| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2015 | US8933541 Semiconductor device |
| 01/13/2015 | US8933540 Thermal via for 3D integrated circuits structures |
| 01/13/2015 | US8933539 Integrated circuit and seal ring |
| 01/13/2015 | US8933535 Wafer with spacer including horizontal member |
| 01/13/2015 | US8933525 Semiconductor apparatus and method of fabrication for a semiconductor apparatus |
| 01/13/2015 | US8933520 Conductive routings in integrated circuits using under bump metallization |
| 01/13/2015 | US8933518 Stacked power semiconductor device using dual lead frame |
| 01/13/2015 | US8933513 Semiconductor device |
| 01/13/2015 | US8933511 Semiconductor device |
| 01/13/2015 | US8933492 Low VT antifuse device |
| 01/13/2015 | US8933491 Arrays of memory cells and methods of forming an array of vertically stacked tiers of memory cells |
| 01/13/2015 | US8933484 Heat transfer member and module with the same |
| 01/13/2015 | US8933482 Light emitting device |
| 01/13/2015 | US8933481 Lead frame assembly, LED package and LED light bar |
| 01/13/2015 | US8933470 Display apparatus having a plurality of stacked organic and inorganic layers and method of manufacturing the same |
| 01/13/2015 | US8933448 Wafers and chips comprising test structures |
| 01/13/2015 | US8933447 Method and apparatus for programmable device testing in stacked die applications |
| 01/13/2015 | US8932956 Far back end of the line stack encapsulation |
| 01/13/2015 | US8932934 Methods of self-forming barrier integration with pore stuffed ULK material |
| 01/13/2015 | US8932912 One-time programmable device |
| 01/13/2015 | US8932911 Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
| 01/13/2015 | US8932910 Method for producing chip stacks, and a carrier for carrying out the method |
| 01/13/2015 | US8932908 Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
| 01/13/2015 | US8932907 Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die |
| 01/13/2015 | US8932906 Through silicon via bonding structure |
| 01/13/2015 | US8932905 Semiconductor circuit system for a composite structure |
| 01/13/2015 | US8932904 Semiconductor device and method of manufacturing the same |
| 01/13/2015 | US8932891 Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device |
| 01/13/2015 | US8932010 Centrifugal fan module, heat dissipation device having the same and electric device having the heat dissipation device |
| 01/13/2015 | US8931972 Thermal module mount structure |
| 01/13/2015 | US8931166 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing |
| 01/13/2015 | CA2730378C Method for packaging semiconductors at a wafer level |
| 01/08/2015 | WO2015002921A1 Method for manufacturing an electronic device by connecting an integrated circuit to a substrate using a liquid crystal polymer layer with openings and a corresponding device |
| 01/08/2015 | WO2015002756A1 Hybrid barrier layer for substrates and electronic devices |
| 01/08/2015 | WO2015002085A1 Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member |
| 01/08/2015 | WO2015002084A1 Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member |
| 01/08/2015 | WO2015002048A1 Method for manufacturing semiconductor device |
| 01/08/2015 | WO2015001863A1 Method for manufacturing silicon carbide semiconductor device |
| 01/08/2015 | WO2015001676A1 Semiconductor device |
| 01/08/2015 | WO2015001662A1 Semiconductor device and manufacturing method for same |
| 01/08/2015 | WO2015001653A1 Electronic apparatus |
| 01/08/2015 | WO2015001648A1 Semiconductor device manufacturing method and semiconductor device |
| 01/08/2015 | WO2015001484A1 Method of flip-chip assembly of two electronic components by uv annealing, and assembly obtained |
| 01/08/2015 | WO2015000905A1 Sensor with a sealing coating |
| 01/08/2015 | WO2015000859A1 Optoelectronic component and method for producing same |
| 01/08/2015 | WO2015000857A1 Optoelectronic component and method for the production thereof |
| 01/08/2015 | WO2015000813A1 Electronic hardware assembly |
| 01/08/2015 | WO2015000597A1 Mixed impedance bond wire connections and method of making the same |
| 01/08/2015 | WO2015000596A1 Die package with low electromagnetic interference interconnection |
| 01/08/2015 | WO2015000595A1 Electronic device having a lead with selectively modified electrical properties |
| 01/08/2015 | WO2015000594A1 An interconnect system comprising an interconnect having a plurality of metal cores at least partially surrounded by a dielectric layer |
| 01/08/2015 | WO2015000593A1 A substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same |
| 01/08/2015 | WO2015000592A1 Coated bond wires for die packages and methods of manufacturing said coated bond wires |
| 01/08/2015 | WO2015000591A2 Heat isolation structures for high bandwidth interconnects |
| 01/08/2015 | WO2015000527A1 Method for bonding metallic contact areas with dissolution of a sacrificial layer applied on one of the contact areas in at least one of the contact areas |
| 01/08/2015 | WO2015000226A1 Esd device manufacturing method, esd device and display panel |
| 01/08/2015 | WO2015000197A1 Package substrate based on 3d printing, and manufacturing method thereof |
| 01/08/2015 | WO2015000007A1 Method for contacting and rewiring an electronic component embedded into a printed circuit board |
| 01/08/2015 | US20150011832 Hybrid interconnect |
| 01/08/2015 | US20150011082 Conductive structure and method for forming the same |
| 01/08/2015 | US20150011072 Capping coating for 3d integration applications |
| 01/08/2015 | US20150011053 Semiconductor device and method of assembling same |
| 01/08/2015 | US20150011052 Pin attachment |
| 01/08/2015 | US20150011051 Package Systems Having Interposers |
| 01/08/2015 | US20150011050 Bridge interconnect with air gap in package assembly |
| 01/08/2015 | US20150009644 Method for making electronic device with cover layer with openings and related devices |
| 01/08/2015 | US20150009631 Cooling Assemblies and Power Electronics Modules Having Multiple-Porosity Structures |
| 01/08/2015 | US20150008976 Anti-fuse and method for operating the same |
| 01/08/2015 | US20150008598 Alignment mark, photomask, and method for forming alignment mark |
| 01/08/2015 | US20150008597 Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation |
| 01/08/2015 | US20150008596 Semiconductor device |
| 01/08/2015 | US20150008595 Semiconductor device with pre-molding chip bonding |
| 01/08/2015 | US20150008594 Semiconductor packages |
| 01/08/2015 | US20150008593 Stacked semiconductor device and method for manufacturing the same |
| 01/08/2015 | US20150008592 Method for Carbon Nanofiber Alignment Using Magnetic Nanoparticles |
| 01/08/2015 | US20150008591 Semiconductor device and manufacturing method of the same |
| 01/08/2015 | US20150008590 Semiconductor device |
| 01/08/2015 | US20150008589 Method of forming stacked-layer wiring, stacked-layer wiring, and electronic element |
| 01/08/2015 | US20150008588 Semiconductor chip and stacked type semiconductor package having the same |
| 01/08/2015 | US20150008587 Semiconductor device and manufacturing method thereof |
| 01/08/2015 | US20150008586 Semiconductor device and manufacturing method thereof |
| 01/08/2015 | US20150008585 Multiple-patterned semiconductor device |
| 01/08/2015 | US20150008584 Semiconductor device and manufacturing method of semiconductor device |
| 01/08/2015 | US20150008583 Method and Structure of Packaging Semiconductor Devices |
| 01/08/2015 | US20150008582 Semiconductor device |
| 01/08/2015 | US20150008581 Package-on-Package Process for Applying Molding Compound |
| 01/08/2015 | US20150008580 Stacked package and method for manufacturing the same |
| 01/08/2015 | US20150008579 Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 01/08/2015 | US20150008578 Device packaging with substrates having embedded lines and metal defined pads |
| 01/08/2015 | US20150008577 Methods of fluxless micro-piercing of solder balls, and resulting devices |
| 01/08/2015 | US20150008576 Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality |
| 01/08/2015 | US20150008575 Semiconductor device and manufacturing method thereof |
| 01/08/2015 | US20150008574 Semiconductor device and method for manufacturing semiconductor device |
| 01/08/2015 | US20150008573 Bonded Body and Semiconductor Module |
| 01/08/2015 | US20150008572 Power Semiconductor Package with Multiple Dies |
| 01/08/2015 | US20150008571 Substrate warpage control using external frame stiffener |
| 01/08/2015 | US20150008570 Semiconductor device |
| 01/08/2015 | US20150008569 Manufacturing method of semiconductor device and semiconductor device |
| 01/08/2015 | US20150008568 Semiconductor device |
| 01/08/2015 | US20150008567 Using an integrated circuit die configuration for package height reduction |