Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/22/2012WO2012155272A1 Light emitting diodes and substrates
11/22/2012WO2012141908A8 Low temperature deposition of silicon oxide films
11/22/2012WO2012126955A4 Thermal interface based on a material having low thermal resistance and manufacturing process
11/22/2012WO2012116218A3 Semiconductor packages with agglomerate terminals
11/22/2012WO2012116157A3 Chip module embedded in pcb substrate
11/22/2012WO2012108944A3 Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
11/22/2012US20120295085 Polymide resin composition, adhesive agent and laminate each comprising same, and device
11/22/2012US20120293972 Integrated Voltage Regulator Method with Embedded Passive Device(s)
11/22/2012US20120293698 Semiconductor device, solid-state image sensor and camera system
11/22/2012US20120292789 Semiconductor wafer and method of producing the same
11/22/2012US20120292788 Chip stacking
11/22/2012US20120292787 Stacked semiconductor package
11/22/2012US20120292786 Integrated void fill for through silicon via
11/22/2012US20120292785 Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP
11/22/2012US20120292784 Semiconductor device
11/22/2012US20120292783 Protection layer for adhesive material at wafer edge
11/22/2012US20120292782 Microelectronic devices having conductive through via electrodes insulated by gap regions
11/22/2012US20120292781 Integrated circuit package
11/22/2012US20120292780 Package structure and manufacturing method thereof
11/22/2012US20120292779 Semiconductor structure having offset passivation to reduce electromigration
11/22/2012US20120292778 Embedded semiconductor power modules and packages
11/22/2012US20120292777 Backside Power Delivery Using Die Stacking
11/22/2012US20120292776 Pad layout structure of semiconductor chip
11/22/2012US20120292775 Mounting method and mounting device
11/22/2012US20120292774 Semiconductor device
11/22/2012US20120292773 Method for Producing a Metal Layer on a Substrate and Device
11/22/2012US20120292772 Shielded electronic components and method of manufacturing the same
11/22/2012US20120292771 Fabricating a contact rhodium structure by electroplating and electroplating composition
11/22/2012US20120292770 Method and device for preventing corrosion on sensors
11/22/2012US20120292769 Semiconductor element mounting member, method of producing the same, and semiconductor device
11/22/2012US20120292768 Via/contact and damascene structures
11/22/2012US20120292767 Novel Approach for Reducing Copper Line Resistivity
11/22/2012US20120292766 Semiconductor structure and manufacturing method of the same
11/22/2012US20120292765 Semiconductor device having wiring layer
11/22/2012US20120292764 Method of manufacturing semiconductor device
11/22/2012US20120292763 Electromigration immune through-substrate vias
11/22/2012US20120292762 Package structure and manufacturing method thereof
11/22/2012US20120292761 Bonding pad structure and integrated circuit comprising a plurality of bonding pad structures
11/22/2012US20120292760 Semiconductor device and method of manufacturing the same
11/22/2012US20120292759 Semiconductor device having chip crack detection structure
11/22/2012US20120292758 Semiconductor element and electronic apparatus
11/22/2012US20120292757 Semiconductor component and method of manufacturing a semiconductor component
11/22/2012US20120292756 Semiconductor device with heat spreader
11/22/2012US20120292755 Flank wettable semiconductor device
11/22/2012US20120292754 Common Drain Exposed Conductive Clip for High Power Semiconductor Packages
11/22/2012US20120292753 Multi-transistor exposed conductive clip for high power semiconductor packages
11/22/2012US20120292752 Thermally Enhanced Semiconductor Package with Exposed Parallel Conductive Clip
11/22/2012US20120292751 Semiconductor Device and Method of Forming Holes in Substrate to Interconnect Top Shield and Ground Shield
11/22/2012US20120292750 Integrated circuit package system with internal stacking module
11/22/2012US20120292749 Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die
11/22/2012US20120292747 Compound semiconductor substrate
11/22/2012US20120292746 Semiconductor devices including stress relief structures
11/22/2012US20120292744 Chip package, method for forming the same, and package wafer
11/22/2012US20120292741 Interconnect structures and design structures for a radiofrequency integrated circuit
11/22/2012US20120292666 Semiconductor device
11/22/2012US20120292009 Method and Apparatus for Joining Members for Downhole and High Temperature Applications
11/22/2012DE112011100421T5 Seibstausgerichtete Kontakte für Feldeffekttransistoreinheiten Seibstausgerichtete contacts for field effect transistor units
11/22/2012DE112010005011T5 Polymerblockgehäuse mit Durchkontakten Polymer block housing with vias
11/22/2012DE112010003715T5 Baugruppenbildung von elektronischen Bauelementen auf Waferebene Assemblies formation of electronic components at the wafer level
11/22/2012DE10339990B4 Verfahren zur Herstellung einer Metallleitung mit einer erhöhten Widerstandsfähigkeit gegen Elektromigration entlang einer Grenzfläche einer dielektrischen Barrierenschicht mittels Implantieren von Material in die Metalleitung A method of manufacturing a metal pipe with an increased resistance to electromigration along a boundary surface of a dielectric barrier layer by implanting material into the metal line
11/22/2012DE10323224B4 Verfahren zum Wiederherstellen von Kontaktflächen einer Elektrode Methods to Recover contact surfaces of an electrode
11/22/2012DE102012104304A1 Verfahren zur Herstellung einer Metallschicht auf einem Substrat und Bauelement A process for preparing a metal layer on a substrate and component
11/22/2012DE102012104270A1 Halbleiterkomponente und Verfahren zum Herstellen einer Halbleiterkomponente Semiconductor component and method of manufacturing a semiconductor component
11/22/2012DE102012103571A1 Halbleiterstruktur mit Passivierung durch Versatz zur Verringerung der Elektromigration Semiconductor structure with passivation by offset in order to reduce the electromigration
11/22/2012DE102011101645A1 Mischlichtquelle Mixed light source
11/22/2012DE102011075949A1 Cooling component comprises a base body and a cellular metallic foam body having greater wall thickness of a portion of the cellular walls arranged close to surfaces defining cells of metallic foam body, arranged on surface of the base body
11/22/2012DE102011075921A1 Leistungshalbleitermodul und Leistungshalbleitermodulsystem The power semiconductor module and power semiconductor module system
11/22/2012DE102011055767A1 Halbleitervorrichtung mit Bonding-Fläche und Verfahren zur Herstellung derselben A semiconductor device having bonding surface and method of making same
11/22/2012DE102011055736A1 Halbleitervorrichtung mit einer Bonding-Fläche und einer Abschirmungsstruktur und Verfahren zur Herstellung derselben A semiconductor device having a bonding surface and a shield structure and method of manufacturing the same
11/21/2012EP2525638A1 Substrate with integrated fins and method of manufacturing substrate with integrated fins
11/21/2012EP2525637A1 Liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated substrate
11/21/2012EP2525403A1 Waterfall wire bonding
11/21/2012EP2525402A1 Electrical insulation device with improved breakdown voltage
11/21/2012EP2525401A2 Common drain exposed conductive clip for high power semiconductor packages
11/21/2012EP2525400A1 High power semiconductor package including transistors interconnected through an exposed conductive clip
11/21/2012EP2525399A1 Crystal device without packaging and manufacturing method thereof
11/21/2012EP2525398A1 Silicon nitride substrate, circuit substrate and electronic device using same
11/21/2012EP2525397A1 Power semiconductor
11/21/2012EP2525394A1 Thermally enhanced semiconductor package with exposed conductive clip
11/21/2012EP2524402A2 Systems and methods for superconducting integrated circuits
11/21/2012EP2524394A2 Electronic device, method for producing the latter, and printed circuit board comprising electronic device
11/21/2012EP2524393A1 Power module production method, and power module produced thereby
11/21/2012EP2524392A1 Reclaiming usable integrated circuit chip area near through-silicon vias
11/21/2012DE202012010674U1 Bauelement Component part
11/21/2012DE202012010603U1 Kühlkörper Heat Sink
11/21/2012CN202551587U Cooling plate of automotive regulator
11/21/2012CN202549842U 半导体模块 Semiconductor Modules
11/21/2012CN202549841U 半导体模块 Semiconductor Modules
11/21/2012CN202549834U Silicon stack for industrial microwave equipment
11/21/2012CN202549833U Patch high voltage silicon rectifier tack
11/21/2012CN202549832U Cantilever-type stacked integrated circuit (IC) chip packaging piece based on barium titanate (BT) substrate
11/21/2012CN202549831U An electrostatic discharge protector and a system composed thereof
11/21/2012CN202549830U Semiconductor device
11/21/2012CN202549829U Pin-free package with four flat sides
11/21/2012CN202549828U Semiconductor package substrate
11/21/2012CN202549827U Lead frame
11/21/2012CN202549826U Lead frame in semiconductor
11/21/2012CN202549825U QFN package structure
11/21/2012CN202549824U Chip packaging structure
11/21/2012CN202549823U Cooling system inside thyristor valve
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