/13/2012US8309397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
11/13/2012US8309388 MEMS package having formed metal lid
11/13/2012US8309385 Inertial sensor, inertial sensor device and manufacturing method of the same
11/13/2012US8309384 Process for packaging components, and packaged components
11/13/2012US8308053 Microfeature workpieces having alloyed conductive structures, and associated methods
11/12/2012DE202011110023U1 Elektronisches Bauteil und Leiterplatte mit elektronischem Bauteil Electronic component and PCB with electronic components
11/09/2012DE202010017397U1 Leistungshalbleiterschaltungsanordnung mit einem Leistungsmodul Power semiconductor circuit arrangement having a power module
11/08/2012WO2012151347A1 Heat spreader for electrical components
11/08/2012WO2012151120A2 Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
11/08/2012WO2012151003A2 Chip packages including through-silicon via dice with vertically integrated phased-array antennas and low-frequency and power delivery substrates
11/08/2012WO2012151002A1 Package-on-package assembly with wire bonds to encapsulation surface
11/08/2012WO2012150953A1 Systems and methods for cooling of power electronic devices
11/08/2012WO2012149891A1 Substrate of high-power electrionic device module and high-power electrionic device module
11/08/2012WO2012149803A1 Epoxy coating on substrate for die attach
11/08/2012WO2012149706A1 Semiconductor device, and forming method and packaging structure thereof
11/08/2012WO2012149686A1 Epoxy coating on substrate for die attach
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