Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/28/2012CN102226991B Copper palladium alloy monocrystal bonding wire and manufacturing method thereof
11/28/2012CN102181026B Production method for electronic-grade phenolic resin
11/28/2012CN102121077B Gold bonding wire and preparation method thereof
11/28/2012CN102067336B Light-emitting device based on strain-adjustable InGaAlN film
11/28/2012CN102054813B Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof
11/28/2012CN102034795B Configuration structures of characteristic dimension bar
11/28/2012CN102026498B Method for manufacturing circuit board, circuit board and chip packaging structure
11/28/2012CN102024776B Flip-chip packaging assembly and integrated circuit device used for the same
11/28/2012CN101996974B Ball grid array printed circuit board and packaging structure and process thereof
11/28/2012CN101996969B Semiconductor device and on-vehicle AC generator
11/28/2012CN101963725B Gate lead and manufacturing method thereof
11/28/2012CN101953241B Heat exchanger
11/28/2012CN101937894B Semiconductor device including through-electrode and method of manufacturing the same
11/28/2012CN101937887B Wafer structure and water processing method
11/28/2012CN101919320B Method for producing wiring board and wiring board
11/28/2012CN101916715B In-situ dry clean chamber for front end of line fabrication
11/28/2012CN101894808B Electronic device and method of manufacturing the same
11/28/2012CN101887881B Interconnecting assembly, manufacture method and repairing method thereof
11/28/2012CN101859701B Substrate for semiconductor device, semiconductor device and manufacturing method thereof
11/28/2012CN101847589B Method for manufacturing a rigid power module suited for high-voltage applications
11/28/2012CN101826492B Chip-suspension-type packaging heat dissipation improved structure of semiconductor
11/28/2012CN101814461B Packaging substrate structure and chip packaging structure, as well as manufacturing method thereof
11/28/2012CN101803008B Semiconductor device and method for manufacturing the same
11/28/2012CN101794800B Solid-state imaging device and electronic device
11/28/2012CN101741075B Esd protection circuit and circuitry of ic applying the ESD protection circuit
11/28/2012CN101661892B Resin molded semiconductor device and manufacturing method thereof
11/28/2012CN101632166B Post-seed deposition process
11/28/2012CN101599498B 半导体器件 Semiconductor devices
11/28/2012CN101575440B Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/28/2012CN101552256B Semiconductor device capable of switching operation modes and operation mode setting method therefor
11/28/2012CN101547959B Sealing material for optical component and light-emitting device
11/28/2012CN101501820B Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor
11/28/2012CN101409282B Thin film transistor substrate, display device having the same and method of manufacturing the same
11/28/2012CN101361180B High frequency device module
11/27/2012US8319871 Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip
11/27/2012US8319586 Integrated circuit
11/27/2012US8319354 Semiconductor chip with post-passivation scheme formed over passivation layer
11/27/2012US8319353 Pre-formed conductive bumps on bonding pads
11/27/2012US8319352 Semiconductor device
11/27/2012US8319351 Planar multi semiconductor chip package
11/27/2012US8319349 Approach for bonding dies onto interposers
11/27/2012US8319348 Metal interconnect of semiconductor device
11/27/2012US8319347 Electronic device package and fabrication method thereof
11/27/2012US8319346 Semiconductor structure and manufacturing method of semiconductor structure
11/27/2012US8319345 Semiconductor packaging substrate and semiconductor device
11/27/2012US8319344 Electrical device with protruding contact elements and overhang regions over a cavity
11/27/2012US8319343 Routing under bond pad for the replacement of an interconnect layer
11/27/2012US8319342 Interconnect structures having permeable hard mask for sealing air gap contained by conductive structures
11/27/2012US8319341 Semiconductor device with gate structure
11/27/2012US8319340 Lead frame and method of manufacturing the same
11/27/2012US8319339 Surface-mounted silicon chip
11/27/2012US8319338 Thin stacked interposer package
11/27/2012US8319337 Conductive structure for a semiconductor integrated circuit and method for forming the same
11/27/2012US8319336 Reduction of etch microloading for through silicon vias
11/27/2012US8319335 Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly
11/27/2012US8319334 Embedded laminated device
11/27/2012US8319333 Power semiconductor module
11/27/2012US8319332 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
11/27/2012US8319331 Semiconductor device
11/27/2012US8319330 Semiconductor package having exterior plating films formed over surfaces of outer leads
11/27/2012US8319329 Stacked integrated circuit package having recessed sidewalls
11/27/2012US8319328 Method of manufacturing a semiconductor device
11/27/2012US8319327 Semiconductor package with stacked chips and method for manufacturing the same
11/27/2012US8319326 Stacked die with vertically-aligned conductors and methods for making the same
11/27/2012US8319325 Intra-die routing using back side redistribution layer and associated method
11/27/2012US8319324 High I/O semiconductor chip package and method of manufacturing the same
11/27/2012US8319323 Electronic package having down-set leads and method
11/27/2012US8319322 Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device
11/27/2012US8319321 Leadless package for high current devices
11/27/2012US8319320 LED module
11/27/2012US8319319 Semiconductor package and mounting method thereof
11/27/2012US8319318 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
11/27/2012US8319317 Mesa type semiconductor device and manufacturing method thereof
11/27/2012US8319286 System and method for input pin ESD protection with floating and/or biased polysilicon regions
11/27/2012US8319245 Lead frame, and light emitting diode module having the same
11/27/2012US8319230 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
11/27/2012US8318599 Resin layer formation method and semiconductor device fabrication method
11/27/2012US8318549 Molded semiconductor package having a filler material
11/27/2012US8318308 Single-walled carbon nanotube and aligned single-walled carbon nanotube bulk structure, and their production process, production apparatus and application use
11/27/2012US8318287 Integrated circuit package and method of making the same
11/27/2012CA2524608C Thermal management materials
11/27/2012CA2462130C Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring board
11/22/2012WO2012158436A1 Uv stable optical element and led lamp using same
11/22/2012WO2012158289A1 Heat sink for cooling power electronics
11/22/2012WO2012157688A1 Al ALLOY FILM FOR SEMICONDUCTOR DEVICES
11/22/2012WO2012157665A1 Semiconductor module component and liquid resin composition for encapsulation
11/22/2012WO2012157584A1 Semiconductor device and manufacturing method thereof
11/22/2012WO2012157583A1 Semiconductor device and manufacturing method thereof
11/22/2012WO2012157529A1 Epoxy resin molding material for encapsulation and electronic component device
11/22/2012WO2012157521A1 Heat-transfer device
11/22/2012WO2012157436A1 Ceramic electronic component and manufacturing method thereof
11/22/2012WO2012157373A1 Circuit substrate for large-capacity module periphery circuit, and large-capacity module including periphery circuit employing circuit substrate
11/22/2012WO2012157330A1 Sealing agent for optical semiconductor device, and optical semiconductor device
11/22/2012WO2012157326A1 Wiring structure and display device
11/22/2012WO2012157247A1 Cooler for use in semiconductor module
11/22/2012WO2012157167A1 Three-dimensional integrated circuit, processor, semiconductor chip, and method for manufacturing three-dimensional integrated circuit
11/22/2012WO2012156590A1 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
11/22/2012WO2012155962A1 Improved tie bar resonance suppression
11/22/2012WO2012155858A1 Chip stacking
11/22/2012WO2012155345A1 Waterfall wire bonding
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