Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/21/2012CN202549822U Mounting structure of power tube of motor driver
11/21/2012CN202549821U Heat radiator
11/21/2012CN202549820U CPU (Central Processing Unit) radiator
11/21/2012CN202549819U Large-power triode
11/21/2012CN202549818U Wafer back protection structure
11/21/2012CN202548743U Heat radiator for CPU (Central Processing Unit)
11/21/2012CN102792789A Module
11/21/2012CN102792512A Prismatic cell system with thermal management features
11/21/2012CN102792474A Miniature surface mount device with large pin pads
11/21/2012CN102792443A Surface mount spark gap
11/21/2012CN102792442A Heat insulation/heat dissipation sheet and intra-device structure
11/21/2012CN102792441A Heat dissipating structure and production method therefor
11/21/2012CN102792440A Method for manufacturing a semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
11/21/2012CN102792168A Mems传感器 Mems Sensor
11/21/2012CN102791819A Heat-resistant adhesive
11/21/2012CN102791796A Resin composition for sealing semiconductors, and semiconductor device using same
11/21/2012CN102791769A Wire wrap compositions and methods relating thereto
11/21/2012CN102791760A Curable resin composition and cured article thereof
11/21/2012CN102791451A Method for fabricating resin composition for sealing semiconductors, and pulverizer
11/21/2012CN102791106A Thermal module and method for controlling same
11/21/2012CN102791082A Component built-in module, and manufacturing method for component built-in module
11/21/2012CN102791075A Manufacture method of loader with three-dimensional inductance and structure of loader
11/21/2012CN102790055A Dram structure with buried word lines and fabrication thereof, and ic structure and fabrication thereof
11/21/2012CN102790051A Array substrate and preparation method and display device thereof
11/21/2012CN102790044A Ultrathin full-wave rectifier
11/21/2012CN102790042A Semiconductor chip stacking structure
11/21/2012CN102790041A Stacked semiconductor package
11/21/2012CN102790040A Semiconductor device having chip crack detection structure
11/21/2012CN102790039A Semiconductor chip and test method
11/21/2012CN102790038A Test key structure for monitoring gate conductor to deep trench misalignment and testing method thereof
11/21/2012CN102790037A SOT89-3L packaging lead frame
11/21/2012CN102790036A SOT89-5L encapsulation lead framework
11/21/2012CN102790035A Bump structure and process
11/21/2012CN102790034A Semiconductor apparatus with radiator
11/21/2012CN102790033A Package structure and manufacturing method thereof
11/21/2012CN102790032A Interconnection structure and forming method thereof
11/21/2012CN102790031A Semiconductor device
11/21/2012CN102790030A Semiconductor structure having offset passivation to reduce electromigration
11/21/2012CN102790029A Power semiconductor module and power semiconductor module system
11/21/2012CN102790028A Two-channel water-cooling structure of CPU (central processing unit) of computer
11/21/2012CN102790027A Multi-runner water-cooling device for computer CPU (central processing unit)
11/21/2012CN102790026A Two-channel water-cooling and air-cooling mixed structure of CPU (central processing unit) of computer
11/21/2012CN102790025A Multi-channel water-cooling structure of CPU (central processing unit) of computer
11/21/2012CN102790024A Multi-runner water-cooling and air-cooling mixed device structure for computer CPU (central processing unit)
11/21/2012CN102790023A Three-channel water-cooling and air-cooling mixed device of CPU (central processing unit) of computer
11/21/2012CN102790022A Radiator for semi-conductor refrigeration
11/21/2012CN102790021A Radiating unit and manufacture method thereof and radiating module
11/21/2012CN102790020A Liquid cooling device
11/21/2012CN102790019A Semiconductor device, manufacturing method thereof, and mobile telephone
11/21/2012CN102790018A Semiconductor package, core layer material, buildup layer material, and sealing resin composition
11/21/2012CN102790017A Semiconductor component and method of manufacturing a semiconductor component
11/21/2012CN102790016A Bump structure and producing process thereof
11/21/2012CN102790010A Preparation method of copper interconnected layer for improving reliability and semiconductor device
11/21/2012CN102789995A Method of manufacture procedures for manufacturing metal protrusion and fusion welded metal
11/21/2012CN102789994A Semiconductor device with infiltrated side surface
11/21/2012CN102789991A Package structure and manufacturing method thereof
11/21/2012CN102789966A Method for producing a metal layer on a substrate and device
11/21/2012CN102786908A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/21/2012CN102786905A Polyester adhesive and thin-film laminated body using the same
11/21/2012CN102786772A Epoxy resin composition for semiconductor packaging
11/21/2012CN102786665A Cure catalyst, composition, electronic device and associated method
11/21/2012CN102231396B Photovoltaic terminal box
11/21/2012CN102208375B Circulation radiator, and manufacturing method and components thereof
11/21/2012CN102208371B Aluminium nitride ceramic copper-clad substrate and preparation method thereof
11/21/2012CN102176432B Photodetector with digital three-dimensional package assembly
11/21/2012CN102157408B Through hole-interconnected wafer level MOSFET packaging structure and realization method
11/21/2012CN102142428B Ruthenium/wolfram hafnium nitride (Ru/WHfN) blocking layer against copper diffusion applied to copper interconnection and preparation method thereof
11/21/2012CN102130182B Current regulation diode chip and manufacturing method thereof
11/21/2012CN102110669B Composite dielectric layer and manufacturing method thereof
11/21/2012CN102097412B Embedded bit line structure, field effect transistor structure with the same and method of fabricating the same
11/21/2012CN102088011B Interface structure for copper-copper peeling integrity
11/21/2012CN102087975B Semiconductor device and manufacturing method thereof
11/21/2012CN102082136B Radiating device
11/21/2012CN102074559B SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof
11/21/2012CN102064140B Packaging structure and making process thereof
11/21/2012CN102054845B Radio frequency laterally diffused metal oxide semiconductor (LDMOS) device based on silicon on insulator (SOI) and method for injecting device
11/21/2012CN102054836B Thyristor for electrostatic discharge
11/21/2012CN101996998B Integrated circuit structure and memory array
11/21/2012CN101983425B Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board
11/21/2012CN101981692B Insulating substrate and method for producing the same
11/21/2012CN101971329B Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module
11/21/2012CN101965309B Micro fixture
11/21/2012CN101964334B Semiconductor package and semiconductor package module
11/21/2012CN101958292B Printed circuit board, encapsulation piece and manufacture methods thereof
11/21/2012CN101933411B Pre-heating system and method for silicon dies
11/21/2012CN101899288B 热界面材料及其制备方法 Thermal interface material and method
11/21/2012CN101889343B Hybrid microscale-nanoscale neuromorphic integrated circuit
11/21/2012CN101849445B Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
11/21/2012CN101847650B Organic light emitting display device
11/21/2012CN101847648B Active matrix organic light-emitting diode pixel structure and manufacturing method thereof
11/21/2012CN101847627B Semiconductor chip of integrated passive element and power amplifier element
11/21/2012CN101814511B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
11/21/2012CN101776254B Light emitting diode lamp and photo engine thereof
11/21/2012CN101752344B Contact plug electric fuse structure and method for manufacturing contact plug electric fuse device
11/21/2012CN101749979B Radiating fin, radiator and electronic device
11/21/2012CN101742889B Miniature liquid cooling device and micro-droplet generator adopted by same
11/21/2012CN101730446B Heat radiation device
11/21/2012CN101730445B Heat radiation device
11/21/2012CN101725946B Light-emitting diode lamp
11/21/2012CN101672432B Light-emitting diode (LED) lamp
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