Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/21/2012CN101662917B Radiating device
11/21/2012CN101641388B Semiconductor sealing resin composition and semiconductor device using the resin composition
11/21/2012CN101587862B Method for forming insulating structure and semiconductor structure
11/21/2012CN101577270B Semi-conductor luminescence component
11/21/2012CN101566513B Pressure sensor module and electronic component
11/21/2012CN101562144B Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
11/21/2012CN101556946B Method of forming a semiconductor package and structure thereof
11/21/2012CN101533824B Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
11/21/2012CN101504939B 半导体器件 Semiconductor devices
11/21/2012CN101437380B Combination of radiating device
11/21/2012CN101431604B Image signal amplifying circuit and amplifying semiconductor integrated circuit
11/21/2012CN101419957B Semiconductor device and fabrication process thereof
11/21/2012CN101409277B Assembly comprising an electromagnetically screened SMD component, method and use
11/21/2012CN101359646B Semiconductor wafer and manufacturing method for semiconductor device
11/21/2012CN101355067B Improved electrical connections for multichip modules
11/21/2012CN101221329B Data driver with multilevel voltage generating circuit, and liquid crystal display apparatus
11/21/2012CN101192604B Integrated circuit element, chip and method of manufacture
11/20/2012USRE43818 Fabrication of an integrated circuit package
11/20/2012USRE43807 Microcircuit package having ductile layer
11/20/2012US8316336 Method and mechanism for modeling interconnect structures for integrated circuits
11/20/2012US8315819 Method and apparatus for determining dopant density in semiconductor devices
11/20/2012US8314870 Solid-state imaging device and electronic apparatus
11/20/2012US8314502 Semiconductor device and a method of manufacturing the same
11/20/2012US8314501 Semiconductor chip package structure, semiconductor chip and semiconductor chip group
11/20/2012US8314500 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
11/20/2012US8314499 Flexible and stackable semiconductor die packages having thin patterned conductive layers
11/20/2012US8314498 Isolated bond pad with conductive via interconnect
11/20/2012US8314497 Surface depressions for die-to-die interconnects and associated systems
11/20/2012US8314496 Semiconductor device and inductor
11/20/2012US8314495 Semiconductor device and method of manufacturing the same
11/20/2012US8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices
11/20/2012US8314493 Method for manufacturing a package-on-package type semiconductor device
11/20/2012US8314492 Semiconductor package and package-on-package semiconductor device
11/20/2012US8314491 Manufacturing method of semiconductor device and semiconductor device
11/20/2012US8314490 Chip having a bump and package having the same
11/20/2012US8314489 Semiconductor module and method for production thereof
11/20/2012US8314488 Sample liquid supply container, sample liquid supply container set, and microchip set
11/20/2012US8314487 Flange for semiconductor die
11/20/2012US8314486 Integrated circuit packaging system with shield and method of manufacture thereof
11/20/2012US8314485 Electronic component
11/20/2012US8314484 Semiconductor device and method of manufacturing the same
11/20/2012US8314483 On-chip heat spreader
11/20/2012US8314482 Semiconductor package device
11/20/2012US8314481 Substrate structure for an image sensor package and method for manufacturing the same
11/20/2012US8314480 Stackable semiconductor package with embedded die in pre-molded carrier frame
11/20/2012US8314479 Leadframe package with recessed cavity for LED
11/20/2012US8314478 Semiconductor memory device and manufacturing the same
11/20/2012US8314476 Semiconductor chip and semiconductor wafer
11/20/2012US8314441 Optoelectronic component
11/20/2012US8314347 Wiring board with lead pins and method of producing the same
11/20/2012US8313985 Atomic layer deposition encapsulation for power amplifiers in RF circuits
11/20/2012US8313981 Chip card, and method for the production thereof
11/20/2012US8313877 Photolithography monitoring mark, photolithography mask comprising an exposure monitoring mark, and phase shift mask comprising an exposure monitoring mark
11/20/2012DE202011051021U1 Konduktionstragkörper für ein Heiz- oder Kühlpaneel Konduktionstragkörper for a heating or cooling panel
11/20/2012CA2604364C Modular led units
11/15/2012WO2012153842A1 Through wiring substrate, electronic device package, and electronic component
11/15/2012WO2012153839A1 Through wiring board, electronic device package, and electronic component
11/15/2012WO2012153531A1 Electromagnetic resonance coupler
11/15/2012WO2012153414A1 Cooler and manufacturing method for cooler
11/15/2012WO2012152777A1 Circuit module comprising cooling by means of a phase change material
11/15/2012WO2012152672A2 Method for producing reconstituted wafers with support of the chips during their encapsulation
11/15/2012WO2012152364A1 Substrate with electrically neutral region
11/15/2012WO2012152307A1 Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
11/15/2012WO2012152271A1 Control device with a getter layer for use in a motor vehicle
11/15/2012WO2012152092A1 Gate ground nmos unit for anti-static protection and anti-static protection structure thereof
11/15/2012WO2012151766A1 Vertical insert led lamp component
11/15/2012WO2012095437A3 Arrangement and method for cooling a support
11/15/2012WO2012024578A8 Portable electronic device
11/15/2012US20120288698 Method of fabrication, device structure and submount comprising diamond on metal substrate for thermal dissipation
11/15/2012US20120288083 Systems and methods for forming isolated devices in a handle wafer
11/15/2012US20120287695 Semiconductor memory device
11/15/2012US20120286819 Mos test structure, method for forming mos test structure and method for performing wafer acceptance test
11/15/2012US20120286434 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
11/15/2012US20120286433 Robust FEBOL and UBM Structure of C4 Interconnects
11/15/2012US20120286432 Integrated circuit packaging system with interconnect and method of manufacture thereof
11/15/2012US20120286431 Integrated Circuit Die Stacks Having Initially Identical Dies Personalized With Switches
11/15/2012US20120286430 Method of Producing a Semiconductor Device and Semiconductor Device Having a Through-Wafer Interconnect
11/15/2012US20120286429 Semiconductor Device and Method of Singulating Thin Semiconductor Wafer on Carrier Along Modified Region Within Non-Active Region Formed by Irradiating Energy
11/15/2012US20120286428 Formation of through-silicon via (tsv) in silicon substrate
11/15/2012US20120286427 Semiconductor device and a manufacturing method thereof
11/15/2012US20120286426 Semiconductor device
11/15/2012US20120286425 Package having mems element and fabrication method thereof
11/15/2012US20120286424 Die stacking with an annular via having a recessed socket
11/15/2012US20120286423 Doping Minor Elements into Metal Bumps
11/15/2012US20120286422 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die having Pre-Applied Protective Layer
11/15/2012US20120286421 Chip package and method for forming the same
11/15/2012US20120286420 Chip package and method for forming the same
11/15/2012US20120286419 Semiconductor package with interposer block therein
11/15/2012US20120286418 Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance
11/15/2012US20120286417 Method and structure for controlling package warpage
11/15/2012US20120286416 Semiconductor chip package assembly and method for making same
11/15/2012US20120286415 Method of producing semiconductor module and semiconductor module
11/15/2012US20120286414 Integrated circuit package and packaging methods
11/15/2012US20120286413 Integrated circuit package and packaging methods
11/15/2012US20120286412 Semiconductor deveice and method for manufacturing the same
11/15/2012US20120286411 Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/15/2012US20120286410 Semiconductor device packaging method and semiconductor device package
11/15/2012US20120286409 Utilizing a jumper chip in packages with long bonding wires
11/15/2012US20120286408 Wafer level package with thermal pad for higher power dissipation
11/15/2012US20120286407 Semiconductor Device and Method of Forming Leadframe with Conductive Bodies for Vertical Electrical Interconnect of Semiconductor Die
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