Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/15/2012US20120286406 Semiconductor device with staggered leads
11/15/2012US20120286405 Semiconductor device and method for manufacturing the same
11/15/2012US20120286404 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure
11/15/2012US20120286403 Semiconductor device
11/15/2012US20120286402 Protuberant structure and method for making the same
11/15/2012US20120286401 3d interconnection structure and method of manufacturing the same
11/15/2012US20120286400 Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device
11/15/2012US20120286399 Leadframe and method for packaging semiconductor die
11/15/2012US20120286398 Semiconductor chip module and planar stack package having the same
11/15/2012US20120286397 Die Seal for Integrated Circuit Device
11/15/2012US20120286390 Electrical fuse structure and method for fabricating the same
11/15/2012US20120286388 Solid state image pickup device and method of producing solid state image pickup device
11/15/2012US20120286384 Semiconductor package, semiconductor device manufacturing method, and solid-state imaging device
11/15/2012US20120286276 Semiconductor Device and Manufacturing Method Thereof
11/15/2012US20120286269 Chip damage detection device for a semiconductor integrated circuit
11/15/2012US20120285667 Sound baffling cooling system for led thermal management and associated methods
11/15/2012US20120285515 Structure installation mount, support device for structure installation, and solar photovoltaic system
11/15/2012DE112010005236T5 Rückseitenpseudostecker für 3D-Integration Back pseudo plug for 3D integration
11/15/2012DE112006002635B4 Schaltungsmodul und Schaltungsvorrichtung, die ein Schaltungsmodul umfasst A circuit module and circuit device comprising a circuit module
11/15/2012DE10327618B4 Verfahren zur Ausbildung von Aluminiummetallverdrahtungen Process for the formation of aluminum metal wirings
11/15/2012DE10250636B4 Verfahren zum Herstellen einer Halbleiterstuktur und Halbleiterstruktur A method of manufacturing a semiconductor structure and Halbleiterstuktur
11/15/2012DE102012104067A1 Integrierte-Schaltung-Gehäuse und Einhäusungsverfahren Integrated circuit housing and Einhäusungsverfahren
11/15/2012DE102011101052A1 Substrat mit elektrisch neutralem Bereich Substrate with an electrically neutral area
11/15/2012DE102011075731A1 Power semiconductor module e.g. insulated gate bipolar transistor module, for e.g. power converter, has heat sink terminal for connecting heat sink with potential, and other heat sink terminal for connecting other sink with other potential
11/15/2012DE102011075614A1 Leistungselektronisches System mit Flüssigkeitskühleinrichtung Power electronic system with liquid cooling device
11/15/2012DE102011075565A1 Schaltungsmodul mit Kühlung durch Phasenwechselmaterial Module with cooling through the phase change material
11/15/2012DE102011075552A1 Schaltungsanordnung für Radaranwendungen Circuit arrangement for radar applications
11/15/2012DE102011075515A1 Power semiconductor component module for fastening at cooling body, has contact units for electrically contacting power semiconductor component, and plate with aperture partly arranged with heat conducting body
11/15/2012DE102011056742A1 Steuergerät mit einer Getterschicht zum Einsatz in einem Kraftfahrzeug Control unit with a getter for use in a motor vehicle
11/15/2012DE102009036033B4 Durchkontaktierung für Halbleiterwafer und Herstellungsverfahren Plated-through hole for semiconductor wafers and manufacturing processes
11/15/2012DE102007014198B4 Integriertes Bauteil und Verfahren zur Herstellung eines integrierten Bauteils Integrated component and method for manufacturing an integrated component
11/14/2012EP2523215A1 Liquid cooling element
11/14/2012EP2523211A1 Leadframe and method for packaging semiconductor die
11/14/2012EP2522030A2 Electronic devices and components for high efficiency power circuits
11/14/2012EP2522029A1 Thermal plug for use with a heat sink and method of assembling same
11/14/2012EP2521631A1 Amorphous alloy seal and bonding
11/14/2012CN202534648U Power MOSFET and IGBT protected from ESD
11/14/2012CN202534644U Multiport type overvoltage protection components
11/14/2012CN202534643U IPEM micro-channle liquid cooling substrate having Moire fringe effect
11/14/2012CN202534642U Large power field-effect tube compaction and heat radiation device
11/14/2012CN202534641U Packaged electronic device
11/14/2012CN1670624B Etching composition
11/14/2012CN102782967A Semiconductor light-emitting device, method for manufacturing semiconductor light-emitting device, and optical device
11/14/2012CN102782934A Miniature microwave component for surface-mounting
11/14/2012CN102782857A 半导体装置 Semiconductor device
11/14/2012CN102782843A 半导体装置 Semiconductor device
11/14/2012CN102782842A Systems and methods providing arrangements of vias
11/14/2012CN102782839A System and method for electrical testing of through silicon vias (tsvs)
11/14/2012CN102782838A Embedded chip packages
11/14/2012CN102782837A Liquid DIMM cooling device
11/14/2012CN102782836A Semiconductor module manufacturing method, semiconductor module, and manufacturing device
11/14/2012CN102782835A 半导体装置 Semiconductor device
11/14/2012CN102782825A Interconnect pattern for high performance interfaces
11/14/2012CN102782054A Method of making a coated article, coating including an alloyed carbon nanotube thin film
11/14/2012CN102782050A Curable composition, hardened material, and method for using curable composition
11/14/2012CN102782000A Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition
11/14/2012CN102781877A Layered composite material for use in a redox flow battery
11/14/2012CN102781876A Graphite-containing moulded body and method for the production thereof
11/14/2012CN102781861A Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
11/14/2012CN102779813A Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/14/2012CN102779812A Novel protecting ring of high-voltage and power device field limiting ring
11/14/2012CN102779811A Chip package and chip packaging method
11/14/2012CN102779810A MOS test structure, method for forming MOS test structure
11/14/2012CN102779809A Chip package and method for forming the same
11/14/2012CN102779808A Integrated circuit package and packaging methods
11/14/2012CN102779807A RDL (radiological defense laboratory) technology-compatible inductive component and manufacture method
11/14/2012CN102779806A Adding decoupling function for tap cells
11/14/2012CN102779805A Board-level package with tuned mass damping structure
11/14/2012CN102779804A Semiconductor packaging piece
11/14/2012CN102779803A 集成电路芯片封装及其制造方法 Integrated circuit chip package and manufacturing method
11/14/2012CN102779802A Semiconductor packaging structure and manufacturing method thereof
11/14/2012CN102779801A 半导体装置 Semiconductor device
11/14/2012CN102779800A Chip package and method for forming the same
11/14/2012CN102779799A Liquid cooling element
11/14/2012CN102779798A Thermal conductive sheet, insulating sheet, and heat dissipating member
11/14/2012CN102779797A Thermal conductive sheet, insulating sheet, and heat dissipating member
11/14/2012CN102779796A Laminated type high-efficiency heat radiating sheet on integrated circuit
11/14/2012CN102779795A Semiconductor device and method for manufacturing the same
11/14/2012CN102779794A Method and structure for controlling package warpage
11/14/2012CN102779793A Electronic element packaging structure, electronic device and manufacturing method thereof
11/14/2012CN102779792A Die seal for integrated circuit device
11/14/2012CN102779791A Bump structure and fabrication method thereof
11/14/2012CN102779768A Semiconductor device and a manufacturing method thereof
11/14/2012CN102779767A Semiconductor package structure and manufacturing method thereof
11/14/2012CN102779765A Semiconductor device with staggered lead wires
11/14/2012CN102779762A Method of producing semiconductor module and semiconductor module
11/14/2012CN102779761A Leadframe and method for packaging semiconductor die
11/14/2012CN102779760A Base plate embedding and connecting type multi-chip encapsulation manufacture process and structure
11/14/2012CN102778157A Flat plate vapor chamber and manufacturing method thereof
11/14/2012CN102776405A Preparation method of bonded gold-silver alloy wire
11/14/2012CN102774805A Wafer packaging body and formation method thereof
11/14/2012CN102774067A Method for manufacturing soaking plate
11/14/2012CN102231374B High-stability face-down bonding substrate applied to linear array infrared focal plane detector
11/14/2012CN102208376B 半导体器件 Semiconductor devices
11/14/2012CN102194792B Integrated circuit and a method for producing the same
11/14/2012CN102169868B On-chip integrated inductor
11/14/2012CN102163588B Conductive pillar structure for semiconductor substrate and method of manufacture
11/14/2012CN102157499B Manufacturing method of hybrid integrated circuit module based on low temperature co-fired ceramic technology
11/14/2012CN102099905B Semiconductor device and display device
11/14/2012CN102097416B High-power module with novel packaging structure
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